JPH0424855B2 - - Google Patents

Info

Publication number
JPH0424855B2
JPH0424855B2 JP63121704A JP12170488A JPH0424855B2 JP H0424855 B2 JPH0424855 B2 JP H0424855B2 JP 63121704 A JP63121704 A JP 63121704A JP 12170488 A JP12170488 A JP 12170488A JP H0424855 B2 JPH0424855 B2 JP H0424855B2
Authority
JP
Japan
Prior art keywords
chamber
foreign matter
semiconductor wafer
baking
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63121704A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01738A (ja
JPS64738A (en
Inventor
Haruo Amada
Hiroshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12170488A priority Critical patent/JPS64738A/ja
Publication of JPH01738A publication Critical patent/JPH01738A/ja
Publication of JPS64738A publication Critical patent/JPS64738A/ja
Publication of JPH0424855B2 publication Critical patent/JPH0424855B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP12170488A 1988-05-20 1988-05-20 Heat treatment of semiconductor wafer Granted JPS64738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12170488A JPS64738A (en) 1988-05-20 1988-05-20 Heat treatment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12170488A JPS64738A (en) 1988-05-20 1988-05-20 Heat treatment of semiconductor wafer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11019880A Division JPS5735319A (en) 1980-08-13 1980-08-13 Heat treatment device

Publications (3)

Publication Number Publication Date
JPH01738A JPH01738A (ja) 1989-01-05
JPS64738A JPS64738A (en) 1989-01-05
JPH0424855B2 true JPH0424855B2 (enrdf_load_stackoverflow) 1992-04-28

Family

ID=14817815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12170488A Granted JPS64738A (en) 1988-05-20 1988-05-20 Heat treatment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS64738A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672538B2 (ja) * 2005-12-06 2011-04-20 東京エレクトロン株式会社 加熱処理装置
WO2012141081A1 (ja) * 2011-04-14 2012-10-18 シャープ株式会社 表示パネル用基板の製造装置
DE102012017230A1 (de) * 2012-08-31 2014-03-06 Oerlikon Trading Ag, Trübbach Anlage zur Strahlungsbehandlung von Substraten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895638A (enrdf_load_stackoverflow) * 1972-03-21 1973-12-07
JPS5148969U (enrdf_load_stackoverflow) * 1974-10-11 1976-04-13
JPS51124839A (en) * 1975-04-25 1976-10-30 Hitachi Ltd Infrared ray baking furnace
JPS5549183Y2 (enrdf_load_stackoverflow) * 1975-07-25 1980-11-17
JPS5925372B2 (ja) * 1976-02-27 1984-06-16 株式会社日立製作所 ベ−キング装置
JPS5320867A (en) * 1976-08-11 1978-02-25 Hitachi Ltd Housing and conveying machine of articles
JPS5427770A (en) * 1977-08-04 1979-03-02 Takasago Thermal Engineering Constant temperature clean bench
JPS54158445A (en) * 1978-06-05 1979-12-14 Mitsubishi Electric Corp Sintering of photosensitive resin
JPS5595332A (en) * 1979-01-12 1980-07-19 Toshiba Corp Dust removing system for conveyor

Also Published As

Publication number Publication date
JPS64738A (en) 1989-01-05

Similar Documents

Publication Publication Date Title
US5261167A (en) Vertical heat treating apparatus
EP0810633A2 (en) Coating film forming method and apparatus
JP4542577B2 (ja) 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2881371B2 (ja) 真空処理装置及び真空処理装置集合体のクリーニング方法
JP3556882B2 (ja) 塗布現像処理システム
JP4813583B2 (ja) 基板処理装置
JP2008160011A (ja) 基板処理装置
JPH1074820A (ja) 被処理基板の搬送方法及び処理システム
JPH0313735B2 (enrdf_load_stackoverflow)
JPH0424855B2 (enrdf_load_stackoverflow)
JP3402713B2 (ja) 熱処理装置
JPH01738A (ja) 半導体ウェーハの熱処理方法
JP3112446B2 (ja) 処理装置
JP3959141B2 (ja) 昇華物対策付き熱処理装置
JP2008159768A (ja) ベーキング装置及び基板処理装置
JPH0794487A (ja) 処理装置及びそのクリーニング方法
JP4954642B2 (ja) 現像処理装置及び現像処理方法
JPH05166789A (ja) 基板の洗浄乾燥装置
JP2929260B2 (ja) 塗布膜形成方法及びその装置
JP2000208053A (ja) プラズマディスプレイパネル用焼成炉
JPS59208836A (ja) 半導体製造装置
JP4620536B2 (ja) 基板処理装置
JP3456925B2 (ja) 基板処理装置
JP2005270932A (ja) 塗布膜形成装置
JPH11145022A (ja) 半導体製造設備