JPH0447447B2 - - Google Patents
Info
- Publication number
- JPH0447447B2 JPH0447447B2 JP63209060A JP20906088A JPH0447447B2 JP H0447447 B2 JPH0447447 B2 JP H0447447B2 JP 63209060 A JP63209060 A JP 63209060A JP 20906088 A JP20906088 A JP 20906088A JP H0447447 B2 JPH0447447 B2 JP H0447447B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- lead wire
- exterior frame
- groove
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 53
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 38
- 230000035882 stress Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63209060A JPH0258209A (ja) | 1988-08-23 | 1988-08-23 | チップ形コンデンサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63209060A JPH0258209A (ja) | 1988-08-23 | 1988-08-23 | チップ形コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0258209A JPH0258209A (ja) | 1990-02-27 |
JPH0447447B2 true JPH0447447B2 (ko) | 1992-08-04 |
Family
ID=16566591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63209060A Granted JPH0258209A (ja) | 1988-08-23 | 1988-08-23 | チップ形コンデンサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0258209A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07105304B2 (ja) * | 1990-07-31 | 1995-11-13 | 三洋電機株式会社 | 面実装電子部品 |
JP2527640B2 (ja) * | 1990-08-29 | 1996-08-28 | 三洋電機株式会社 | 面実装電子部品 |
DE202011000854U1 (de) * | 2011-04-12 | 2012-07-13 | Frolyt Kondensatoren Und Bauelemente Gmbh | Elektrolytkondensator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342513U (ko) * | 1986-09-08 | 1988-03-22 | ||
JPS6342512U (ko) * | 1986-09-04 | 1988-03-22 |
-
1988
- 1988-08-23 JP JP63209060A patent/JPH0258209A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342512U (ko) * | 1986-09-04 | 1988-03-22 | ||
JPS6342513U (ko) * | 1986-09-08 | 1988-03-22 |
Also Published As
Publication number | Publication date |
---|---|
JPH0258209A (ja) | 1990-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0447447B2 (ko) | ||
JPS60220922A (ja) | チツプ型コンデンサ | |
JP2627778B2 (ja) | チップ形コンデンサ | |
JP2691420B2 (ja) | チップ形コンデンサ | |
JP2832719B2 (ja) | チップ形コンデンサ | |
JP2894332B2 (ja) | チップ形コンデンサ | |
JP2640497B2 (ja) | チップ形コンデンサおよびその製造方法 | |
JP2691409B2 (ja) | チップ形コンデンサ | |
JP2841339B2 (ja) | チップ形コンデンサ | |
JP2838711B2 (ja) | チップ形コンデンサ | |
JPH0416416Y2 (ko) | ||
JPH0558644B2 (ko) | ||
JP3327294B2 (ja) | チップ形コンデンサの製造方法 | |
JP2653025B2 (ja) | チップ形コンデンサおよびその製造方法 | |
JP2564155B2 (ja) | チップ形コンデンサ | |
JPH0612747B2 (ja) | コンデンサ | |
JP2946669B2 (ja) | チップ形アルミ電解コンデンサ | |
JPH0416419Y2 (ko) | ||
JP2691412B2 (ja) | チップ形コンデンサ | |
JP2838705B2 (ja) | チップ形コンデンサ | |
JP2720390B2 (ja) | チップ形コンデンサ | |
JP3200844B2 (ja) | チップ形コンデンサ | |
JP2000269084A (ja) | チップ形コンデンサ | |
JP2741597B2 (ja) | チップ形コンデンサ | |
JP2727950B2 (ja) | チップ形電解コンデンサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080804 Year of fee payment: 16 |
|
LAPS | Cancellation because of no payment of annual fees |