JPH0416419Y2 - - Google Patents
Info
- Publication number
- JPH0416419Y2 JPH0416419Y2 JP18743087U JP18743087U JPH0416419Y2 JP H0416419 Y2 JPH0416419 Y2 JP H0416419Y2 JP 18743087 U JP18743087 U JP 18743087U JP 18743087 U JP18743087 U JP 18743087U JP H0416419 Y2 JPH0416419 Y2 JP H0416419Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- exterior frame
- printed circuit
- circuit board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 44
- 238000005476 soldering Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18743087U JPH0416419Y2 (ko) | 1987-12-09 | 1987-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18743087U JPH0416419Y2 (ko) | 1987-12-09 | 1987-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0192119U JPH0192119U (ko) | 1989-06-16 |
| JPH0416419Y2 true JPH0416419Y2 (ko) | 1992-04-13 |
Family
ID=31478585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18743087U Expired JPH0416419Y2 (ko) | 1987-12-09 | 1987-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416419Y2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105312B2 (ja) * | 1991-08-27 | 1995-11-13 | 神栄株式会社 | フィルムコンデンサ |
-
1987
- 1987-12-09 JP JP18743087U patent/JPH0416419Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0192119U (ko) | 1989-06-16 |
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