DE3479618D1 - Forming patterns in metallic or ceramic substrates - Google Patents

Forming patterns in metallic or ceramic substrates

Info

Publication number
DE3479618D1
DE3479618D1 DE8484112875T DE3479618T DE3479618D1 DE 3479618 D1 DE3479618 D1 DE 3479618D1 DE 8484112875 T DE8484112875 T DE 8484112875T DE 3479618 T DE3479618 T DE 3479618T DE 3479618 D1 DE3479618 D1 DE 3479618D1
Authority
DE
Germany
Prior art keywords
metallic
ceramic substrates
forming patterns
patterns
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484112875T
Other languages
German (de)
English (en)
Inventor
Dudley Angustus Chance
Timothy Clark Reiley
Michael Sampogna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3479618D1 publication Critical patent/DE3479618D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
DE8484112875T 1983-12-14 1984-10-26 Forming patterns in metallic or ceramic substrates Expired DE3479618D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/561,373 US4555285A (en) 1983-12-14 1983-12-14 Forming patterns in metallic or ceramic substrates

Publications (1)

Publication Number Publication Date
DE3479618D1 true DE3479618D1 (en) 1989-10-05

Family

ID=24241675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484112875T Expired DE3479618D1 (en) 1983-12-14 1984-10-26 Forming patterns in metallic or ceramic substrates

Country Status (4)

Country Link
US (1) US4555285A (enExample)
EP (1) EP0144684B1 (enExample)
JP (1) JPS60128695A (enExample)
DE (1) DE3479618D1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
DE3619871A1 (de) * 1986-06-13 1987-12-17 Siemens Ag Verfahren zur herstellung keramischen materials mit piezoelektrischen eigenschaften
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
US5580511A (en) * 1990-01-25 1996-12-03 Dai Nippon Insatsu Kabushiki Kaisha Method of forming thick film pattern and material for forming thick film pattern
US5798469A (en) * 1992-12-29 1998-08-25 International Business Machines Corporation Non-sintering controlled pattern formation
DE4312976A1 (de) * 1993-04-21 1994-10-27 Bosch Gmbh Robert Kontaktierung von elektrisch leitenden Schichten eines Schichtsystems
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
WO2007061448A2 (en) * 2005-05-18 2007-05-31 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
JP4344954B2 (ja) * 2006-10-03 2009-10-14 セイコーエプソン株式会社 素子基板の製造方法
JP2008091685A (ja) * 2006-10-03 2008-04-17 Seiko Epson Corp 素子基板およびその製造方法
EP4610240A1 (en) 2024-02-28 2025-09-03 CeramTec GmbH A millable paste for use in a method for obtaining cavity structures in a ceramic component, and a method for obtaining said cavity structures in ceramic components

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1219843B (de) * 1962-05-09 1966-06-23 Buntpapierfabrik A G Verfahren zum Dekorieren von nichtglasierten Rohscherben unter Verwendung keramischer Schiebebilder
DE1522515C2 (de) * 1965-08-03 1980-10-09 Du Pont Verfahren zur Herstellung gedruckter Schaltungen
US3526504A (en) * 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US3614834A (en) * 1969-09-09 1971-10-26 Us Air Force Extensometer for large diameter rods
US3615980A (en) * 1970-02-12 1971-10-26 Daniel J Rose Decal metallization of ceramic substrates
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US4353957A (en) * 1973-09-24 1982-10-12 Tam Ceramics Inc. Ceramic matrices for electronic devices and process for forming same
US3948706A (en) * 1973-12-13 1976-04-06 International Business Machines Corporation Method for metallizing ceramic green sheets
US3984244A (en) * 1974-11-27 1976-10-05 E. I. Du Pont De Nemours And Company Process for laminating a channeled photosensitive layer on an irregular surface
US4119480A (en) * 1976-05-13 1978-10-10 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing thick-film circuit devices
DE2854010A1 (de) * 1977-12-21 1979-07-05 Letraset International Ltd Verfahren zur herstellung von schildern
US4405394A (en) * 1980-05-27 1983-09-20 E. I. Du Pont De Nemours And Company Laminating process

Also Published As

Publication number Publication date
EP0144684A2 (en) 1985-06-19
EP0144684B1 (en) 1989-08-30
US4555285A (en) 1985-11-26
EP0144684A3 (en) 1986-11-26
JPH0213472B2 (enExample) 1990-04-04
JPS60128695A (ja) 1985-07-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee