JPS60128695A - 基板のパタ−ン形成方法 - Google Patents
基板のパタ−ン形成方法Info
- Publication number
- JPS60128695A JPS60128695A JP59171657A JP17165784A JPS60128695A JP S60128695 A JPS60128695 A JP S60128695A JP 59171657 A JP59171657 A JP 59171657A JP 17165784 A JP17165784 A JP 17165784A JP S60128695 A JPS60128695 A JP S60128695A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- photosensitive material
- ceramic
- pattern
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 37
- 239000000919 ceramic Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 18
- 238000005245 sintering Methods 0.000 claims description 8
- 239000002923 metal particle Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 230000007261 regionalization Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 25
- 230000003014 reinforcing effect Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000012216 screening Methods 0.000 description 5
- -1 diazocarbon compound Chemical class 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910001338 liquidmetal Inorganic materials 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- ZRUOTKQBVMWMDK-UHFFFAOYSA-N 2-hydroxy-6-methylbenzaldehyde Chemical group CC1=CC=CC(O)=C1C=O ZRUOTKQBVMWMDK-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910019590 Cr-N Inorganic materials 0.000 description 1
- 229910019588 Cr—N Inorganic materials 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 206010024229 Leprosy Diseases 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AIXAANGOTKPUOY-UHFFFAOYSA-N carbachol Chemical group [Cl-].C[N+](C)(C)CCOC(N)=O AIXAANGOTKPUOY-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXTZHYXQVWRADW-UHFFFAOYSA-N diazomethanone Chemical compound [N]N=C=O XXTZHYXQVWRADW-UHFFFAOYSA-N 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Producing Shaped Articles From Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US561373 | 1983-12-14 | ||
| US06/561,373 US4555285A (en) | 1983-12-14 | 1983-12-14 | Forming patterns in metallic or ceramic substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60128695A true JPS60128695A (ja) | 1985-07-09 |
| JPH0213472B2 JPH0213472B2 (enExample) | 1990-04-04 |
Family
ID=24241675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171657A Granted JPS60128695A (ja) | 1983-12-14 | 1984-08-20 | 基板のパタ−ン形成方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4555285A (enExample) |
| EP (1) | EP0144684B1 (enExample) |
| JP (1) | JPS60128695A (enExample) |
| DE (1) | DE3479618D1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991011307A1 (fr) * | 1990-01-25 | 1991-08-08 | Dai Nippon Insatsu Kabushiki Kaisha | Procede et matiere pour former des films epais textures |
| JP2008546542A (ja) * | 2005-05-18 | 2008-12-25 | プレジデント・アンド・フエローズ・オブ・ハーバード・カレツジ | マイクロ流体ネットワークにおける伝導通路、マイクロ回路、マイクロ構造の製造 |
| US7597813B2 (en) | 2006-10-03 | 2009-10-06 | Seiko Epson Corporation | Element substrate and method of manufacturing the same |
| US7966720B2 (en) | 2006-10-03 | 2011-06-28 | Seiko Epson Corporation | Method of manufacturing an element substrate |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4753694A (en) * | 1986-05-02 | 1988-06-28 | International Business Machines Corporation | Process for forming multilayered ceramic substrate having solid metal conductors |
| DE3619871A1 (de) * | 1986-06-13 | 1987-12-17 | Siemens Ag | Verfahren zur herstellung keramischen materials mit piezoelektrischen eigenschaften |
| US4828961A (en) * | 1986-07-02 | 1989-05-09 | W. R. Grace & Co.-Conn. | Imaging process for forming ceramic electronic circuits |
| US5798469A (en) * | 1992-12-29 | 1998-08-25 | International Business Machines Corporation | Non-sintering controlled pattern formation |
| DE4312976A1 (de) * | 1993-04-21 | 1994-10-27 | Bosch Gmbh Robert | Kontaktierung von elektrisch leitenden Schichten eines Schichtsystems |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| EP4610240A1 (en) | 2024-02-28 | 2025-09-03 | CeramTec GmbH | A millable paste for use in a method for obtaining cavity structures in a ceramic component, and a method for obtaining said cavity structures in ceramic components |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1219843B (de) * | 1962-05-09 | 1966-06-23 | Buntpapierfabrik A G | Verfahren zum Dekorieren von nichtglasierten Rohscherben unter Verwendung keramischer Schiebebilder |
| DE1522515C2 (de) * | 1965-08-03 | 1980-10-09 | Du Pont | Verfahren zur Herstellung gedruckter Schaltungen |
| US3526504A (en) * | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
| US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| US3614834A (en) * | 1969-09-09 | 1971-10-26 | Us Air Force | Extensometer for large diameter rods |
| US3615980A (en) * | 1970-02-12 | 1971-10-26 | Daniel J Rose | Decal metallization of ceramic substrates |
| US3726002A (en) * | 1971-08-27 | 1973-04-10 | Ibm | Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate |
| US4353957A (en) * | 1973-09-24 | 1982-10-12 | Tam Ceramics Inc. | Ceramic matrices for electronic devices and process for forming same |
| US3948706A (en) * | 1973-12-13 | 1976-04-06 | International Business Machines Corporation | Method for metallizing ceramic green sheets |
| US3984244A (en) * | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
| US4119480A (en) * | 1976-05-13 | 1978-10-10 | Tokyo Shibaura Electric Co., Ltd. | Method of manufacturing thick-film circuit devices |
| DE2854010A1 (de) * | 1977-12-21 | 1979-07-05 | Letraset International Ltd | Verfahren zur herstellung von schildern |
| US4405394A (en) * | 1980-05-27 | 1983-09-20 | E. I. Du Pont De Nemours And Company | Laminating process |
-
1983
- 1983-12-14 US US06/561,373 patent/US4555285A/en not_active Expired - Fee Related
-
1984
- 1984-08-20 JP JP59171657A patent/JPS60128695A/ja active Granted
- 1984-10-26 EP EP84112875A patent/EP0144684B1/en not_active Expired
- 1984-10-26 DE DE8484112875T patent/DE3479618D1/de not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991011307A1 (fr) * | 1990-01-25 | 1991-08-08 | Dai Nippon Insatsu Kabushiki Kaisha | Procede et matiere pour former des films epais textures |
| JP2008546542A (ja) * | 2005-05-18 | 2008-12-25 | プレジデント・アンド・フエローズ・オブ・ハーバード・カレツジ | マイクロ流体ネットワークにおける伝導通路、マイクロ回路、マイクロ構造の製造 |
| US7597813B2 (en) | 2006-10-03 | 2009-10-06 | Seiko Epson Corporation | Element substrate and method of manufacturing the same |
| US7966720B2 (en) | 2006-10-03 | 2011-06-28 | Seiko Epson Corporation | Method of manufacturing an element substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0144684A2 (en) | 1985-06-19 |
| EP0144684B1 (en) | 1989-08-30 |
| US4555285A (en) | 1985-11-26 |
| EP0144684A3 (en) | 1986-11-26 |
| JPH0213472B2 (enExample) | 1990-04-04 |
| DE3479618D1 (en) | 1989-10-05 |
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