JPS5080763A - - Google Patents
Info
- Publication number
- JPS5080763A JPS5080763A JP48127304A JP12730473A JPS5080763A JP S5080763 A JPS5080763 A JP S5080763A JP 48127304 A JP48127304 A JP 48127304A JP 12730473 A JP12730473 A JP 12730473A JP S5080763 A JPS5080763 A JP S5080763A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10P72/0444—
-
- H10W72/07173—
-
- H10W72/075—
-
- H10W72/932—
Landscapes
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48127304A JPS5080763A (enExample) | 1973-11-14 | 1973-11-14 | |
| GB48035/74A GB1488717A (en) | 1973-11-14 | 1974-11-06 | Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame |
| DE19742454143 DE2454143A1 (de) | 1973-11-14 | 1974-11-14 | Vorrichtung zur befestigung von leitungsdraehten |
| US05/523,800 US3973713A (en) | 1973-11-14 | 1974-11-14 | Wire bonding system |
| HK68/79A HK6879A (en) | 1973-11-14 | 1979-02-08 | Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48127304A JPS5080763A (enExample) | 1973-11-14 | 1973-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5080763A true JPS5080763A (enExample) | 1975-07-01 |
Family
ID=14956627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48127304A Pending JPS5080763A (enExample) | 1973-11-14 | 1973-11-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3973713A (enExample) |
| JP (1) | JPS5080763A (enExample) |
| DE (1) | DE2454143A1 (enExample) |
| GB (1) | GB1488717A (enExample) |
| HK (1) | HK6879A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52116168A (en) * | 1976-03-26 | 1977-09-29 | Shinkawa Seisakusho Kk | Apparatus for wireebonding |
| JPS57113240A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Wire bonding apparatus |
| JPS57113239A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Ultrasonic wire bonding apparatus |
| US4492903A (en) * | 1977-05-23 | 1985-01-08 | Nu-Tech Industries, Inc. | Optimum efficiency brushless DC motor |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4054387A (en) * | 1975-12-22 | 1977-10-18 | Vickers Instruments, Inc. | Measuring with microscope |
| JPS5978538A (ja) * | 1982-10-27 | 1984-05-07 | Toshiba Corp | ダイボンダ装置 |
| US4674670A (en) * | 1984-08-13 | 1987-06-23 | Hitachi, Ltd. | Manufacturing apparatus |
| US4763827A (en) * | 1984-08-13 | 1988-08-16 | Hitachi, Ltd. | Manufacturing method |
| US4691854A (en) * | 1984-12-21 | 1987-09-08 | Texas Instruments Incorporated | Coatings for ceramic bonding capillaries |
| JPS6362242A (ja) * | 1986-09-02 | 1988-03-18 | Toshiba Corp | ワイヤボンディング装置 |
| IT1204967B (it) * | 1987-03-30 | 1989-03-10 | Mario Scavino | Dispositivo ad assi ortogonali,con motori lineari per il posizionamento e lavorazione di pezzi,in particolare per la microsaldatura di fili su composnenti elettronici |
| JP2668734B2 (ja) * | 1989-10-23 | 1997-10-27 | 株式会社新川 | ワイヤボンデイング方法 |
| US5459672A (en) * | 1990-07-30 | 1995-10-17 | Hughes Aircraft Company | Electrical interconnect integrity measuring method |
| SG11201604465VA (en) * | 2013-12-11 | 2016-07-28 | Fairchild Semiconductor | Integrated wire bonder and 3d measurement system with defect rejection |
| KR20250029440A (ko) * | 2023-08-23 | 2025-03-05 | 삼성전자주식회사 | 와이어 공급 모듈 및 이를 포함하는 와이어 본딩 장치 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3641660A (en) * | 1969-06-30 | 1972-02-15 | Texas Instruments Inc | The method of ball bonding with an automatic semiconductor bonding machine |
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1973
- 1973-11-14 JP JP48127304A patent/JPS5080763A/ja active Pending
-
1974
- 1974-11-06 GB GB48035/74A patent/GB1488717A/en not_active Expired
- 1974-11-14 DE DE19742454143 patent/DE2454143A1/de not_active Withdrawn
- 1974-11-14 US US05/523,800 patent/US3973713A/en not_active Expired - Lifetime
-
1979
- 1979-02-08 HK HK68/79A patent/HK6879A/xx unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52116168A (en) * | 1976-03-26 | 1977-09-29 | Shinkawa Seisakusho Kk | Apparatus for wireebonding |
| US4492903A (en) * | 1977-05-23 | 1985-01-08 | Nu-Tech Industries, Inc. | Optimum efficiency brushless DC motor |
| JPS57113240A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Wire bonding apparatus |
| JPS57113239A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Ultrasonic wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1488717A (en) | 1977-10-12 |
| HK6879A (en) | 1979-02-16 |
| DE2454143A1 (de) | 1975-06-19 |
| US3973713A (en) | 1976-08-10 |