TWI901613B - 電解鍍銅液、其製造方法及電解鍍銅方法 - Google Patents

電解鍍銅液、其製造方法及電解鍍銅方法

Info

Publication number
TWI901613B
TWI901613B TW109141728A TW109141728A TWI901613B TW I901613 B TWI901613 B TW I901613B TW 109141728 A TW109141728 A TW 109141728A TW 109141728 A TW109141728 A TW 109141728A TW I901613 B TWI901613 B TW I901613B
Authority
TW
Taiwan
Prior art keywords
copper plating
electrolytic copper
parts
mass
plating solution
Prior art date
Application number
TW109141728A
Other languages
English (en)
Chinese (zh)
Other versions
TW202130860A (zh
Inventor
髙橋拓也
石渡伸哉
廿日出朋子
Original Assignee
日商Ａｄｅｋａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｄｅｋａ股份有限公司 filed Critical 日商Ａｄｅｋａ股份有限公司
Publication of TW202130860A publication Critical patent/TW202130860A/zh
Application granted granted Critical
Publication of TWI901613B publication Critical patent/TWI901613B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW109141728A 2019-12-04 2020-11-27 電解鍍銅液、其製造方法及電解鍍銅方法 TWI901613B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
JP2019-219370 2019-12-04

Publications (2)

Publication Number Publication Date
TW202130860A TW202130860A (zh) 2021-08-16
TWI901613B true TWI901613B (zh) 2025-10-21

Family

ID=76222138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109141728A TWI901613B (zh) 2019-12-04 2020-11-27 電解鍍銅液、其製造方法及電解鍍銅方法

Country Status (6)

Country Link
US (1) US20230025950A1 (https=)
JP (1) JP7710376B2 (https=)
KR (1) KR20220109405A (https=)
CN (1) CN114761621A (https=)
TW (1) TWI901613B (https=)
WO (1) WO2021111919A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
TWI255872B (en) * 2002-11-21 2006-06-01 Shipley Co Llc Electroplating bath
TWI489013B (zh) * 2009-09-16 2015-06-21 Uyemura C & Co Ltd 銅電鍍浴及使用該銅電鍍浴的電鍍方法
TWI603981B (zh) * 2013-04-02 2017-11-01 Adeka股份有限公司 電解鍍銅浴用添加劑、含有該添加劑之電解鍍銅浴及使用該電解鍍銅浴之電解鍍銅方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP4704761B2 (ja) 2005-01-19 2011-06-22 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP4799887B2 (ja) 2005-03-24 2011-10-26 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Adeka 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP2007016264A (ja) * 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
TWI255872B (en) * 2002-11-21 2006-06-01 Shipley Co Llc Electroplating bath
TWI489013B (zh) * 2009-09-16 2015-06-21 Uyemura C & Co Ltd 銅電鍍浴及使用該銅電鍍浴的電鍍方法
TWI603981B (zh) * 2013-04-02 2017-11-01 Adeka股份有限公司 電解鍍銅浴用添加劑、含有該添加劑之電解鍍銅浴及使用該電解鍍銅浴之電解鍍銅方法

Also Published As

Publication number Publication date
KR20220109405A (ko) 2022-08-04
US20230025950A1 (en) 2023-01-26
CN114761621A (zh) 2022-07-15
JPWO2021111919A1 (https=) 2021-06-10
WO2021111919A1 (ja) 2021-06-10
TW202130860A (zh) 2021-08-16
JP7710376B2 (ja) 2025-07-18

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