JPH04130438U - 実装基板 - Google Patents

実装基板

Info

Publication number
JPH04130438U
JPH04130438U JP1991035603U JP3560391U JPH04130438U JP H04130438 U JPH04130438 U JP H04130438U JP 1991035603 U JP1991035603 U JP 1991035603U JP 3560391 U JP3560391 U JP 3560391U JP H04130438 U JPH04130438 U JP H04130438U
Authority
JP
Japan
Prior art keywords
pattern
conductor pattern
mounting board
solder resist
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1991035603U
Other languages
English (en)
Other versions
JP2538112Y2 (ja
Inventor
直之 田島
孝明 津田
Original Assignee
シヤープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シヤープ株式会社 filed Critical シヤープ株式会社
Priority to JP1991035603U priority Critical patent/JP2538112Y2/ja
Priority to TW081102924A priority patent/TW282521B/zh
Priority to US07/868,561 priority patent/US5398128A/en
Publication of JPH04130438U publication Critical patent/JPH04130438U/ja
Application granted granted Critical
Publication of JP2538112Y2 publication Critical patent/JP2538112Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Abstract

(57)【要約】 （修正有） 【構成】 断線しやすい導体パターン２部分を柔軟なソ
ルダーレジスト４等の樹脂で被覆することで、機械強度
を向上させたことを特徴とする。 【効果】 本考案によれば、折り曲げた際にも樹脂でパ
ターンを保護しているので、パターン断線を防止するこ
とができる。

Description

【考案の詳細な説明】
【０００１】
【産業上の利用分野】
本考案は、液晶パネル等、基板を折り曲げて使用するようなモジュールに実装 されるテープキャリアパッケージ、フレキシブルプリント基板、硬質プリント基 板等の実装基板に関するものである。
【０００２】
【従来の技術】
従来は導体パターンの機械強度を向上させたり、折り曲げの角度、条件を工夫 して対応していた。
【０００３】
【考案が解決しようとする課題】
上記従来技術は以下の様な問題点があり、これらの解決が望まれている。
【０００４】 （Ａ）実装密度等の制約によりパターン幅が細くなった場合、オーバーハング部 分のパターンの機械強度が弱くなり、断線し易くなる。
【０００５】 （Ｂ）パターンにダメージを与えない様にするための、実装工程上の制約が多く 、作業性が悪い。
【０００６】
【課題を解決するための手段】
本考案は、断線し易い導体パターン部分を柔軟なソルダーレジスト等の樹脂で 被覆することで、機械強度を向上させたことを特徴とする。
【０００７】
【作用】
本考案によれば、折り曲げた際にも樹脂でパターンを保護しているので、パタ ーン断線を防止することができる。また、柔軟なソルダーレジストを保護用樹脂 として使用すれば、製造上も工程の増加はなく、コスト的にも通常品と同等にす ることができる。
【０００８】
【実施例】
以下、実施例に基づいて本考案を詳細に説明する。
【０００９】 図１に示すように、液晶ドライバーとして折り曲げて使用されるテープキャリ アパッケージに於いて本考案を実施する場合、例えば、耐熱性、絶縁性をもち、 充分に柔軟なソルダーレジストを、折り曲げた部分の導体パターンの上にも被覆 する。同図に於いて、１はポリイミド等のベースフィルム、２は導体パターン、 ３は半導体チップ、４はソルダーレジスト、５は封止樹脂である。
【００１０】
【考案の効果】
以上詳細に説明したように、本考案によれば、折り曲げた際にも樹脂でパター ンを保護しているので、パターン断線を防止することができる。
【図面の簡単な説明】
【図１】本考案の一実施例の構成図である。
【符号の説明】
１ ベースフィルム ２ 導体パターン ３ 半導体チップ ４ ソルダーレジスト ５ 封止樹脂

Claims (1)

    【実用新案登録請求の範囲】
  1. 【請求項１】 基板に穴があき、その上に導体パターン
    がオーバーハングしており、更に、その導体パターンの
    オーバーハング部分が柔軟な樹脂で被覆されてなること
    を特徴とする実装基板。
JP1991035603U 1991-05-21 1991-05-21 実装基板 Expired - Lifetime JP2538112Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1991035603U JP2538112Y2 (ja) 1991-05-21 1991-05-21 実装基板
TW081102924A TW282521B (ja) 1991-05-21 1992-04-14
US07/868,561 US5398128A (en) 1991-05-21 1992-04-15 Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991035603U JP2538112Y2 (ja) 1991-05-21 1991-05-21 実装基板

Publications (2)

Publication Number Publication Date
JPH04130438U true JPH04130438U (ja) 1992-11-30
JP2538112Y2 JP2538112Y2 (ja) 1997-06-11

Family

ID=12446405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991035603U Expired - Lifetime JP2538112Y2 (ja) 1991-05-21 1991-05-21 実装基板

Country Status (3)

Country Link
US (1) US5398128A (ja)
JP (1) JP2538112Y2 (ja)
TW (1) TW282521B (ja)

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TW344043B (en) * 1994-10-21 1998-11-01 Hitachi Ltd Liquid crystal display device with reduced frame portion surrounding display area
JPH08186336A (ja) * 1994-12-28 1996-07-16 Mitsubishi Electric Corp 回路基板、駆動回路モジュール及びそれを用いた液晶表示装置並びにそれらの製造方法
EP0778959A1 (en) * 1995-06-29 1997-06-18 Koninklijke Philips Electronics N.V. Display device
TW453449U (en) * 1995-11-16 2001-09-01 Hitachi Ltd LCD display panel with buckling driving multi-layer bendable PCB
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
TW565728B (en) * 1997-10-15 2003-12-11 Sharp Kk Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof
US6498636B1 (en) * 1999-03-30 2002-12-24 National Semiconductor Corporation Apparatus and method for substantially stress-free electrical connection to a liquid crystal display
JP3645770B2 (ja) * 2000-01-28 2005-05-11 株式会社日立製作所 液晶表示装置
KR100381046B1 (ko) * 2000-03-31 2003-04-18 엘지.필립스 엘시디 주식회사 더미부를 가지는 테이프 캐리어 패키지와 이를 이용한 액정표시장치
WO2002101449A1 (fr) * 2001-06-08 2002-12-19 Nanox Corporation Affichage a cristaux liquides et son procede de fabrication
US7563990B2 (en) * 2002-08-05 2009-07-21 Koninklijke Philips Electronics N.V. Electronic product, a body and a method of manufacturing
DE10243637B4 (de) * 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten
KR100699823B1 (ko) * 2003-08-05 2007-03-27 삼성전자주식회사 저가형 플랙서블 필름 패키지 모듈 및 그 제조방법
CN100363790C (zh) * 2004-12-01 2008-01-23 鸿富锦精密工业（深圳）有限公司 液晶显示器及其采用的软性电路板
JP4581726B2 (ja) * 2004-12-28 2010-11-17 ソニー株式会社 表示装置および携帯機器
US7572183B2 (en) * 2005-08-30 2009-08-11 Igt Gaming machine including redo feature
US7767543B2 (en) * 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
KR101431154B1 (ko) * 2007-11-08 2014-08-18 삼성디스플레이 주식회사 표시 장치 및 이의 조립 방법
US8197335B2 (en) * 2008-11-14 2012-06-12 Igt Gaming system, gaming device, and method for enabling a current bet to be placed on a future play of a wagering game
KR101346083B1 (ko) * 2012-04-26 2013-12-31 엘지디스플레이 주식회사 디스플레이 장치
KR101307960B1 (ko) * 2012-04-26 2013-09-12 엘지디스플레이 주식회사 디스플레이 장치
KR101995981B1 (ko) * 2012-11-05 2019-07-04 삼성디스플레이 주식회사 표시 장치
WO2014088974A1 (en) 2012-12-03 2014-06-12 Flextronics Ap, Llc Driving board folding machine
US9338915B1 (en) * 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US9560746B1 (en) 2014-01-24 2017-01-31 Multek Technologies, Ltd. Stress relief for rigid components on flexible circuits
US9195358B1 (en) * 2014-04-16 2015-11-24 Eastman Kodak Company Z-fold multi-element substrate structure
US9549463B1 (en) 2014-05-16 2017-01-17 Multek Technologies, Ltd. Rigid to flexible PC transition
KR102251231B1 (ko) 2014-09-16 2021-05-12 엘지디스플레이 주식회사 구동 칩 패키지 및 이를 포함하는 표시장치
CN104486902B (zh) * 2014-11-27 2018-01-16 深圳市华星光电技术有限公司 弯折型印刷电路板
CN204884440U (zh) * 2015-08-27 2015-12-16 京东方科技集团股份有限公司 柔性显示面板和柔性显示装置
TWI646637B (zh) * 2018-02-13 2019-01-01 頎邦科技股份有限公司 薄膜覆晶封裝結構及其可撓性基板
CN109148380B (zh) * 2018-08-21 2021-02-02 武汉华星光电半导体显示技术有限公司 显示面板、显示模组以及电子装置

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JPH02185051A (ja) * 1989-01-12 1990-07-19 Hitachi Cable Ltd 両面保護コート型ｔａｂ用テープキャリア
JPH03297192A (ja) * 1990-04-17 1991-12-27 Mitsubishi Cable Ind Ltd 回路基板及びその製造方法

Also Published As

Publication number Publication date
JP2538112Y2 (ja) 1997-06-11
TW282521B (ja) 1996-08-01
US5398128A (en) 1995-03-14

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