CN114761621A - 电解镀铜液、其制造方法以及电解镀铜方法 - Google Patents

电解镀铜液、其制造方法以及电解镀铜方法 Download PDF

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Publication number
CN114761621A
CN114761621A CN202080084097.2A CN202080084097A CN114761621A CN 114761621 A CN114761621 A CN 114761621A CN 202080084097 A CN202080084097 A CN 202080084097A CN 114761621 A CN114761621 A CN 114761621A
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CN
China
Prior art keywords
copper plating
electrolytic copper
plating solution
parts
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080084097.2A
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English (en)
Chinese (zh)
Inventor
高桥拓也
石渡伸哉
廿日出朋子
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Adeka Corp
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Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of CN114761621A publication Critical patent/CN114761621A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202080084097.2A 2019-12-04 2020-11-24 电解镀铜液、其制造方法以及电解镀铜方法 Pending CN114761621A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
JP2019-219370 2019-12-04
PCT/JP2020/043577 WO2021111919A1 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Publications (1)

Publication Number Publication Date
CN114761621A true CN114761621A (zh) 2022-07-15

Family

ID=76222138

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080084097.2A Pending CN114761621A (zh) 2019-12-04 2020-11-24 电解镀铜液、其制造方法以及电解镀铜方法

Country Status (6)

Country Link
US (1) US20230025950A1 (https=)
JP (1) JP7710376B2 (https=)
KR (1) KR20220109405A (https=)
CN (1) CN114761621A (https=)
TW (1) TWI901613B (https=)
WO (1) WO2021111919A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP2007016265A (ja) * 2005-07-06 2007-01-25 Adeka Corp 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
JP4704761B2 (ja) 2005-01-19 2011-06-22 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP4799887B2 (ja) 2005-03-24 2011-10-26 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP2007016264A (ja) * 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
CN105102687A (zh) * 2013-04-02 2015-11-25 株式会社Adeka 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP2007016265A (ja) * 2005-07-06 2007-01-25 Adeka Corp 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用
JP2025522118A (ja) * 2022-07-22 2025-07-10 揚州納力新材料科技有限公司 ノーシアン銅めっき結晶粒微細化剤、ノーシアン銅めっき液及びその調製方法と適用

Also Published As

Publication number Publication date
KR20220109405A (ko) 2022-08-04
US20230025950A1 (en) 2023-01-26
TWI901613B (zh) 2025-10-21
JPWO2021111919A1 (https=) 2021-06-10
WO2021111919A1 (ja) 2021-06-10
TW202130860A (zh) 2021-08-16
JP7710376B2 (ja) 2025-07-18

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