HK6879A - Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame - Google Patents

Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame

Info

Publication number
HK6879A
HK6879A HK68/79A HK6879A HK6879A HK 6879 A HK6879 A HK 6879A HK 68/79 A HK68/79 A HK 68/79A HK 6879 A HK6879 A HK 6879A HK 6879 A HK6879 A HK 6879A
Authority
HK
Hong Kong
Prior art keywords
lead frame
bonding apparatus
connecting wires
semiconductor pellet
pellet
Prior art date
Application number
HK68/79A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK6879A publication Critical patent/HK6879A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
HK68/79A 1973-11-14 1979-02-08 Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame HK6879A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48127304A JPS5080763A (enExample) 1973-11-14 1973-11-14

Publications (1)

Publication Number Publication Date
HK6879A true HK6879A (en) 1979-02-16

Family

ID=14956627

Family Applications (1)

Application Number Title Priority Date Filing Date
HK68/79A HK6879A (en) 1973-11-14 1979-02-08 Bonding apparatus and method for connecting wires between a semiconductor pellet and a lead frame

Country Status (5)

Country Link
US (1) US3973713A (enExample)
JP (1) JPS5080763A (enExample)
DE (1) DE2454143A1 (enExample)
GB (1) GB1488717A (enExample)
HK (1) HK6879A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054387A (en) * 1975-12-22 1977-10-18 Vickers Instruments, Inc. Measuring with microscope
JPS52116168A (en) * 1976-03-26 1977-09-29 Shinkawa Seisakusho Kk Apparatus for wireebonding
US4492903A (en) * 1977-05-23 1985-01-08 Nu-Tech Industries, Inc. Optimum efficiency brushless DC motor
JPS57113239A (en) * 1981-01-05 1982-07-14 Shinkawa Ltd Ultrasonic wire bonding apparatus
JPS57113240A (en) * 1981-01-05 1982-07-14 Shinkawa Ltd Wire bonding apparatus
JPS5978538A (ja) * 1982-10-27 1984-05-07 Toshiba Corp ダイボンダ装置
US4763827A (en) * 1984-08-13 1988-08-16 Hitachi, Ltd. Manufacturing method
US4674670A (en) * 1984-08-13 1987-06-23 Hitachi, Ltd. Manufacturing apparatus
US4691854A (en) * 1984-12-21 1987-09-08 Texas Instruments Incorporated Coatings for ceramic bonding capillaries
JPS6362242A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンディング装置
IT1204967B (it) * 1987-03-30 1989-03-10 Mario Scavino Dispositivo ad assi ortogonali,con motori lineari per il posizionamento e lavorazione di pezzi,in particolare per la microsaldatura di fili su composnenti elettronici
JP2668734B2 (ja) * 1989-10-23 1997-10-27 株式会社新川 ワイヤボンデイング方法
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
CN105849881A (zh) * 2013-12-11 2016-08-10 飞兆半导体公司 集成的引线接合器和具有缺陷剔除的三维测量系统
KR20250029440A (ko) * 2023-08-23 2025-03-05 삼성전자주식회사 와이어 공급 모듈 및 이를 포함하는 와이어 본딩 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine

Also Published As

Publication number Publication date
GB1488717A (en) 1977-10-12
JPS5080763A (enExample) 1975-07-01
DE2454143A1 (de) 1975-06-19
US3973713A (en) 1976-08-10

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