DE3785129T2 - Drahtverbindungsvorrichtung. - Google Patents

Drahtverbindungsvorrichtung.

Info

Publication number
DE3785129T2
DE3785129T2 DE8787307230T DE3785129T DE3785129T2 DE 3785129 T2 DE3785129 T2 DE 3785129T2 DE 8787307230 T DE8787307230 T DE 8787307230T DE 3785129 T DE3785129 T DE 3785129T DE 3785129 T2 DE3785129 T2 DE 3785129T2
Authority
DE
Germany
Prior art keywords
reference character
pattern
wire
generating
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787307230T
Other languages
German (de)
English (en)
Other versions
DE3785129D1 (de
Inventor
Kazuyuki Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3785129D1 publication Critical patent/DE3785129D1/de
Publication of DE3785129T2 publication Critical patent/DE3785129T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10P72/0446—
    • H10W72/0711—
    • H10W72/07531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
DE8787307230T 1986-09-02 1987-08-14 Drahtverbindungsvorrichtung. Expired - Lifetime DE3785129T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61206555A JPS6362242A (ja) 1986-09-02 1986-09-02 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
DE3785129D1 DE3785129D1 (de) 1993-05-06
DE3785129T2 true DE3785129T2 (de) 1993-07-15

Family

ID=16525330

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787307230T Expired - Lifetime DE3785129T2 (de) 1986-09-02 1987-08-14 Drahtverbindungsvorrichtung.

Country Status (5)

Country Link
US (1) US4855928A (enExample)
EP (1) EP0262777B1 (enExample)
JP (1) JPS6362242A (enExample)
KR (1) KR900007688B1 (enExample)
DE (1) DE3785129T2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708795C2 (de) * 1987-03-18 1995-08-03 Gsf Forschungszentrum Umwelt Verfahren zur Größenselektion in Videoechtzeit
EP0341944A3 (en) * 1988-05-10 1991-06-26 Gec Plessey Telecommunications Limited Improvements in or relating to methods of and apparatus for registration
US4972311A (en) * 1988-08-15 1990-11-20 Kulicke And Soffa Industries Inc. X-Y table error mapping apparatus and method
JP2534132B2 (ja) * 1989-05-15 1996-09-11 株式会社新川 ボンデイング方法
JPH039540A (ja) * 1989-06-07 1991-01-17 Shinkawa Ltd ワイヤボンデイング方法
JPH07111998B2 (ja) * 1989-08-18 1995-11-29 株式会社東芝 ワイヤボンディング検査装置
JP2668734B2 (ja) * 1989-10-23 1997-10-27 株式会社新川 ワイヤボンデイング方法
US5043589A (en) * 1990-05-18 1991-08-27 Trigon/Adcotech Semiconductor device inspection apparatus using a plurality of reflective elements
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
US5119436A (en) * 1990-09-24 1992-06-02 Kulicke And Soffa Industries, Inc Method of centering bond positions
JP2913565B2 (ja) * 1991-01-31 1999-06-28 株式会社新川 ワイヤループ曲がり検査方法及びその装置
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
JPH07144180A (ja) * 1992-08-21 1995-06-06 Supply Control:Kk 洗浄器
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
DE69311347T2 (de) * 1993-11-30 1997-09-18 Sgs Thomson Microelectronics Einrichtung für die elektrische Verbindung von integrierten Schaltungen
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US5702049A (en) * 1995-06-07 1997-12-30 West Bond Inc. Angled wire bonding tool and alignment method
US5951475A (en) * 1997-09-25 1999-09-14 International Business Machines Corporation Methods and apparatus for registering CT-scan data to multiple fluoroscopic images
US6299050B1 (en) 2000-02-24 2001-10-09 Hitachi, Ltd. Friction stir welding apparatus and method
US6381016B1 (en) * 2000-07-14 2002-04-30 Advanced Micro Devices, Inc. Lead width inspection system and methods
JP4547117B2 (ja) * 2001-09-25 2010-09-22 株式会社雄島試作研究所 位置決め機構の制御装置
EP1346793A1 (de) * 2002-03-19 2003-09-24 ESEC Trading S.A. Verfahren und Einrichtung für die Bestimmung der vektoriellen Distanz zwischen der Kapillare und dem Bilderkennungssystem eines Wire Bonders
TWI221648B (en) * 2002-03-19 2004-10-01 Esec Trading Sa Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
US12118726B2 (en) * 2021-01-15 2024-10-15 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070117A (en) * 1972-06-12 1978-01-24 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
JPS5080763A (enExample) * 1973-11-14 1975-07-01
US4163212A (en) * 1977-09-08 1979-07-31 Excellon Industries Pattern recognition system
US4233625A (en) * 1978-11-03 1980-11-11 Teledyne, Inc. Television monitoring system for automatically aligning semiconductor devices during manufacture
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
US4450579A (en) * 1980-06-10 1984-05-22 Fujitsu Limited Recognition method and apparatus
JPS57157378A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Setting method of binary-coded threshold level
JPS5951536A (ja) * 1982-09-14 1984-03-26 Fujitsu Ltd パタ−ン認識方法及びその装置
US4672557A (en) * 1983-03-26 1987-06-09 Disco Abrasive Systems, Ltd. Automatic accurate alignment system
JPS61102747A (ja) * 1984-10-26 1986-05-21 Marine Instr Co Ltd ワイヤ−ボンダ−の認識パタ−ン変更方法
JPS61190953A (ja) * 1985-02-20 1986-08-25 Hitachi Tokyo Electronics Co Ltd ワイヤボンダ
US4750836A (en) * 1986-09-18 1988-06-14 Rca Corporation Method of measuring misalignment between superimposed patterns

Also Published As

Publication number Publication date
JPS6362242A (ja) 1988-03-18
JPH0453094B2 (enExample) 1992-08-25
KR880004565A (ko) 1988-06-07
KR900007688B1 (ko) 1990-10-18
EP0262777A2 (en) 1988-04-06
US4855928A (en) 1989-08-08
EP0262777A3 (en) 1989-08-23
EP0262777B1 (en) 1993-03-31
DE3785129D1 (de) 1993-05-06

Similar Documents

Publication Publication Date Title
DE3785129T2 (de) Drahtverbindungsvorrichtung.
DE19749781B4 (de) Musternähmaschine
DE69508414T2 (de) Markierungssystem für kleidungsstücke mit einer rechnergestützten ausrichtung von symmetrischen stoffmustern
DE69735902T2 (de) Verfahren zur herstellung eines werkstückes in einer biegepresse sowie biegepresse zur durchführung des verfahrens
DE3639554C2 (de) Verfahren zum Verarbeiten von Stichdaten mit einer automatischen Nähmaschine
DE19509884C2 (de) Verfahren zum Ausrichten von Zuschnittsegmenten
DE68927138T2 (de) Handhabungssteuerungsverfahren und -system
DE3688705T2 (de) Verfahren und vorrichtung zum automatischen zuschneiden von gemustertem textilmaterial.
EP2989872B1 (de) Platziervorrichtung und platzierverfahren
DE2803653C3 (de) Ausrichtvorrichtung
DE3338386C2 (de) Verfahren zur Konvergenzmessung bei einer Farbbildröhre und Vorrichtung zur Durchführung des Verfahrens
DE3519806A1 (de) Verfahren und vorrichtung zur anpassung der muster von zuschnitten vor dem schneiden aus bahnenfoermigem gemusterten material
DE69703350T2 (de) Siebdruckverfahren und siebdruckvorrichtung
DE3880065T2 (de) Automatische Montagevorrichtung für elektronische Bauteile.
DE3208435C2 (de) Steuerungsvorrichtung zum Führen eines Lichtbogenschweißautomaten
DE3789440T2 (de) Justierverfahren für den Ort einer Farbdichtemessung.
DE3871902T2 (de) Interaktives bildanzeigegeraet.
DE69032934T2 (de) Verfahren und Gerät zur semi-automatischen Bildablaufverfolgung
DE3103194A1 (de) Programmiersystem fuer eine automatische naehmaschine
DE1941057A1 (de) Einrichtung zur Lageeinstellung eines Gegenstandes relativ zu einem Bezugspunkt
DE2951943A1 (de) Verfahren zum erzielen der ausrichtung zwischen gegenstaenden
DE3342491A1 (de) Automatische vorrichtung zum herstellen oder pruefen von geraeten
DE102014006604A1 (de) Anschlusscrimpmaschine mit Anschlusszuführ-Ausrichtungshilfe
DE4210141C2 (de) Verfahren zum Erzeugen von Nähdaten
DE69418366T2 (de) Zufuhrmechanismus für Verbindergehäuse

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)