KR20230098652A - 와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법 - Google Patents

와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법 Download PDF

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Publication number
KR20230098652A
KR20230098652A KR1020237018943A KR20237018943A KR20230098652A KR 20230098652 A KR20230098652 A KR 20230098652A KR 1020237018943 A KR1020237018943 A KR 1020237018943A KR 20237018943 A KR20237018943 A KR 20237018943A KR 20230098652 A KR20230098652 A KR 20230098652A
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South Korea
Prior art keywords
force
wire bonding
height position
head assembly
height
Prior art date
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Pending
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KR1020237018943A
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English (en)
Korean (ko)
Inventor
후이 수
웨이 친
디. 매튜 오드너
Original Assignee
쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
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Publication of KR20230098652A publication Critical patent/KR20230098652A/ko
Pending legal-status Critical Current

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    • H01L24/85—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H01L24/48—
    • H01L24/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H01L2224/48247—
    • H01L2224/78251—
    • H01L2224/78301—
    • H01L2224/78901—
    • H01L2224/7892—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
KR1020237018943A 2020-11-05 2021-11-03 와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법 Pending KR20230098652A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063110012P 2020-11-05 2020-11-05
US63/110,012 2020-11-05
PCT/US2021/057820 WO2022098697A1 (en) 2020-11-05 2021-11-03 Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods

Publications (1)

Publication Number Publication Date
KR20230098652A true KR20230098652A (ko) 2023-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237018943A Pending KR20230098652A (ko) 2020-11-05 2021-11-03 와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법

Country Status (6)

Country Link
US (2) US11597031B2 (https=)
JP (1) JP7794821B2 (https=)
KR (1) KR20230098652A (https=)
CN (1) CN116420221A (https=)
TW (1) TWI895537B (https=)
WO (1) WO2022098697A1 (https=)

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US12230424B1 (en) * 2021-04-27 2025-02-18 Encore Wire Corporation Bond wire payoff system and method
US20240250063A1 (en) * 2023-01-20 2024-07-25 Kulicke And Soffa Industries, Inc. Methods of automatic recovery for process errors in operating wire bonding machines
CN116313859B (zh) * 2023-05-26 2023-09-15 青岛泰睿思微电子有限公司 悬臂产品的焊线方法
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法

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Also Published As

Publication number Publication date
JP2023548578A (ja) 2023-11-17
US11597031B2 (en) 2023-03-07
WO2022098697A1 (en) 2022-05-12
TWI895537B (zh) 2025-09-01
JP7794821B2 (ja) 2026-01-06
US20220134469A1 (en) 2022-05-05
US11865633B2 (en) 2024-01-09
CN116420221A (zh) 2023-07-11
TW202230548A (zh) 2022-08-01
US20230166348A1 (en) 2023-06-01

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