JPH0453094B2 - - Google Patents

Info

Publication number
JPH0453094B2
JPH0453094B2 JP20655586A JP20655586A JPH0453094B2 JP H0453094 B2 JPH0453094 B2 JP H0453094B2 JP 20655586 A JP20655586 A JP 20655586A JP 20655586 A JP20655586 A JP 20655586A JP H0453094 B2 JPH0453094 B2 JP H0453094B2
Authority
JP
Japan
Prior art keywords
pattern
aiming
wire bonding
bonding apparatus
aiming mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20655586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362242A (ja
Inventor
Kazuyuki Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP61206555A priority Critical patent/JPS6362242A/ja
Priority to EP19870307230 priority patent/EP0262777B1/en
Priority to DE8787307230T priority patent/DE3785129T2/de
Priority to KR1019870009698A priority patent/KR900007688B1/ko
Priority to US07/092,369 priority patent/US4855928A/en
Publication of JPS6362242A publication Critical patent/JPS6362242A/ja
Publication of JPH0453094B2 publication Critical patent/JPH0453094B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10P72/0446—
    • H10W72/0711—
    • H10W72/07531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP61206555A 1986-09-02 1986-09-02 ワイヤボンディング装置 Granted JPS6362242A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP61206555A JPS6362242A (ja) 1986-09-02 1986-09-02 ワイヤボンディング装置
EP19870307230 EP0262777B1 (en) 1986-09-02 1987-08-14 Wire bonding device
DE8787307230T DE3785129T2 (de) 1986-09-02 1987-08-14 Drahtverbindungsvorrichtung.
KR1019870009698A KR900007688B1 (ko) 1986-09-02 1987-09-02 와이어본딩장치
US07/092,369 US4855928A (en) 1986-09-02 1987-09-02 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61206555A JPS6362242A (ja) 1986-09-02 1986-09-02 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS6362242A JPS6362242A (ja) 1988-03-18
JPH0453094B2 true JPH0453094B2 (enExample) 1992-08-25

Family

ID=16525330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61206555A Granted JPS6362242A (ja) 1986-09-02 1986-09-02 ワイヤボンディング装置

Country Status (5)

Country Link
US (1) US4855928A (enExample)
EP (1) EP0262777B1 (enExample)
JP (1) JPS6362242A (enExample)
KR (1) KR900007688B1 (enExample)
DE (1) DE3785129T2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708795C2 (de) * 1987-03-18 1995-08-03 Gsf Forschungszentrum Umwelt Verfahren zur Größenselektion in Videoechtzeit
EP0341944A3 (en) * 1988-05-10 1991-06-26 Gec Plessey Telecommunications Limited Improvements in or relating to methods of and apparatus for registration
US4972311A (en) * 1988-08-15 1990-11-20 Kulicke And Soffa Industries Inc. X-Y table error mapping apparatus and method
JP2534132B2 (ja) * 1989-05-15 1996-09-11 株式会社新川 ボンデイング方法
JPH039540A (ja) * 1989-06-07 1991-01-17 Shinkawa Ltd ワイヤボンデイング方法
JPH07111998B2 (ja) * 1989-08-18 1995-11-29 株式会社東芝 ワイヤボンディング検査装置
JP2668734B2 (ja) * 1989-10-23 1997-10-27 株式会社新川 ワイヤボンデイング方法
US5043589A (en) * 1990-05-18 1991-08-27 Trigon/Adcotech Semiconductor device inspection apparatus using a plurality of reflective elements
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
US5119436A (en) * 1990-09-24 1992-06-02 Kulicke And Soffa Industries, Inc Method of centering bond positions
JP2913565B2 (ja) * 1991-01-31 1999-06-28 株式会社新川 ワイヤループ曲がり検査方法及びその装置
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
JPH07144180A (ja) * 1992-08-21 1995-06-06 Supply Control:Kk 洗浄器
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
DE69311347T2 (de) * 1993-11-30 1997-09-18 Sgs Thomson Microelectronics Einrichtung für die elektrische Verbindung von integrierten Schaltungen
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US5702049A (en) * 1995-06-07 1997-12-30 West Bond Inc. Angled wire bonding tool and alignment method
US5951475A (en) * 1997-09-25 1999-09-14 International Business Machines Corporation Methods and apparatus for registering CT-scan data to multiple fluoroscopic images
US6299050B1 (en) 2000-02-24 2001-10-09 Hitachi, Ltd. Friction stir welding apparatus and method
US6381016B1 (en) * 2000-07-14 2002-04-30 Advanced Micro Devices, Inc. Lead width inspection system and methods
JP4547117B2 (ja) * 2001-09-25 2010-09-22 株式会社雄島試作研究所 位置決め機構の制御装置
EP1346793A1 (de) * 2002-03-19 2003-09-24 ESEC Trading S.A. Verfahren und Einrichtung für die Bestimmung der vektoriellen Distanz zwischen der Kapillare und dem Bilderkennungssystem eines Wire Bonders
TWI221648B (en) * 2002-03-19 2004-10-01 Esec Trading Sa Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
US12118726B2 (en) * 2021-01-15 2024-10-15 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070117A (en) * 1972-06-12 1978-01-24 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
JPS5080763A (enExample) * 1973-11-14 1975-07-01
US4163212A (en) * 1977-09-08 1979-07-31 Excellon Industries Pattern recognition system
US4233625A (en) * 1978-11-03 1980-11-11 Teledyne, Inc. Television monitoring system for automatically aligning semiconductor devices during manufacture
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
US4450579A (en) * 1980-06-10 1984-05-22 Fujitsu Limited Recognition method and apparatus
JPS57157378A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Setting method of binary-coded threshold level
JPS5951536A (ja) * 1982-09-14 1984-03-26 Fujitsu Ltd パタ−ン認識方法及びその装置
US4672557A (en) * 1983-03-26 1987-06-09 Disco Abrasive Systems, Ltd. Automatic accurate alignment system
JPS61102747A (ja) * 1984-10-26 1986-05-21 Marine Instr Co Ltd ワイヤ−ボンダ−の認識パタ−ン変更方法
JPS61190953A (ja) * 1985-02-20 1986-08-25 Hitachi Tokyo Electronics Co Ltd ワイヤボンダ
US4750836A (en) * 1986-09-18 1988-06-14 Rca Corporation Method of measuring misalignment between superimposed patterns

Also Published As

Publication number Publication date
JPS6362242A (ja) 1988-03-18
KR880004565A (ko) 1988-06-07
KR900007688B1 (ko) 1990-10-18
EP0262777A2 (en) 1988-04-06
DE3785129T2 (de) 1993-07-15
US4855928A (en) 1989-08-08
EP0262777A3 (en) 1989-08-23
EP0262777B1 (en) 1993-03-31
DE3785129D1 (de) 1993-05-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees