JP7710376B2 - 電解銅めっき液、その製造方法及び電解銅めっき方法 - Google Patents

電解銅めっき液、その製造方法及び電解銅めっき方法

Info

Publication number
JP7710376B2
JP7710376B2 JP2021562580A JP2021562580A JP7710376B2 JP 7710376 B2 JP7710376 B2 JP 7710376B2 JP 2021562580 A JP2021562580 A JP 2021562580A JP 2021562580 A JP2021562580 A JP 2021562580A JP 7710376 B2 JP7710376 B2 JP 7710376B2
Authority
JP
Japan
Prior art keywords
copper plating
electrolytic copper
plating solution
component
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021562580A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021111919A1 (https=
JPWO2021111919A5 (https=
Inventor
拓也 ▲高▼橋
伸哉 石渡
朋子 廿日出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of JPWO2021111919A1 publication Critical patent/JPWO2021111919A1/ja
Publication of JPWO2021111919A5 publication Critical patent/JPWO2021111919A5/ja
Application granted granted Critical
Publication of JP7710376B2 publication Critical patent/JP7710376B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021562580A 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法 Active JP7710376B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
JP2019219370 2019-12-04
PCT/JP2020/043577 WO2021111919A1 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Publications (3)

Publication Number Publication Date
JPWO2021111919A1 JPWO2021111919A1 (https=) 2021-06-10
JPWO2021111919A5 JPWO2021111919A5 (https=) 2023-11-20
JP7710376B2 true JP7710376B2 (ja) 2025-07-18

Family

ID=76222138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562580A Active JP7710376B2 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Country Status (6)

Country Link
US (1) US20230025950A1 (https=)
JP (1) JP7710376B2 (https=)
KR (1) KR20220109405A (https=)
CN (1) CN114761621A (https=)
TW (1) TWI901613B (https=)
WO (1) WO2021111919A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199994A (ja) 2005-01-19 2006-08-03 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2006265632A (ja) 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2007016264A (ja) 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Adeka 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
CN105102687A (zh) * 2013-04-02 2015-11-25 株式会社Adeka 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199994A (ja) 2005-01-19 2006-08-03 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2006265632A (ja) 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2007016264A (ja) 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法

Also Published As

Publication number Publication date
KR20220109405A (ko) 2022-08-04
US20230025950A1 (en) 2023-01-26
TWI901613B (zh) 2025-10-21
CN114761621A (zh) 2022-07-15
JPWO2021111919A1 (https=) 2021-06-10
WO2021111919A1 (ja) 2021-06-10
TW202130860A (zh) 2021-08-16

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