JP7794821B2 - ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法 - Google Patents

ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法

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Publication number
JP7794821B2
JP7794821B2 JP2023527217A JP2023527217A JP7794821B2 JP 7794821 B2 JP7794821 B2 JP 7794821B2 JP 2023527217 A JP2023527217 A JP 2023527217A JP 2023527217 A JP2023527217 A JP 2023527217A JP 7794821 B2 JP7794821 B2 JP 7794821B2
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force
wire bonding
height position
head assembly
height
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JP2023548578A (ja
JPWO2022098697A5 (https=
JP2023548578A5 (https=
Inventor
シュ、フイ
チン、ウェイ
オードナー、ディー．、マシュー
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クリック アンド ソッファ インダストリーズ、インク．
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2023527217A 2020-11-05 2021-11-03 ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法 Active JP7794821B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063110012P 2020-11-05 2020-11-05
US63/110,012 2020-11-05
PCT/US2021/057820 WO2022098697A1 (en) 2020-11-05 2021-11-03 Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods

Publications (4)

Publication Number Publication Date
JP2023548578A JP2023548578A (ja) 2023-11-17
JPWO2022098697A5 JPWO2022098697A5 (https=) 2024-11-07
JP2023548578A5 JP2023548578A5 (https=) 2024-11-07
JP7794821B2 true JP7794821B2 (ja) 2026-01-06

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JP2023527217A Active JP7794821B2 (ja) 2020-11-05 2021-11-03 ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法

Country Status (6)

Country Link
US (2) US11597031B2 (https=)
JP (1) JP7794821B2 (https=)
KR (1) KR20230098652A (https=)
CN (1) CN116420221A (https=)
TW (1) TWI895537B (https=)
WO (1) WO2022098697A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12230424B1 (en) * 2021-04-27 2025-02-18 Encore Wire Corporation Bond wire payoff system and method
US20240250063A1 (en) * 2023-01-20 2024-07-25 Kulicke And Soffa Industries, Inc. Methods of automatic recovery for process errors in operating wire bonding machines
CN116313859B (zh) * 2023-05-26 2023-09-15 青岛泰睿思微电子有限公司 悬臂产品的焊线方法
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置
JP2009152480A (ja) 2007-12-21 2009-07-09 Shinapex Co Ltd ワイヤボンディング装置
JP2017113799A (ja) 2015-12-25 2017-06-29 株式会社シンアペックス 超音波接合装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
JP2535599B2 (ja) * 1988-08-30 1996-09-18 富士通株式会社 ワイヤボンディング方法
JP3051229B2 (ja) * 1991-11-01 2000-06-12 芝浦メカトロニクス株式会社 ボンディング装置
US5230458A (en) 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JPH1027818A (ja) * 1996-07-10 1998-01-27 Toshiba Mechatronics Kk ボンディング装置におけるボンディング荷重検出装置
JPH1041330A (ja) * 1996-07-22 1998-02-13 Sony Corp ワイヤボンデイング方法
JP3370553B2 (ja) * 1997-05-07 2003-01-27 株式会社新川 ボンディング荷重の補正方法及びワイヤボンディング装置
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
JPH11265907A (ja) * 1998-03-17 1999-09-28 Kyushu Electronics System:Kk アルミワイヤボンディング装置及び方法
JP3522123B2 (ja) * 1998-09-30 2004-04-26 株式会社新川 ワイヤボンディング方法
US6483190B1 (en) * 1999-10-20 2002-11-19 Fujitsu Limited Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
US6564115B1 (en) * 2000-02-01 2003-05-13 Texas Instruments Incorporated Combined system, method and apparatus for wire bonding and testing
JP3681676B2 (ja) * 2001-11-16 2005-08-10 松下電器産業株式会社 バンプボンディング方法及び装置
TW200628029A (en) * 2004-12-06 2006-08-01 Matsushita Electric Industrial Co Ltd Component mounting apparatus and component mounting method
JP2007214342A (ja) * 2006-02-09 2007-08-23 Shinkawa Ltd ワイヤボンディング装置のキャピラリ接地位置データ設定方法
CN101675510B (zh) * 2007-05-16 2011-12-14 库利克和索夫工业公司 金属线接合方法和接合力校准
JP4275724B1 (ja) * 2008-07-16 2009-06-10 株式会社新川 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
JP4343996B1 (ja) * 2008-08-20 2009-10-14 株式会社新川 ワイヤボンディング装置及びキャピラリの振幅測定方法
JP4425319B1 (ja) * 2008-09-10 2010-03-03 株式会社新川 ボンディング方法、ボンディング装置及び製造方法
TWI506710B (zh) * 2009-09-09 2015-11-01 瑞薩電子股份有限公司 半導體裝置之製造方法
KR20110119304A (ko) * 2010-04-27 2011-11-02 삼성엘이디 주식회사 본딩면의 바운싱 모니터링 장치, 이를 구비한 와이어 본딩 장치 및 본딩면의 바운싱 모니터링 방법
JP4880055B2 (ja) * 2010-06-04 2012-02-22 株式会社新川 電子部品実装装置及びその方法
US8348356B2 (en) 2010-07-08 2013-01-08 Caterpillar Inc. Combination idler recoil and tension adjustment assembly and method for identifying source of leakage in same
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
JP6354415B2 (ja) * 2013-08-14 2018-07-11 富士電機株式会社 レーザ溶接機とそれを用いたレーザ溶接方法
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
JP2015153907A (ja) * 2014-02-14 2015-08-24 株式会社新川 半導体装置の製造方法及びワイヤボンディング装置
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
JP6172058B2 (ja) * 2014-06-09 2017-08-02 株式会社デンソー 半導体装置の製造方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105590874A (zh) * 2015-12-18 2016-05-18 中国电子科技集团公司第二研究所 一种引线楔焊微小力输出机构的工作方法
CN105598613A (zh) * 2015-12-18 2016-05-25 中国电子科技集团公司第二研究所 全自动引线键合机焊头
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US11517977B2 (en) * 2017-09-15 2022-12-06 Tech-Sonic, Inc. Dual cam servo weld splicer
CN108213687A (zh) * 2018-01-16 2018-06-29 上海铭沣半导体科技有限公司 全自动引线键合机焊头
US11049839B2 (en) * 2018-01-24 2021-06-29 Kulicke And Soffa Industries, Inc. Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
JP2020119983A (ja) * 2019-01-23 2020-08-06 トヨタ自動車株式会社 半導体素子接合装置、及び半導体素子接合方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置
JP2009152480A (ja) 2007-12-21 2009-07-09 Shinapex Co Ltd ワイヤボンディング装置
JP2017113799A (ja) 2015-12-25 2017-06-29 株式会社シンアペックス 超音波接合装置

Also Published As

Publication number Publication date
JP2023548578A (ja) 2023-11-17
US11597031B2 (en) 2023-03-07
WO2022098697A1 (en) 2022-05-12
KR20230098652A (ko) 2023-07-04
TWI895537B (zh) 2025-09-01
US20220134469A1 (en) 2022-05-05
US11865633B2 (en) 2024-01-09
CN116420221A (zh) 2023-07-11
TW202230548A (zh) 2022-08-01
US20230166348A1 (en) 2023-06-01

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