JPH0328996B2 - - Google Patents

Info

Publication number
JPH0328996B2
JPH0328996B2 JP61073157A JP7315786A JPH0328996B2 JP H0328996 B2 JPH0328996 B2 JP H0328996B2 JP 61073157 A JP61073157 A JP 61073157A JP 7315786 A JP7315786 A JP 7315786A JP H0328996 B2 JPH0328996 B2 JP H0328996B2
Authority
JP
Japan
Prior art keywords
solder
alloy
added
solderability
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61073157A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62230493A (ja
Inventor
Masao Masuzawa
Takuji Niihori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TARUCHIN KK
Original Assignee
TARUCHIN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TARUCHIN KK filed Critical TARUCHIN KK
Priority to JP7315786A priority Critical patent/JPS62230493A/ja
Publication of JPS62230493A publication Critical patent/JPS62230493A/ja
Publication of JPH0328996B2 publication Critical patent/JPH0328996B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP7315786A 1986-03-31 1986-03-31 はんだ合金 Granted JPS62230493A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7315786A JPS62230493A (ja) 1986-03-31 1986-03-31 はんだ合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7315786A JPS62230493A (ja) 1986-03-31 1986-03-31 はんだ合金

Publications (2)

Publication Number Publication Date
JPS62230493A JPS62230493A (ja) 1987-10-09
JPH0328996B2 true JPH0328996B2 (https=) 1991-04-22

Family

ID=13510059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7315786A Granted JPS62230493A (ja) 1986-03-31 1986-03-31 はんだ合金

Country Status (1)

Country Link
JP (1) JPS62230493A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994020257A1 (fr) * 1993-03-03 1994-09-15 Nihon Almit Co., Ltd. Alliage de soudage a haute resistance
JP2021171812A (ja) * 2020-04-30 2021-11-01 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543941B2 (ja) * 1988-03-17 1996-10-16 大豊工業株式会社 はんだ材
JP2584842B2 (ja) * 1988-09-13 1997-02-26 富士通株式会社 鉛系高融点はんだ合金
JPH02187295A (ja) * 1989-01-17 1990-07-23 Nippon Arumitsuto Kk 高強度はんだ合金
JP2543985B2 (ja) * 1989-06-28 1996-10-16 トヨタ自動車株式会社 はんだ材
US6649127B2 (en) 1996-12-17 2003-11-18 Sony Chemicals Corp Lead-free solder material having good wettability
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
CN1069566C (zh) * 1997-04-29 2001-08-15 北京有色金属研究总院 低温铝焊料及其制造方法
JP3296289B2 (ja) * 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JP3760586B2 (ja) * 1997-09-05 2006-03-29 株式会社村田製作所 半田組成物
ES2224609T3 (es) * 1998-03-26 2005-03-01 Nihon Superior Sha Co., Ltd Aleacion de soldadura exenta de plomo.
US6197253B1 (en) * 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
DE10011174A1 (de) 1999-03-09 2000-10-05 Matsushita Electric Industrial Co Ltd Wechselwirkungsfreies Schaltungsgerät, Verfahren zu dessen Herstellung, und dieses einsetzende Mobilkommunikationseinrichtung
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
KR100421634B1 (ko) * 2001-03-31 2004-03-10 주식회사 듀텍 무연솔더볼 합금조성물
JP4635715B2 (ja) * 2005-05-20 2011-02-23 富士電機システムズ株式会社 はんだ合金およびそれを用いた半導体装置
JP2008221330A (ja) * 2007-03-16 2008-09-25 Fuji Electric Holdings Co Ltd はんだ合金
JP4957581B2 (ja) * 2007-05-29 2012-06-20 日本軽金属株式会社 中空形材の接合方法および接合構造
JP6234488B2 (ja) * 2016-02-05 2017-11-22 株式会社リソー技研 無鉛はんだ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820718B2 (ja) * 1981-01-30 1983-04-25 住友金属鉱山株式会社 フエライト接着用ろう合金

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994020257A1 (fr) * 1993-03-03 1994-09-15 Nihon Almit Co., Ltd. Alliage de soudage a haute resistance
JP2021171812A (ja) * 2020-04-30 2021-11-01 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
WO2021221145A1 (ja) * 2020-04-30 2021-11-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
CN115485098A (zh) * 2020-04-30 2022-12-16 千住金属工业株式会社 无铅且无锑的软钎料合金、焊料球、球栅阵列和钎焊接头
CN115485098B (zh) * 2020-04-30 2023-10-03 千住金属工业株式会社 无铅且无锑的软钎料合金、焊料球、球栅阵列和钎焊接头
US12447565B2 (en) 2020-04-30 2025-10-21 Senju Metal Industry Co., Ltd. Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint

Also Published As

Publication number Publication date
JPS62230493A (ja) 1987-10-09

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