WO2004018145A1 - 錫−亜鉛系鉛フリーはんだ合金、その混合物及びはんだ接合部 - Google Patents
錫−亜鉛系鉛フリーはんだ合金、その混合物及びはんだ接合部 Download PDFInfo
- Publication number
- WO2004018145A1 WO2004018145A1 PCT/JP2002/011990 JP0211990W WO2004018145A1 WO 2004018145 A1 WO2004018145 A1 WO 2004018145A1 JP 0211990 W JP0211990 W JP 0211990W WO 2004018145 A1 WO2004018145 A1 WO 2004018145A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- tin
- zinc
- magnesium
- mixture
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
Definitions
- the present invention relates to an environment-friendly tin-zinc-based lead-free solder alloy, a mixture thereof, and a solder joint, among various solder materials.
- tin-lead solder alloys have often been used for soldering various devices because of their advantages such as low melting point and good wettability even in oxidizing atmospheres.
- lead is toxic
- lead-free soldering has been rapidly advancing from the viewpoint of preventing environmental pollution due to disposal of electronic equipment.
- lead-free solder alloys are inferior to conventional tin-lead solder alloys in terms of wettability, melting point, cost, etc., and have not yet been developed as a complete substitute. is there.
- tin-zinc solder alloy containing about 9% by weight of zinc (eutectic point composition) has been proposed as a lead-free solder material that is expected to be put into practical use for reflow soldering. Further, a tin-zinc solder alloy containing about 8% by weight of zinc and 1 to 3% by weight of bismuth has been proposed. These tin-zinc alloys have a eutectic temperature of 199 ° C, which is the highest eutectic point of the tin-lead alloy among tin-based lead-free solder alloys.
- the cream solder used for the reflow soldering is a mixture of a solder powder and a flux.
- Activator to add water Therefore, the wettability is lower than that of the conventional tin-lead solder alloy.
- the activator In the case of tin-zinc based solder alloys, which are inferior, the activator must be strengthened in order to improve the wettability of the solder.
- a phase containing zinc as a main component exists on the surface and inside of the manufactured solder powder.
- solder alloys there are tin-zinc-based solder alloys containing bismuth as described above, but with such tin-zinc based solder alloys, the metallic luster on the solder surface after solidification is low. It tends to become dull, so it is desired to improve not only the compatibility of wettability and preservation, but also its appearance.
- an object of the present invention is to provide a tin-zinc-based lead-free solder alloy which improves solder wettability and also has excellent long-term storage stability of cream solder, a mixture thereof, and a solder joint.
- the surface gloss after solidification is also improved. Disclosure of the invention
- the present inventors have conducted intensive studies to solve the conventional problems described above. As a result, when a trace amount of magnesium, which has a higher oxidation tendency than zinc, is added to a tin-zinc-based solder by a predetermined composition, a cream is obtained. The inventors have found that the reaction between zinc and flux in the solder is suppressed and the preservability is improved, while the solder has good wettability when it is melted. Thus, the present invention having the following configuration has been completed.
- the tin-zinc based lead-free solder alloy of the present invention is a solder alloy containing tin as a main component and essentially containing at least 6 to 10% by weight of zinc, and a protective coating of magnesium oxide. Is formed on the surface of the solder, and 0.0015 to 0.1% by weight of magnesium, which is an effective ratio for the oxidized protective film to break down when the solder is melted. Therefore, according to the present invention, on the other hand, at the time of preservation of the cream solder, the inside is protected by the oxide protective film of magnesium formed on the surface of the solder powder, and the reaction between zinc and the activator is suppressed to improve the preservability. On the other hand, at the time of raising the temperature at which the solder is melted, the oxide protective film is easily broken, so that good wettability can be maintained.
- the tin-zinc-based lead-free solder alloy of the present invention contains tin as a main component, and contains at least 6 to 10% by weight of zinc and 0.5 to 6% by weight of bismuth.
- the present invention provides a mixture of two or more solder alloys having different component compositions, comprising tin as a main component and at least 0.0015 to 0.1% by weight of magnesium, A tin-zinc based lead-free solder alloy mixture having an average composition of the mixture falling within the range defined in claim 1 is provided.
- the present invention provides a method of mixing two or more solder alloys having different component compositions containing tin as a main component and at least 0.0015 to 0.1% by weight of magnesium.
- a tin-zinc-based lead-free solder alloy mixture having an average composition of the mixture falling within the range defined in claim 2.
- this invention provides the solder joint part joined by the tin-zinc-based lead-free solder alloy of Claim 1, 2, 3 or 4 as described above or its mixture.
- FIG. 1 is a table showing the chemical composition of solder powder and the results of property evaluation in experiments of a tin-zinc based lead-free solder alloy of the present invention.
- the added element when a very small amount of an element having a higher tendency to oxidize than zinc is added to the tin-zinc solder, the added element is preferentially oxidized over zinc, so that the oxide powder is formed on the surface of the solder powder. Since a protective film is formed, the oxidation protective film is intended to reduce the reaction between zinc and flux. As a result, it is possible to obtain a solder powder for cream solder which is excellent in both solder wettability and storage stability. However, it was found that depending on the additive element such as aluminum, the oxidation protective film formed on the surface was so strong that it could not be reduced by flux, and instead, a large amount of undissolved solder was generated when the solder was melted.
- the tin-zinc based lead-free solder alloy according to the present invention suppresses the reaction between zinc and the activator in the flux when preserving the cream solder, thereby improving the preservability, while maintaining good wettability when the solder is melted.
- the chemical composition is a solder alloy containing tin as a main component and essentially containing at least 6 to 10% by weight of zinc, while forming a protective film of magnesium oxide on the solder surface. It is composed of 0.0015 to 0.1% by weight of magnesium, which is an effective ratio for destroying the oxide film when the solder is melted.
- magnesium has the following effects as other effects. That is, when bismuth is added to a tin-zinc solder alloy, the metallic luster on the solder surface tends to be dull. However, it was confirmed that adding a small amount of magnesium to a tin-zinc based solder alloy containing bismuth improves the surface gloss. This is because when bismuth is added, fine irregularities are formed on the surface during solidification, whereas when magnesium is added, the irregularities on the solder surface are reduced during solidification. As a result, it is possible to obtain good gloss close to that of the conventional tin-lead solder.
- the tin one zinc-based lead-free solder alloy according to the present invention the tin as a main component, even without least 6 -1 0 Zinc weight 0/0 and 0.5 to 6 wt 0/0 bismuth essential to A solder alloy containing a protective layer of magnesium oxide on the surface of the solder, which is effective at breaking the oxide protective layer when the solder is melted. It is also possible to adopt a configuration blended with 1 magnesium weight 0/0.
- the reason why the range of addition of magnesium is specified to a predetermined content in the tin-zinc based lead-free solder alloy of the present invention will be described. First, the lower limit was determined from the experimental results as the content required for the effect of magnesium to appear.
- the content is less than 0.0015% by weight, a sufficient oxide film for reducing the reaction between zinc and the flux cannot be formed on the powder surface.
- the upper limit was set to 0.1% by weight from the viewpoint of deterioration of solderability and productivity of solder powder. If the content exceeds 0.1% by weight, magnesium oxide remains without being destroyed during soldering. Another reason is that the viscosity of the molten alloy used in the production of solder powder increases. As described above, only when the upper and lower limits of the magnesium content are specified, the generated oxide protective film suppresses the reaction between zinc and flux and enhances the preservability.On the other hand, when the solder is melted, the oxide protective film is destroyed. This ensures good wettability.
- the individual solder powder before the mixing is at least 0.0015 to 0. . by containing one magnesium weight 0/0, it is possible to obtain the effect of the above.
- other components such as zinc do not necessarily need to fall within the scope of the invention according to claim 1 or 2 in the individual solder powder before mixing, and the entire solder powder after mixing. It is sufficient that the average composition falls within the range.
- the tin of the present invention - 2 zinc-based lead-free solder alloy mixture which tin as a main component, at least 0 0 0 1 5-0 1 containing magnesium by weight 0/0, different that the component composition.
- a mixture of two or more kinds of solder alloys, and the average thread composition of the mixture may be in the range described in claim 1.
- a mixture of the above solder alloys, wherein the average composition of the mixture may be in the range described in claim 2.
- a tin-zinc-based lead-free solder joint is formed by joining with the solder alloy or the mixture thereof configured as described above.
- the solder alloy and the solder alloy mixture prepared with the above-described chemical composition have been described using the example of processing into a solder powder. Of course, it can also be used.
- the present inventors conducted experiments to confirm the effects of the present invention.
- tin was used as a main component
- the content of zinc was 6-9%
- the content of bismuth was 0-3%
- the addition amount of magnesium was 0-0.190%.
- Solder powder was used.
- the solder powder used in this experiment was a tin-zinc based true spherical powder with a particle size of 32 to 45 ⁇ m.
- the chemical composition and characterization results of these powders are shown in the table of FIG.
- the solder powder is mixed with the flux to make a paste, which is used for various evaluation tests.
- the solderability in the figure was evaluated by the method based on JIS-Z-3284, and the wet spreadability was evaluated.
- the present invention is suitable for use in electronic circuit element mounting processes among various solder materials. Useful as a part.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02807735A EP1531024B1 (en) | 2002-08-23 | 2002-11-18 | Tin-zinc lead-free solder, its mixture, and solder-joined part |
KR1020037007307A KR100540846B1 (ko) | 2002-08-23 | 2002-11-18 | 주석-아연계 납 프리 땜납합금 및 땜납접합부 |
US10/468,607 US7175805B2 (en) | 2002-08-23 | 2002-11-18 | Tin-zinc lead-free solder, its mixture, and solder-joined part |
CA002466949A CA2466949A1 (en) | 2002-08-23 | 2002-11-18 | Tin-zinc lead-free solder, its mixture, and solder-joined part |
AU2002368187A AU2002368187A1 (en) | 2002-08-23 | 2002-11-18 | Tin-zinc lead-free solder, its mixture, and solder-joined part |
DE60224456T DE60224456T2 (de) | 2002-08-23 | 2002-11-18 | Bleifreies zinn-zink-lot, seine mischung und verlötetes teil |
US11/435,614 US7179417B2 (en) | 2002-08-23 | 2006-05-17 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002242785A JP2004082134A (ja) | 2002-08-23 | 2002-08-23 | 錫−亜鉛系鉛フリーはんだ合金及びその混合物 |
JP2002-242785 | 2002-08-23 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10468607 A-371-Of-International | 2002-11-18 | ||
US11/435,614 Division US7179417B2 (en) | 2002-08-23 | 2006-05-17 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004018145A1 true WO2004018145A1 (ja) | 2004-03-04 |
Family
ID=31944079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/011990 WO2004018145A1 (ja) | 2002-08-23 | 2002-11-18 | 錫−亜鉛系鉛フリーはんだ合金、その混合物及びはんだ接合部 |
Country Status (11)
Country | Link |
---|---|
US (2) | US7175805B2 (ja) |
EP (1) | EP1531024B1 (ja) |
JP (1) | JP2004082134A (ja) |
KR (1) | KR100540846B1 (ja) |
CN (1) | CN1307022C (ja) |
AT (1) | ATE382448T1 (ja) |
AU (1) | AU2002368187A1 (ja) |
CA (1) | CA2466949A1 (ja) |
DE (1) | DE60224456T2 (ja) |
TW (1) | TWI255750B (ja) |
WO (1) | WO2004018145A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2655237C2 (ru) * | 2013-06-12 | 2018-05-24 | Л'Эр Ликид, Сосьете Аноним Пур Л'Этюд Э Л'Эксплуатасьон Де Проседе Жорж Клод | Средство для защиты органов дыхания |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100348361C (zh) * | 2005-08-04 | 2007-11-14 | 上海交通大学 | Sn-Zn-Cr合金无铅焊料 |
US9050651B2 (en) * | 2011-06-14 | 2015-06-09 | Ingot Metal Company Limited | Method for producing lead-free copper—bismuth alloys and ingots useful for same |
MY181753A (en) | 2013-05-03 | 2021-01-06 | Honeywell Int Inc | Lead frame construct for lead-free solder connections |
US20150151387A1 (en) * | 2013-12-04 | 2015-06-04 | Honeywell International Inc. | Zinc-based lead-free solder compositions |
KR101723032B1 (ko) | 2016-05-19 | 2017-04-04 | 박종세 | 다목적 물꼬 |
CN106825979B (zh) * | 2017-01-04 | 2019-11-12 | 南京信息工程大学 | 一种低熔点Sn-Zn-Bi-Mg系无铅焊料及其制备方法 |
CN113414237B (zh) * | 2021-06-21 | 2023-04-11 | 西安理工大学 | 一种轧制制备高性能Al-Cu-Al复合材料的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015478A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Corp | ハンダ材 |
JP2000210788A (ja) * | 1999-01-27 | 2000-08-02 | Matsushita Electronics Industry Corp | 無鉛半田合金およびその製造方法 |
JP2002248596A (ja) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
JP2002283093A (ja) * | 2001-03-27 | 2002-10-02 | Toshiba Corp | 非鉛系接合用合金 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3103067A (en) * | 1959-08-13 | 1963-09-10 | Westinghouse Electric Corp | Process of soldering to a ceramic or glass body |
DE3135847C2 (de) * | 1981-09-10 | 1983-11-03 | Eerste Nederlandse Witmetaalfabriek B.V., Naarden | Vorlegierung zur Herstellung feinkörniger Zinnlegierungen |
US6080497A (en) * | 1992-03-27 | 2000-06-27 | The Louis Berkman Company | Corrosion-resistant coated copper metal and method for making the same |
JP2002105615A (ja) * | 2000-10-03 | 2002-04-10 | Nippon Steel Corp | 溶融Sn−Mg系めっき鋼板 |
US6361626B1 (en) * | 2000-10-24 | 2002-03-26 | Fujitsu Limited | Solder alloy and soldered bond |
-
2002
- 2002-08-23 JP JP2002242785A patent/JP2004082134A/ja active Pending
- 2002-11-18 AT AT02807735T patent/ATE382448T1/de not_active IP Right Cessation
- 2002-11-18 CA CA002466949A patent/CA2466949A1/en not_active Abandoned
- 2002-11-18 AU AU2002368187A patent/AU2002368187A1/en not_active Abandoned
- 2002-11-18 EP EP02807735A patent/EP1531024B1/en not_active Expired - Lifetime
- 2002-11-18 US US10/468,607 patent/US7175805B2/en not_active Expired - Fee Related
- 2002-11-18 DE DE60224456T patent/DE60224456T2/de not_active Expired - Lifetime
- 2002-11-18 CN CNB028264541A patent/CN1307022C/zh not_active Expired - Fee Related
- 2002-11-18 KR KR1020037007307A patent/KR100540846B1/ko not_active IP Right Cessation
- 2002-11-18 WO PCT/JP2002/011990 patent/WO2004018145A1/ja active IP Right Grant
-
2003
- 2003-05-20 TW TW092113559A patent/TWI255750B/zh active
-
2006
- 2006-05-17 US US11/435,614 patent/US7179417B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015478A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Corp | ハンダ材 |
JP2000210788A (ja) * | 1999-01-27 | 2000-08-02 | Matsushita Electronics Industry Corp | 無鉛半田合金およびその製造方法 |
JP2002248596A (ja) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
JP2002283093A (ja) * | 2001-03-27 | 2002-10-02 | Toshiba Corp | 非鉛系接合用合金 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2655237C2 (ru) * | 2013-06-12 | 2018-05-24 | Л'Эр Ликид, Сосьете Аноним Пур Л'Этюд Э Л'Эксплуатасьон Де Проседе Жорж Клод | Средство для защиты органов дыхания |
Also Published As
Publication number | Publication date |
---|---|
EP1531024B1 (en) | 2008-01-02 |
DE60224456T2 (de) | 2009-01-02 |
AU2002368187A1 (en) | 2004-03-11 |
KR100540846B1 (ko) | 2006-01-10 |
JP2004082134A (ja) | 2004-03-18 |
TW200403124A (en) | 2004-03-01 |
DE60224456D1 (de) | 2008-02-14 |
US7175805B2 (en) | 2007-02-13 |
CN1307022C (zh) | 2007-03-28 |
CN1610599A (zh) | 2005-04-27 |
ATE382448T1 (de) | 2008-01-15 |
TWI255750B (en) | 2006-06-01 |
EP1531024A1 (en) | 2005-05-18 |
EP1531024A4 (en) | 2006-04-26 |
US7179417B2 (en) | 2007-02-20 |
CA2466949A1 (en) | 2004-03-04 |
US20040156741A1 (en) | 2004-08-12 |
US20060210420A1 (en) | 2006-09-21 |
KR20040036680A (ko) | 2004-04-30 |
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