JPS5735319A - Heat treatment device - Google Patents
Heat treatment deviceInfo
- Publication number
- JPS5735319A JPS5735319A JP11019880A JP11019880A JPS5735319A JP S5735319 A JPS5735319 A JP S5735319A JP 11019880 A JP11019880 A JP 11019880A JP 11019880 A JP11019880 A JP 11019880A JP S5735319 A JPS5735319 A JP S5735319A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- foreign matters
- wafer
- gas
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
PURPOSE:To improve production yield by preventing foreign matters from adhering to a wafer, by providing a treating chamber, for heat treatment of a wafer, with a gas circulating passage designed for allowing clean gas to pass downwards, and by keeping gas pressure in the treating chamber to positive pressure in comparison with atmospheric pressure. CONSTITUTION:An inert gas, sent into a circulating chamber 3 from a gas supply pipe 4, passes through filters 14 and 15, enters a baking chamber from a ventilating chamber 7, flows downwards by action of a mesh plate 5 carrying down foreign matters produced in a driving unit of a conveying step 16 and flows into a ventilating chamber 9 through a mesh plate 6, so that foreign matters in the baking chamber can be removed. On the other hand, a wafer 17 is made to pass through a conveying entrance 20 and conveyed into the baking chamber by the conveying step 16, where it is provided with heat treatment and conveyed out from an exit 22. At this time, positive pressure is maintained in the baking chamber by adjusting gas flow so that foreign matters contained in atmosphere can be prevented from entering at the time of conveying in and out of the wafer. it is possible, by doing so, to prevent the foreign matters from adhering to a coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11019880A JPS5735319A (en) | 1980-08-13 | 1980-08-13 | Heat treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11019880A JPS5735319A (en) | 1980-08-13 | 1980-08-13 | Heat treatment device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12170488A Division JPS64738A (en) | 1988-05-20 | 1988-05-20 | Heat treatment of semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5735319A true JPS5735319A (en) | 1982-02-25 |
JPH0313735B2 JPH0313735B2 (en) | 1991-02-25 |
Family
ID=14529528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11019880A Granted JPS5735319A (en) | 1980-08-13 | 1980-08-13 | Heat treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5735319A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120331A (en) * | 1984-07-09 | 1986-01-29 | Nec Corp | Device for baking resist |
JPS61164023U (en) * | 1985-03-28 | 1986-10-11 | ||
JPS6453421A (en) * | 1987-08-24 | 1989-03-01 | Mitsubishi Electric Corp | Resist coating device |
JPH01225119A (en) * | 1988-03-03 | 1989-09-08 | Nec Corp | Hot plate type baking device |
JP2009099861A (en) * | 2007-10-18 | 2009-05-07 | Fenwall Controls Of Japan Ltd | Semiconductor processing unit and semiconductor manufacturing apparatus |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4895638A (en) * | 1972-03-21 | 1973-12-07 | ||
JPS51124839A (en) * | 1975-04-25 | 1976-10-30 | Hitachi Ltd | Infrared ray baking furnace |
JPS51132772A (en) * | 1975-05-14 | 1976-11-18 | Hitachi Ltd | Baking apparatus |
JPS5422377U (en) * | 1977-07-18 | 1979-02-14 | ||
JPS54158445A (en) * | 1978-06-05 | 1979-12-14 | Mitsubishi Electric Corp | Sintering of photosensitive resin |
JPS5595332A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Dust removing system for conveyor |
-
1980
- 1980-08-13 JP JP11019880A patent/JPS5735319A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4895638A (en) * | 1972-03-21 | 1973-12-07 | ||
JPS51124839A (en) * | 1975-04-25 | 1976-10-30 | Hitachi Ltd | Infrared ray baking furnace |
JPS51132772A (en) * | 1975-05-14 | 1976-11-18 | Hitachi Ltd | Baking apparatus |
JPS5422377U (en) * | 1977-07-18 | 1979-02-14 | ||
JPS54158445A (en) * | 1978-06-05 | 1979-12-14 | Mitsubishi Electric Corp | Sintering of photosensitive resin |
JPS5595332A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Dust removing system for conveyor |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120331A (en) * | 1984-07-09 | 1986-01-29 | Nec Corp | Device for baking resist |
JPH0254656B2 (en) * | 1984-07-09 | 1990-11-22 | Nippon Electric Co | |
JPS61164023U (en) * | 1985-03-28 | 1986-10-11 | ||
JPH0238438Y2 (en) * | 1985-03-28 | 1990-10-17 | ||
JPS6453421A (en) * | 1987-08-24 | 1989-03-01 | Mitsubishi Electric Corp | Resist coating device |
JPH061758B2 (en) * | 1987-08-24 | 1994-01-05 | 三菱電機株式会社 | Resist coating device |
JPH01225119A (en) * | 1988-03-03 | 1989-09-08 | Nec Corp | Hot plate type baking device |
JP2009099861A (en) * | 2007-10-18 | 2009-05-07 | Fenwall Controls Of Japan Ltd | Semiconductor processing unit and semiconductor manufacturing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0313735B2 (en) | 1991-02-25 |
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