JPWO2021111919A5 - - Google Patents
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- Publication number
- JPWO2021111919A5 JPWO2021111919A5 JP2021562580A JP2021562580A JPWO2021111919A5 JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5 JP 2021562580 A JP2021562580 A JP 2021562580A JP 2021562580 A JP2021562580 A JP 2021562580A JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- electrolytic copper
- copper plating
- atom
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019219370 | 2019-12-04 | ||
| JP2019219370 | 2019-12-04 | ||
| PCT/JP2020/043577 WO2021111919A1 (ja) | 2019-12-04 | 2020-11-24 | 電解銅めっき液、その製造方法及び電解銅めっき方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021111919A1 JPWO2021111919A1 (https=) | 2021-06-10 |
| JPWO2021111919A5 true JPWO2021111919A5 (https=) | 2023-11-20 |
| JP7710376B2 JP7710376B2 (ja) | 2025-07-18 |
Family
ID=76222138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021562580A Active JP7710376B2 (ja) | 2019-12-04 | 2020-11-24 | 電解銅めっき液、その製造方法及び電解銅めっき方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230025950A1 (https=) |
| JP (1) | JP7710376B2 (https=) |
| KR (1) | KR20220109405A (https=) |
| CN (1) | CN114761621A (https=) |
| TW (1) | TWI901613B (https=) |
| WO (1) | WO2021111919A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016330A1 (zh) * | 2022-07-22 | 2024-01-25 | 扬州纳力新材料科技有限公司 | 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07316875A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| EP1422320A1 (en) * | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| JP4704761B2 (ja) | 2005-01-19 | 2011-06-22 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP4799887B2 (ja) | 2005-03-24 | 2011-10-26 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Adeka | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
| JP2007016264A (ja) * | 2005-07-06 | 2007-01-25 | Adeka Corp | 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法 |
| JP5637671B2 (ja) * | 2009-09-16 | 2014-12-10 | 上村工業株式会社 | 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法 |
| CN105102687A (zh) * | 2013-04-02 | 2015-11-25 | 株式会社Adeka | 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法 |
-
2020
- 2020-11-24 KR KR1020227018554A patent/KR20220109405A/ko not_active Ceased
- 2020-11-24 CN CN202080084097.2A patent/CN114761621A/zh active Pending
- 2020-11-24 WO PCT/JP2020/043577 patent/WO2021111919A1/ja not_active Ceased
- 2020-11-24 US US17/781,949 patent/US20230025950A1/en not_active Abandoned
- 2020-11-24 JP JP2021562580A patent/JP7710376B2/ja active Active
- 2020-11-27 TW TW109141728A patent/TWI901613B/zh active
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