KR20220109405A - 전해 구리 도금액, 그 제조 방법 및 전해 구리 도금 방법 - Google Patents

전해 구리 도금액, 그 제조 방법 및 전해 구리 도금 방법 Download PDF

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Publication number
KR20220109405A
KR20220109405A KR1020227018554A KR20227018554A KR20220109405A KR 20220109405 A KR20220109405 A KR 20220109405A KR 1020227018554 A KR1020227018554 A KR 1020227018554A KR 20227018554 A KR20227018554 A KR 20227018554A KR 20220109405 A KR20220109405 A KR 20220109405A
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KR
South Korea
Prior art keywords
copper plating
electrolytic copper
plating solution
component
atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020227018554A
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English (en)
Korean (ko)
Inventor
다쿠야 다카하시
신야 이시와타
도모코 하츠카데
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20220109405A publication Critical patent/KR20220109405A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020227018554A 2019-12-04 2020-11-24 전해 구리 도금액, 그 제조 방법 및 전해 구리 도금 방법 Ceased KR20220109405A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
JPJP-P-2019-219370 2019-12-04
PCT/JP2020/043577 WO2021111919A1 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Publications (1)

Publication Number Publication Date
KR20220109405A true KR20220109405A (ko) 2022-08-04

Family

ID=76222138

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227018554A Ceased KR20220109405A (ko) 2019-12-04 2020-11-24 전해 구리 도금액, 그 제조 방법 및 전해 구리 도금 방법

Country Status (6)

Country Link
US (1) US20230025950A1 (https=)
JP (1) JP7710376B2 (https=)
KR (1) KR20220109405A (https=)
CN (1) CN114761621A (https=)
TW (1) TWI901613B (https=)
WO (1) WO2021111919A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199994A (ja) 2005-01-19 2006-08-03 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2006265632A (ja) 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2007016264A (ja) 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Adeka 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
CN105102687A (zh) * 2013-04-02 2015-11-25 株式会社Adeka 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199994A (ja) 2005-01-19 2006-08-03 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2006265632A (ja) 2005-03-24 2006-10-05 Ishihara Chem Co Ltd 電気銅メッキ浴、並びに銅メッキ方法
JP2007016264A (ja) 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法

Also Published As

Publication number Publication date
US20230025950A1 (en) 2023-01-26
TWI901613B (zh) 2025-10-21
CN114761621A (zh) 2022-07-15
JPWO2021111919A1 (https=) 2021-06-10
WO2021111919A1 (ja) 2021-06-10
TW202130860A (zh) 2021-08-16
JP7710376B2 (ja) 2025-07-18

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PA0105 International application

Patent event date: 20220531

Patent event code: PA01051R01D

Comment text: International Patent Application

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PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20250424

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20250627

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D