CN115836143B - 用于铜或铜合金的表面处理的化学研磨液和表面处理方法 - Google Patents

用于铜或铜合金的表面处理的化学研磨液和表面处理方法 Download PDF

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Publication number
CN115836143B
CN115836143B CN202180040575.4A CN202180040575A CN115836143B CN 115836143 B CN115836143 B CN 115836143B CN 202180040575 A CN202180040575 A CN 202180040575A CN 115836143 B CN115836143 B CN 115836143B
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China
Prior art keywords
copper
chemical polishing
polishing liquid
copper alloy
mass
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CN202180040575.4A
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Chinese (zh)
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CN115836143A (zh
Inventor
黑泽伸也
松永裕嗣
玉井聪
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
CN202180040575.4A 2020-06-08 2021-06-01 用于铜或铜合金的表面处理的化学研磨液和表面处理方法 Active CN115836143B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020099372 2020-06-08
JP2020-099372 2020-06-08
PCT/JP2021/020778 WO2021251204A1 (ja) 2020-06-08 2021-06-01 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法

Publications (2)

Publication Number Publication Date
CN115836143A CN115836143A (zh) 2023-03-21
CN115836143B true CN115836143B (zh) 2025-04-11

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CN202180040575.4A Active CN115836143B (zh) 2020-06-08 2021-06-01 用于铜或铜合金的表面处理的化学研磨液和表面处理方法

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Country Link
JP (1) JP7735999B2 (https=)
CN (1) CN115836143B (https=)
TW (1) TWI887426B (https=)
WO (1) WO2021251204A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115613043A (zh) * 2022-11-11 2023-01-17 安徽鑫科铜业有限公司 一种铜镍硅合金带材表面处理溶液及铜镍硅合金带材表面处理方法
CN116497355B (zh) * 2023-04-10 2024-03-22 珠海市裕洲环保科技有限公司 一种酸性铜蚀刻液及其应用
CN116617879A (zh) * 2023-04-28 2023-08-22 四川大学 一种活性酯-胺界面聚合制备聚酰胺纳滤膜新方法
CN117328066B (zh) * 2023-10-07 2024-03-22 江苏贺鸿电子有限公司 一种线路板用粗化微蚀剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459216A (en) * 1982-05-08 1984-07-10 Mitsubishi Gas Chemical Company, Inc. Chemical dissolving solution for metals
JP2005133147A (ja) * 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286933A (en) * 1976-01-14 1977-07-20 Tokai Electro Chemical Co Method of treating surface of copper and copper alloy
JP3361680B2 (ja) * 1995-12-27 2003-01-07 日本パーオキサイド株式会社 銅又は銅合金の表面処理液
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US7063800B2 (en) * 2003-11-10 2006-06-20 Ying Ding Methods of cleaning copper surfaces in the manufacture of printed circuit boards
JP2005220365A (ja) * 2004-02-03 2005-08-18 Mitsubishi Gas Chem Co Inc 銅および銅合金の化学研磨液
JP2009076601A (ja) 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
TW200946621A (en) * 2007-10-29 2009-11-16 Ekc Technology Inc Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use
JP5885971B2 (ja) 2011-09-08 2016-03-16 関東化學株式会社 銅および銅合金のエッチング液
JP5715088B2 (ja) * 2012-05-30 2015-05-07 四国化成工業株式会社 銅のエッチング方法
KR102254563B1 (ko) * 2015-03-31 2021-05-21 동우 화인켐 주식회사 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
JP6337922B2 (ja) 2015-08-03 2018-06-06 三菱瓦斯化学株式会社 銅層およびチタン層を含む多層薄膜をエッチングするためのエッチング液およびこれを用いたエッチング方法、並びに該エッチング方法を用いて得られた基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459216A (en) * 1982-05-08 1984-07-10 Mitsubishi Gas Chemical Company, Inc. Chemical dissolving solution for metals
JP2005133147A (ja) * 2003-10-30 2005-05-26 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤

Also Published As

Publication number Publication date
TWI887426B (zh) 2025-06-21
JP7735999B2 (ja) 2025-09-09
WO2021251204A1 (ja) 2021-12-16
JPWO2021251204A1 (https=) 2021-12-16
CN115836143A (zh) 2023-03-21
TW202208686A (zh) 2022-03-01

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