JPH0526760Y2 - - Google Patents
Info
- Publication number
- JPH0526760Y2 JPH0526760Y2 JP1987036375U JP3637587U JPH0526760Y2 JP H0526760 Y2 JPH0526760 Y2 JP H0526760Y2 JP 1987036375 U JP1987036375 U JP 1987036375U JP 3637587 U JP3637587 U JP 3637587U JP H0526760 Y2 JPH0526760 Y2 JP H0526760Y2
- Authority
- JP
- Japan
- Prior art keywords
- island
- chip
- lead frame
- resin
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000012778 molding material Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 7
- 239000009719 polyimide resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987036375U JPH0526760Y2 (US07534539-20090519-C00280.png) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987036375U JPH0526760Y2 (US07534539-20090519-C00280.png) | 1987-03-11 | 1987-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63142855U JPS63142855U (US07534539-20090519-C00280.png) | 1988-09-20 |
JPH0526760Y2 true JPH0526760Y2 (US07534539-20090519-C00280.png) | 1993-07-07 |
Family
ID=30846719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987036375U Expired - Lifetime JPH0526760Y2 (US07534539-20090519-C00280.png) | 1987-03-11 | 1987-03-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0526760Y2 (US07534539-20090519-C00280.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2734443B2 (ja) * | 1996-03-19 | 1998-03-30 | 日本電気株式会社 | 樹脂封止型半導体装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS525584U (US07534539-20090519-C00280.png) * | 1975-06-27 | 1977-01-14 | ||
JPS533011U (US07534539-20090519-C00280.png) * | 1976-06-25 | 1978-01-12 | ||
JPS58440B2 (ja) * | 1971-11-20 | 1983-01-06 | フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ | 17,21−ジヒドロキシ−20−ケトプレグナン類の製造方法 |
JPS5988854A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
JPS59116122A (ja) * | 1982-12-01 | 1984-07-04 | ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ | ホウ酸の製法 |
JPS59134857A (ja) * | 1983-01-21 | 1984-08-02 | Toshiba Corp | 半導体装置 |
JPS60195955A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | 半導体装置 |
JPS6123348A (ja) * | 1984-07-12 | 1986-01-31 | Nec Corp | 樹脂封止型半導体装置 |
JPS61185955A (ja) * | 1985-02-13 | 1986-08-19 | Toshiba Corp | 半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
-
1987
- 1987-03-11 JP JP1987036375U patent/JPH0526760Y2/ja not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58440B2 (ja) * | 1971-11-20 | 1983-01-06 | フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ | 17,21−ジヒドロキシ−20−ケトプレグナン類の製造方法 |
JPS525584U (US07534539-20090519-C00280.png) * | 1975-06-27 | 1977-01-14 | ||
JPS533011U (US07534539-20090519-C00280.png) * | 1976-06-25 | 1978-01-12 | ||
JPS5988854A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
JPS59116122A (ja) * | 1982-12-01 | 1984-07-04 | ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ | ホウ酸の製法 |
JPS59134857A (ja) * | 1983-01-21 | 1984-08-02 | Toshiba Corp | 半導体装置 |
JPS60195955A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | 半導体装置 |
JPS6123348A (ja) * | 1984-07-12 | 1986-01-31 | Nec Corp | 樹脂封止型半導体装置 |
JPS61185955A (ja) * | 1985-02-13 | 1986-08-19 | Toshiba Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS63142855U (US07534539-20090519-C00280.png) | 1988-09-20 |
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