JP7735999B2 - 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法 - Google Patents

銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法

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Publication number
JP7735999B2
JP7735999B2 JP2022530481A JP2022530481A JP7735999B2 JP 7735999 B2 JP7735999 B2 JP 7735999B2 JP 2022530481 A JP2022530481 A JP 2022530481A JP 2022530481 A JP2022530481 A JP 2022530481A JP 7735999 B2 JP7735999 B2 JP 7735999B2
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Japan
Prior art keywords
copper
chemical polishing
polishing solution
mass
component
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JP2022530481A
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English (en)
Japanese (ja)
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JPWO2021251204A1 (https=
Inventor
伸也 黒澤
裕嗣 松永
聡 玉井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP2022530481A 2020-06-08 2021-06-01 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法 Active JP7735999B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020099372 2020-06-08
JP2020099372 2020-06-08
PCT/JP2021/020778 WO2021251204A1 (ja) 2020-06-08 2021-06-01 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法

Publications (2)

Publication Number Publication Date
JPWO2021251204A1 JPWO2021251204A1 (https=) 2021-12-16
JP7735999B2 true JP7735999B2 (ja) 2025-09-09

Family

ID=78845681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022530481A Active JP7735999B2 (ja) 2020-06-08 2021-06-01 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法

Country Status (4)

Country Link
JP (1) JP7735999B2 (https=)
CN (1) CN115836143B (https=)
TW (1) TWI887426B (https=)
WO (1) WO2021251204A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115613043A (zh) * 2022-11-11 2023-01-17 安徽鑫科铜业有限公司 一种铜镍硅合金带材表面处理溶液及铜镍硅合金带材表面处理方法
CN116497355B (zh) * 2023-04-10 2024-03-22 珠海市裕洲环保科技有限公司 一种酸性铜蚀刻液及其应用
CN116617879A (zh) * 2023-04-28 2023-08-22 四川大学 一种活性酯-胺界面聚合制备聚酰胺纳滤膜新方法
CN117328066B (zh) * 2023-10-07 2024-03-22 江苏贺鸿电子有限公司 一种线路板用粗化微蚀剂及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133147A (ja) 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤
JP2005220365A (ja) 2004-02-03 2005-08-18 Mitsubishi Gas Chem Co Inc 銅および銅合金の化学研磨液
JP2006511701A (ja) 2002-11-26 2006-04-06 マクダーミッド　インコーポレーテッド 金属表面に対するポリマー材料の接着力向上方法、接着力向上剤
JP2009076601A (ja) 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
JP2013058629A (ja) 2011-09-08 2013-03-28 Kanto Chem Co Inc 銅および銅合金のエッチング液
JP2013245401A (ja) 2012-05-30 2013-12-09 Shikoku Chem Corp 銅のエッチング液およびエッチング方法
JP2017031502A (ja) 2015-08-03 2017-02-09 三菱瓦斯化学株式会社 銅層およびチタン層を含む多層薄膜をエッチングするためのエッチング液およびこれを用いたエッチング方法、並びに該エッチング方法を用いて得られた基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286933A (en) * 1976-01-14 1977-07-20 Tokai Electro Chemical Co Method of treating surface of copper and copper alloy
JPS58197277A (ja) * 1982-05-08 1983-11-16 Mitsubishi Gas Chem Co Inc 金属の化学的溶解処理液
JP3361680B2 (ja) * 1995-12-27 2003-01-07 日本パーオキサイド株式会社 銅又は銅合金の表面処理液
US7063800B2 (en) * 2003-11-10 2006-06-20 Ying Ding Methods of cleaning copper surfaces in the manufacture of printed circuit boards
TW200946621A (en) * 2007-10-29 2009-11-16 Ekc Technology Inc Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use
KR102254563B1 (ko) * 2015-03-31 2021-05-21 동우 화인켐 주식회사 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006511701A (ja) 2002-11-26 2006-04-06 マクダーミッド　インコーポレーテッド 金属表面に対するポリマー材料の接着力向上方法、接着力向上剤
JP2005133147A (ja) 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤
JP2005220365A (ja) 2004-02-03 2005-08-18 Mitsubishi Gas Chem Co Inc 銅および銅合金の化学研磨液
JP2009076601A (ja) 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
JP2013058629A (ja) 2011-09-08 2013-03-28 Kanto Chem Co Inc 銅および銅合金のエッチング液
JP2013245401A (ja) 2012-05-30 2013-12-09 Shikoku Chem Corp 銅のエッチング液およびエッチング方法
JP2017031502A (ja) 2015-08-03 2017-02-09 三菱瓦斯化学株式会社 銅層およびチタン層を含む多層薄膜をエッチングするためのエッチング液およびこれを用いたエッチング方法、並びに該エッチング方法を用いて得られた基板

Also Published As

Publication number Publication date
TWI887426B (zh) 2025-06-21
WO2021251204A1 (ja) 2021-12-16
JPWO2021251204A1 (https=) 2021-12-16
CN115836143A (zh) 2023-03-21
TW202208686A (zh) 2022-03-01
CN115836143B (zh) 2025-04-11

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