JPH0526760Y2 - - Google Patents

Info

Publication number
JPH0526760Y2
JPH0526760Y2 JP1987036375U JP3637587U JPH0526760Y2 JP H0526760 Y2 JPH0526760 Y2 JP H0526760Y2 JP 1987036375 U JP1987036375 U JP 1987036375U JP 3637587 U JP3637587 U JP 3637587U JP H0526760 Y2 JPH0526760 Y2 JP H0526760Y2
Authority
JP
Japan
Prior art keywords
island
chip
lead frame
resin
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987036375U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63142855U (sl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987036375U priority Critical patent/JPH0526760Y2/ja
Publication of JPS63142855U publication Critical patent/JPS63142855U/ja
Application granted granted Critical
Publication of JPH0526760Y2 publication Critical patent/JPH0526760Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987036375U 1987-03-11 1987-03-11 Expired - Lifetime JPH0526760Y2 (sl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987036375U JPH0526760Y2 (sl) 1987-03-11 1987-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987036375U JPH0526760Y2 (sl) 1987-03-11 1987-03-11

Publications (2)

Publication Number Publication Date
JPS63142855U JPS63142855U (sl) 1988-09-20
JPH0526760Y2 true JPH0526760Y2 (sl) 1993-07-07

Family

ID=30846719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987036375U Expired - Lifetime JPH0526760Y2 (sl) 1987-03-11 1987-03-11

Country Status (1)

Country Link
JP (1) JPH0526760Y2 (sl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2734443B2 (ja) * 1996-03-19 1998-03-30 日本電気株式会社 樹脂封止型半導体装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525584U (sl) * 1975-06-27 1977-01-14
JPS533011U (sl) * 1976-06-25 1978-01-12
JPS58440B2 (ja) * 1971-11-20 1983-01-06 フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ １７，２１−ジヒドロキシ−２０−ケトプレグナン類の製造方法
JPS5988854A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 半導体装置
JPS59116122A (ja) * 1982-12-01 1984-07-04 ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ ホウ酸の製法
JPS59134857A (ja) * 1983-01-21 1984-08-02 Toshiba Corp 半導体装置
JPS60195955A (ja) * 1984-03-19 1985-10-04 Hitachi Ltd 半導体装置
JPS6123348A (ja) * 1984-07-12 1986-01-31 Nec Corp 樹脂封止型半導体装置
JPS61185955A (ja) * 1985-02-13 1986-08-19 Toshiba Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58440U (ja) * 1981-06-25 1983-01-05 富士通株式会社 プラスチツクパツケ−ジ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58440B2 (ja) * 1971-11-20 1983-01-06 フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ １７，２１−ジヒドロキシ−２０−ケトプレグナン類の製造方法
JPS525584U (sl) * 1975-06-27 1977-01-14
JPS533011U (sl) * 1976-06-25 1978-01-12
JPS5988854A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 半導体装置
JPS59116122A (ja) * 1982-12-01 1984-07-04 ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ ホウ酸の製法
JPS59134857A (ja) * 1983-01-21 1984-08-02 Toshiba Corp 半導体装置
JPS60195955A (ja) * 1984-03-19 1985-10-04 Hitachi Ltd 半導体装置
JPS6123348A (ja) * 1984-07-12 1986-01-31 Nec Corp 樹脂封止型半導体装置
JPS61185955A (ja) * 1985-02-13 1986-08-19 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPS63142855U (sl) 1988-09-20

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