JPH0213472B2 - - Google Patents
Info
- Publication number
- JPH0213472B2 JPH0213472B2 JP59171657A JP17165784A JPH0213472B2 JP H0213472 B2 JPH0213472 B2 JP H0213472B2 JP 59171657 A JP59171657 A JP 59171657A JP 17165784 A JP17165784 A JP 17165784A JP H0213472 B2 JPH0213472 B2 JP H0213472B2
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive material
- substrate
- ceramic
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 21
- 239000002923 metal particle Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000197 pyrolysis Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 28
- 230000003014 reinforcing effect Effects 0.000 description 18
- 239000000203 mixture Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000012216 screening Methods 0.000 description 5
- -1 diazoketone compound Chemical class 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005272 metallurgy Methods 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910001338 liquidmetal Inorganic materials 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZRUOTKQBVMWMDK-UHFFFAOYSA-N 2-hydroxy-6-methylbenzaldehyde Chemical group CC1=CC=CC(O)=C1C=O ZRUOTKQBVMWMDK-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- XXTZHYXQVWRADW-UHFFFAOYSA-N diazomethanone Chemical compound [N]N=C=O XXTZHYXQVWRADW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Producing Shaped Articles From Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/561,373 US4555285A (en) | 1983-12-14 | 1983-12-14 | Forming patterns in metallic or ceramic substrates |
| US561373 | 1983-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60128695A JPS60128695A (ja) | 1985-07-09 |
| JPH0213472B2 true JPH0213472B2 (enExample) | 1990-04-04 |
Family
ID=24241675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171657A Granted JPS60128695A (ja) | 1983-12-14 | 1984-08-20 | 基板のパタ−ン形成方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4555285A (enExample) |
| EP (1) | EP0144684B1 (enExample) |
| JP (1) | JPS60128695A (enExample) |
| DE (1) | DE3479618D1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4753694A (en) * | 1986-05-02 | 1988-06-28 | International Business Machines Corporation | Process for forming multilayered ceramic substrate having solid metal conductors |
| DE3619871A1 (de) * | 1986-06-13 | 1987-12-17 | Siemens Ag | Verfahren zur herstellung keramischen materials mit piezoelektrischen eigenschaften |
| US4828961A (en) * | 1986-07-02 | 1989-05-09 | W. R. Grace & Co.-Conn. | Imaging process for forming ceramic electronic circuits |
| DE69132442T2 (de) * | 1990-01-25 | 2001-05-03 | Dai Nippon Insatsu K.K., Tokio/Tokyo | Verfahren und material zum bilden von texturierten dicken filmartigen mustern |
| US5798469A (en) * | 1992-12-29 | 1998-08-25 | International Business Machines Corporation | Non-sintering controlled pattern formation |
| DE4312976A1 (de) * | 1993-04-21 | 1994-10-27 | Bosch Gmbh Robert | Kontaktierung von elektrisch leitenden Schichten eines Schichtsystems |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| KR20080023303A (ko) * | 2005-05-18 | 2008-03-13 | 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 | 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작 |
| JP4344954B2 (ja) * | 2006-10-03 | 2009-10-14 | セイコーエプソン株式会社 | 素子基板の製造方法 |
| JP2008091685A (ja) * | 2006-10-03 | 2008-04-17 | Seiko Epson Corp | 素子基板およびその製造方法 |
| EP4610240A1 (en) | 2024-02-28 | 2025-09-03 | CeramTec GmbH | A millable paste for use in a method for obtaining cavity structures in a ceramic component, and a method for obtaining said cavity structures in ceramic components |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1219843B (de) * | 1962-05-09 | 1966-06-23 | Buntpapierfabrik A G | Verfahren zum Dekorieren von nichtglasierten Rohscherben unter Verwendung keramischer Schiebebilder |
| DE1522515C2 (de) * | 1965-08-03 | 1980-10-09 | Du Pont | Verfahren zur Herstellung gedruckter Schaltungen |
| US3526504A (en) * | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
| US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| US3614834A (en) * | 1969-09-09 | 1971-10-26 | Us Air Force | Extensometer for large diameter rods |
| US3615980A (en) * | 1970-02-12 | 1971-10-26 | Daniel J Rose | Decal metallization of ceramic substrates |
| US3968193A (en) * | 1971-08-27 | 1976-07-06 | International Business Machines Corporation | Firing process for forming a multilayer glass-metal module |
| US4353957A (en) * | 1973-09-24 | 1982-10-12 | Tam Ceramics Inc. | Ceramic matrices for electronic devices and process for forming same |
| US3948706A (en) * | 1973-12-13 | 1976-04-06 | International Business Machines Corporation | Method for metallizing ceramic green sheets |
| US3984244A (en) * | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
| US4119480A (en) * | 1976-05-13 | 1978-10-10 | Tokyo Shibaura Electric Co., Ltd. | Method of manufacturing thick-film circuit devices |
| DE2854010A1 (de) * | 1977-12-21 | 1979-07-05 | Letraset International Ltd | Verfahren zur herstellung von schildern |
| US4405394A (en) * | 1980-05-27 | 1983-09-20 | E. I. Du Pont De Nemours And Company | Laminating process |
-
1983
- 1983-12-14 US US06/561,373 patent/US4555285A/en not_active Expired - Fee Related
-
1984
- 1984-08-20 JP JP59171657A patent/JPS60128695A/ja active Granted
- 1984-10-26 EP EP84112875A patent/EP0144684B1/en not_active Expired
- 1984-10-26 DE DE8484112875T patent/DE3479618D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3479618D1 (en) | 1989-10-05 |
| EP0144684B1 (en) | 1989-08-30 |
| EP0144684A2 (en) | 1985-06-19 |
| US4555285A (en) | 1985-11-26 |
| JPS60128695A (ja) | 1985-07-09 |
| EP0144684A3 (en) | 1986-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4902610A (en) | Method for manufacture of multilayer circuit board | |
| US4360570A (en) | Use of photosensitive stratum to create through-hole connections in circuit boards | |
| JP3177211B2 (ja) | プリント配線基板内のホールを充填する方法 | |
| US4546065A (en) | Process for forming a pattern of metallurgy on the top of a ceramic substrate | |
| US4119480A (en) | Method of manufacturing thick-film circuit devices | |
| US4283243A (en) | Use of photosensitive stratum to create through-hole connections in circuit boards | |
| US6350334B1 (en) | Method of manufacturing a multi-layered ceramic substrate | |
| JPH0213472B2 (enExample) | ||
| JP3442200B2 (ja) | プリント回路基板、プリント回路基板の製造方法 | |
| DE69605056T2 (de) | Lötstopmaske zur herstellung gedruckter schaltungen | |
| JP3670487B2 (ja) | 配線基板の製造方法 | |
| JP2001216839A (ja) | 導電性ペースト及び多層基板の製法 | |
| JP3236785B2 (ja) | 積層セラミック基板の製造方法 | |
| JP2003264361A (ja) | 回路基板の製造方法 | |
| JP2896296B2 (ja) | セラミックス配線基板の製造方法 | |
| JPH11186448A (ja) | 積層セラミック回路基板の製造方法 | |
| WO1991017840A1 (en) | Process for making fine conductor lines | |
| JP4407781B2 (ja) | セラミック回路基板の製造方法 | |
| JPH0818236A (ja) | 積層セラミック回路基板の製造方法 | |
| JP3472599B2 (ja) | 配線構造体の製造方法 | |
| JP3709453B2 (ja) | セラミックス多層配線基板の製造方法 | |
| JP2001144128A (ja) | 導電体の印刷方法 | |
| JP4454663B2 (ja) | 複合メッキ処理抵抗素子およびそれを含むプリント回路基板の製造方法 | |
| JP3559310B2 (ja) | 積層セラミック回路基板の製造方法 | |
| JPH0558667B2 (enExample) |