TWI895537B - 引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法 - Google Patents

引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法

Info

Publication number
TWI895537B
TWI895537B TW110141006A TW110141006A TWI895537B TW I895537 B TWI895537 B TW I895537B TW 110141006 A TW110141006 A TW 110141006A TW 110141006 A TW110141006 A TW 110141006A TW I895537 B TWI895537 B TW I895537B
Authority
TW
Taiwan
Prior art keywords
wire bonding
force
bonding machine
operating
height position
Prior art date
Application number
TW110141006A
Other languages
English (en)
Chinese (zh)
Other versions
TW202230548A (zh
Inventor
徐慧
偉 秦
Ｄ 馬修 奧德納
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202230548A publication Critical patent/TW202230548A/zh
Application granted granted Critical
Publication of TWI895537B publication Critical patent/TWI895537B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW110141006A 2020-11-05 2021-11-03 引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法 TWI895537B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063110012P 2020-11-05 2020-11-05
US63/110,012 2020-11-05

Publications (2)

Publication Number Publication Date
TW202230548A TW202230548A (zh) 2022-08-01
TWI895537B true TWI895537B (zh) 2025-09-01

Family

ID=81380561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141006A TWI895537B (zh) 2020-11-05 2021-11-03 引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法

Country Status (6)

Country Link
US (2) US11597031B2 (https=)
JP (1) JP7794821B2 (https=)
KR (1) KR20230098652A (https=)
CN (1) CN116420221A (https=)
TW (1) TWI895537B (https=)
WO (1) WO2022098697A1 (https=)

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US12230424B1 (en) * 2021-04-27 2025-02-18 Encore Wire Corporation Bond wire payoff system and method
US20240250063A1 (en) * 2023-01-20 2024-07-25 Kulicke And Soffa Industries, Inc. Methods of automatic recovery for process errors in operating wire bonding machines
CN116313859B (zh) * 2023-05-26 2023-09-15 青岛泰睿思微电子有限公司 悬臂产品的焊线方法
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法

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US6250539B1 (en) * 1998-09-30 2001-06-26 Kabushiki Kaisha Shinkawa Wire bonding method
TW200802648A (en) * 2006-02-09 2008-01-01 Shinkawa Kk Data setting method of Capillary grounding position for wire bonding device
US20100108744A1 (en) * 2007-05-16 2010-05-06 Kulicke And Soffa Industries, Inc. Closed loop wire bonding methods and bonding force calibration
US20110259941A1 (en) * 2010-04-27 2011-10-27 Kim Soo Seong Apparatus for monitoring bonding surface bouncing, wire bonding apparatus having the same and method for monitoring bonding surface bouncing

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US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
US6250539B1 (en) * 1998-09-30 2001-06-26 Kabushiki Kaisha Shinkawa Wire bonding method
TW200802648A (en) * 2006-02-09 2008-01-01 Shinkawa Kk Data setting method of Capillary grounding position for wire bonding device
US20100108744A1 (en) * 2007-05-16 2010-05-06 Kulicke And Soffa Industries, Inc. Closed loop wire bonding methods and bonding force calibration
US20110259941A1 (en) * 2010-04-27 2011-10-27 Kim Soo Seong Apparatus for monitoring bonding surface bouncing, wire bonding apparatus having the same and method for monitoring bonding surface bouncing

Also Published As

Publication number Publication date
JP2023548578A (ja) 2023-11-17
US11597031B2 (en) 2023-03-07
WO2022098697A1 (en) 2022-05-12
KR20230098652A (ko) 2023-07-04
JP7794821B2 (ja) 2026-01-06
US20220134469A1 (en) 2022-05-05
US11865633B2 (en) 2024-01-09
CN116420221A (zh) 2023-07-11
TW202230548A (zh) 2022-08-01
US20230166348A1 (en) 2023-06-01

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