JPH0424855B2 - - Google Patents

Info

Publication number
JPH0424855B2
JPH0424855B2 JP63121704A JP12170488A JPH0424855B2 JP H0424855 B2 JPH0424855 B2 JP H0424855B2 JP 63121704 A JP63121704 A JP 63121704A JP 12170488 A JP12170488 A JP 12170488A JP H0424855 B2 JPH0424855 B2 JP H0424855B2
Authority
JP
Japan
Prior art keywords
chamber
foreign matter
semiconductor wafer
baking
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63121704A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64738A (en
JPH01738A (ja
Inventor
Haruo Amada
Hiroshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63-121704A priority Critical patent/JPH01738A/ja
Priority claimed from JP63-121704A external-priority patent/JPH01738A/ja
Publication of JPS64738A publication Critical patent/JPS64738A/ja
Publication of JPH01738A publication Critical patent/JPH01738A/ja
Publication of JPH0424855B2 publication Critical patent/JPH0424855B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP63-121704A 1988-05-20 半導体ウェーハの熱処理方法 Granted JPH01738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63-121704A JPH01738A (ja) 1988-05-20 半導体ウェーハの熱処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63-121704A JPH01738A (ja) 1988-05-20 半導体ウェーハの熱処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11019880A Division JPS5735319A (en) 1980-08-13 1980-08-13 Heat treatment device

Publications (3)

Publication Number Publication Date
JPS64738A JPS64738A (en) 1989-01-05
JPH01738A JPH01738A (ja) 1989-01-05
JPH0424855B2 true JPH0424855B2 (enExample) 1992-04-28

Family

ID=

Also Published As

Publication number Publication date
JPS64738A (en) 1989-01-05

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