JPH058745B2 - - Google Patents
Info
- Publication number
- JPH058745B2 JPH058745B2 JP26538484A JP26538484A JPH058745B2 JP H058745 B2 JPH058745 B2 JP H058745B2 JP 26538484 A JP26538484 A JP 26538484A JP 26538484 A JP26538484 A JP 26538484A JP H058745 B2 JPH058745 B2 JP H058745B2
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- paper
- copper
- silver
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 22
- 239000005011 phenolic resin Substances 0.000 claims description 22
- 229920001568 phenolic resin Polymers 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 description 23
- 239000004332 silver Substances 0.000 description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 21
- 239000000123 paper Substances 0.000 description 18
- 230000005012 migration Effects 0.000 description 13
- 238000013508 migration Methods 0.000 description 13
- 239000002966 varnish Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BDYUSDIJIDGWCY-UHFFFAOYSA-N NN-Dimethyllauramide Chemical compound CCCCCCCCCCCC(=O)N(C)C BDYUSDIJIDGWCY-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002383 tung oil Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- GAXDEROCNMZYCS-QXMHVHEDSA-N (z)-n,n-dimethyloctadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)N(C)C GAXDEROCNMZYCS-QXMHVHEDSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 fatty acid dimethylamides Chemical class 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010466 nut oil Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538484A JPS61143463A (ja) | 1984-12-18 | 1984-12-18 | 積層板用熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538484A JPS61143463A (ja) | 1984-12-18 | 1984-12-18 | 積層板用熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61143463A JPS61143463A (ja) | 1986-07-01 |
| JPH058745B2 true JPH058745B2 (enrdf_load_stackoverflow) | 1993-02-03 |
Family
ID=17416425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26538484A Granted JPS61143463A (ja) | 1984-12-18 | 1984-12-18 | 積層板用熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61143463A (enrdf_load_stackoverflow) |
-
1984
- 1984-12-18 JP JP26538484A patent/JPS61143463A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61143463A (ja) | 1986-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH058745B2 (enrdf_load_stackoverflow) | ||
| JP2604846B2 (ja) | 積層板の製造方法 | |
| JPH0471408B2 (enrdf_load_stackoverflow) | ||
| JPH01126360A (ja) | 積層板用熱硬化性樹脂組成物 | |
| JPS59166533A (ja) | 寸法安定性の良好な熱硬化性樹脂積層板 | |
| JP2641361B2 (ja) | 積層板の製造方法 | |
| JPH0680859A (ja) | フェノール樹脂組成物 | |
| JP3016931B2 (ja) | 積層板の製造方法 | |
| JP2642714B2 (ja) | 紙基材エポキシ樹脂積層板の製造方法 | |
| JPH09118730A (ja) | 積層板用フェノール樹脂組成物及び該フェノール樹脂組成物を用いたフェノール樹脂積層板 | |
| JPS61183325A (ja) | 積層板およびその製造方法 | |
| JPH04142338A (ja) | 積層板の製造方法 | |
| JPS63211400A (ja) | 積層板用紙基材 | |
| JPH04168043A (ja) | 熱硬化性樹脂積層板の製造法 | |
| JPH064707B2 (ja) | 紙基材−難燃性フェノール樹脂積層板の製造法 | |
| JPH0940845A (ja) | フェノール樹脂組成物、プリプレグ、及び電気用積層板 | |
| JPH04249539A (ja) | 積層板の製造方法 | |
| JPH0320137B2 (enrdf_load_stackoverflow) | ||
| JPH03140355A (ja) | 積層板用熱硬化性樹脂組成物 | |
| JPH05202268A (ja) | フェノール樹脂組成物 | |
| JPH01144428A (ja) | 紙基材−フェノール樹脂積層板の製造法 | |
| JPS6153330A (ja) | 積層板の製造法 | |
| JPH06234189A (ja) | 片面銅張積層板の製造方法 | |
| JPH04249543A (ja) | 積層板の製造方法 | |
| JPH0637541B2 (ja) | 積層用フェノール樹脂の製造方法 |