TWI887426B - 用於銅或銅合金之表面處理的化學研磨液及表面處理方法 - Google Patents

用於銅或銅合金之表面處理的化學研磨液及表面處理方法 Download PDF

Info

Publication number
TWI887426B
TWI887426B TW110119759A TW110119759A TWI887426B TW I887426 B TWI887426 B TW I887426B TW 110119759 A TW110119759 A TW 110119759A TW 110119759 A TW110119759 A TW 110119759A TW I887426 B TWI887426 B TW I887426B
Authority
TW
Taiwan
Prior art keywords
copper
polishing liquid
chemical polishing
copper alloy
surface treatment
Prior art date
Application number
TW110119759A
Other languages
English (en)
Chinese (zh)
Other versions
TW202208686A (zh
Inventor
黒澤伸也
松永裕嗣
玉井聡
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW202208686A publication Critical patent/TW202208686A/zh
Application granted granted Critical
Publication of TWI887426B publication Critical patent/TWI887426B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
TW110119759A 2020-06-08 2021-06-01 用於銅或銅合金之表面處理的化學研磨液及表面處理方法 TWI887426B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020099372 2020-06-08
JP2020-099372 2020-06-08

Publications (2)

Publication Number Publication Date
TW202208686A TW202208686A (zh) 2022-03-01
TWI887426B true TWI887426B (zh) 2025-06-21

Family

ID=78845681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119759A TWI887426B (zh) 2020-06-08 2021-06-01 用於銅或銅合金之表面處理的化學研磨液及表面處理方法

Country Status (4)

Country Link
JP (1) JP7735999B2 (https=)
CN (1) CN115836143B (https=)
TW (1) TWI887426B (https=)
WO (1) WO2021251204A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115613043A (zh) * 2022-11-11 2023-01-17 安徽鑫科铜业有限公司 一种铜镍硅合金带材表面处理溶液及铜镍硅合金带材表面处理方法
CN116497355B (zh) * 2023-04-10 2024-03-22 珠海市裕洲环保科技有限公司 一种酸性铜蚀刻液及其应用
CN116617879A (zh) * 2023-04-28 2023-08-22 四川大学 一种活性酯-胺界面聚合制备聚酰胺纳滤膜新方法
CN117328066B (zh) * 2023-10-07 2024-03-22 江苏贺鸿电子有限公司 一种线路板用粗化微蚀剂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459216A (en) * 1982-05-08 1984-07-10 Mitsubishi Gas Chemical Company, Inc. Chemical dissolving solution for metals
TW200516177A (en) * 2003-11-10 2005-05-16 Macdermid Acumen Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
JP2005133147A (ja) * 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤
TW200946621A (en) * 2007-10-29 2009-11-16 Ekc Technology Inc Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286933A (en) * 1976-01-14 1977-07-20 Tokai Electro Chemical Co Method of treating surface of copper and copper alloy
JP3361680B2 (ja) * 1995-12-27 2003-01-07 日本パーオキサイド株式会社 銅又は銅合金の表面処理液
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP2005220365A (ja) * 2004-02-03 2005-08-18 Mitsubishi Gas Chem Co Inc 銅および銅合金の化学研磨液
JP2009076601A (ja) 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
JP5885971B2 (ja) 2011-09-08 2016-03-16 関東化學株式会社 銅および銅合金のエッチング液
JP5715088B2 (ja) * 2012-05-30 2015-05-07 四国化成工業株式会社 銅のエッチング方法
KR102254563B1 (ko) * 2015-03-31 2021-05-21 동우 화인켐 주식회사 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
JP6337922B2 (ja) 2015-08-03 2018-06-06 三菱瓦斯化学株式会社 銅層およびチタン層を含む多層薄膜をエッチングするためのエッチング液およびこれを用いたエッチング方法、並びに該エッチング方法を用いて得られた基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459216A (en) * 1982-05-08 1984-07-10 Mitsubishi Gas Chemical Company, Inc. Chemical dissolving solution for metals
JP2005133147A (ja) * 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤
TW200516177A (en) * 2003-11-10 2005-05-16 Macdermid Acumen Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
TW200946621A (en) * 2007-10-29 2009-11-16 Ekc Technology Inc Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use

Also Published As

Publication number Publication date
JP7735999B2 (ja) 2025-09-09
WO2021251204A1 (ja) 2021-12-16
JPWO2021251204A1 (https=) 2021-12-16
CN115836143A (zh) 2023-03-21
TW202208686A (zh) 2022-03-01
CN115836143B (zh) 2025-04-11

Similar Documents

Publication Publication Date Title
TWI887426B (zh) 用於銅或銅合金之表面處理的化學研磨液及表面處理方法
US6194366B1 (en) Post chemical-mechanical planarization (CMP) cleaning composition
DE60222532T2 (de) Zusammensetzung zur reinigung nach einem chemischen-mechanischen polierverfahren
US6492308B1 (en) Post chemical-mechanical planarization (CMP) cleaning composition
JP4538490B2 (ja) アルミニウム又はアルミニウム合金上の金属置換処理液及びこれを用いた表面処理方法
JP2010093126A (ja) 基板処理用アルカリ性水溶液組成物
JP4232002B2 (ja) デバイス基板用の洗浄組成物及び該洗浄組成物を用いた洗浄方法並びに洗浄装置
TWI376273B (en) Semiconductor substrate process
US20060166847A1 (en) Compositions for processing of semiconductor substrates
TW201000627A (en) Cleaning liquid composition for a semiconductor substrate
TW583310B (en) Composition comprising an oxidizing and complexing compound
TW200903605A (en) Substrate cleaning solution for semiconductor device and method for manufacturing semiconductor device
JP2008305900A (ja) 基板の洗浄またはエッチングに用いられるアルカリ性水溶液組成物
KR0177568B1 (ko) 세정제 및 세정방법
JP5101505B2 (ja) Ｃｕ層及びＣｕ／Ｎｉ層用の安定化されたエッチング溶液
EP0776256B1 (en) Stainless steel acid treatment
DE602004009584T2 (de) Halbleiterreinigungslösung
JP2014114505A (ja) 除錆防錆剤および除錆防錆方法
JP3957268B2 (ja) 半導体基板の洗浄方法
DE602004008863T2 (de) Zusammensetzung und Verfahren zur Behandlung von Halbleitersubstraten
JP2006505132A (ja) 半導体の表面処理およびそれに使用される混合物
US20100275952A1 (en) Selective etching of reactor surfaces
JP5671793B2 (ja) 仕上研磨を施したシリコンウェーハの洗浄方法
JP5365031B2 (ja) 半導体製造装置部品の洗浄方法
TWI725732B (zh) 用於半導體晶圓的清洗液組成物及使用該清洗液組成物的清洗方法