JPWO2021111919A5 - - Google Patents

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JPWO2021111919A5
JPWO2021111919A5 JP2021562580A JP2021562580A JPWO2021111919A5 JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5 JP 2021562580 A JP2021562580 A JP 2021562580A JP 2021562580 A JP2021562580 A JP 2021562580A JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5
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plating solution
electrolytic copper
copper plating
atom
mass
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JP2021562580A
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JPWO2021111919A1 (en
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Priority claimed from PCT/JP2020/043577 external-priority patent/WO2021111919A1/en
Publication of JPWO2021111919A1 publication Critical patent/JPWO2021111919A1/ja
Publication of JPWO2021111919A5 publication Critical patent/JPWO2021111919A5/ja
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Figure 2021111919000001
Figure 2021111919000001

Claims (8)

（Ａ）硫酸イオン
（Ｂ）下記一般式（１）で表される化合物
（Ｃ）銅イオン
を含有し、前記（Ａ）成分の含有量１００質量部に対する、前記（Ｂ）成分の含有量が０．３～５０質量部であり、前記（Ｃ）成分の含有量が５～５０質量部である、電解銅めっき液。
Figure 2021111919000002
 （式中、Ｒ1及びＲ2は各々独立に、水素原子、ナトリウム原子、カリウム原子又は炭素原子数１～５のアルキル基を表し、ｎは１又は２を表す。） (A) Sulfate ion (B) Compound represented by the following general formula (1) (C) Contains copper ion, and the content of the component (B) based on 100 parts by mass of the component (A) is An electrolytic copper plating solution having a content of 0.3 to 50 parts by mass, and a content of component (C) of 5 to 50 parts by mass.
Figure 2021111919000002
 (In the formula, R 1 and R 2 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and n represents 1 or 2.) 前記Ｒ1が、水素原子、ナトリウム原子又はカリウム原子であり、Ｒ2が水素原子である、請求項１に記載の電解銅めっき液。 The electrolytic copper plating solution according to claim 1 , wherein R 1 is a hydrogen atom, a sodium atom, or a potassium atom, and R 2 is a hydrogen atom. さらに、塩化物イオンを含有する、請求項１又は２に記載の電解銅めっき液。 The electrolytic copper plating solution according to claim 1 or 2, further containing chloride ions. 前記（Ａ）成分が、電解銅めっき液１Ｌ中に、１０ｇ～５００ｇ含まれる、請求項１～３のいずれか１項に記載の電解銅めっき液。 The electrolytic copper plating solution according to any one of claims 1 to 3, wherein the component (A) is contained in 10 g to 500 g in 1 L of the electrolytic copper plating solution. 請求項１～４のいずれか１項に記載の電解銅めっき液を用いることを含む、電解銅めっき方法。 An electrolytic copper plating method comprising using the electrolytic copper plating solution according to any one of claims 1 to 4. 硫酸イオン供給源、下記一般式（１）で表される化合物、銅イオン供給源及び溶媒を混合することを含む、電解銅めっき液を製造する方法であって、前記電解銅めっき液において、硫酸イオンの含有量１００質量部に対する、前記一般式（１）で表される化合物の含有量が０．３～５０質量部であり、銅イオンの含有量が５～５０質量部である、電解銅めっき液を製造する方法。
Figure 2021111919000003
 （式中、Ｒ1及びＲ2は各々独立に、水素原子、ナトリウム原子、カリウム原子又は炭素原子数１～５のアルキル基を表し、ｎは１又は２を表す。） A method for producing an electrolytic copper plating solution comprising mixing a sulfate ion source, a compound represented by the following general formula (1), a copper ion source, and a solvent, the method comprising: mixing a sulfate ion source, a compound represented by the following general formula (1), a copper ion source, and a solvent, the method comprising: Electrolytic copper, in which the content of the compound represented by the general formula (1) is 0.3 to 50 parts by mass and the content of copper ions is 5 to 50 parts by mass, relative to 100 parts by mass of ions. A method of manufacturing plating solution.
Figure 2021111919000003
 (In the formula, R 1 and R 2 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and n represents 1 or 2.) 前記Ｒ1が、水素原子、ナトリウム原子又はカリウム原子であり、Ｒ2が水素原子である、請求項６に記載の電解銅めっき液を製造する方法。 The method for producing an electrolytic copper plating solution according to claim 6, wherein R 1 is a hydrogen atom, a sodium atom, or a potassium atom, and R 2 is a hydrogen atom. 前記（Ａ）成分が、電解銅めっき液１Ｌ中に、１０ｇ～５００ｇ含まれる、請求項６又は７に記載の電解銅めっき液を製造する方法。 The method for producing an electrolytic copper plating solution according to claim 6 or 7, wherein the component (A) is contained in 10 g to 500 g in 1 L of the electrolytic copper plating solution .
JP2021562580A 2019-12-04 2020-11-24 Pending JPWO2021111919A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
PCT/JP2020/043577 WO2021111919A1 (en) 2019-12-04 2020-11-24 Electrolytic copper plating solution, method for producing same, and electrolytic copper plating method

Publications (2)

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JPWO2021111919A1 JPWO2021111919A1 (en) 2021-06-10
JPWO2021111919A5 true JPWO2021111919A5 (en) 2023-11-20

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JP2021562580A Pending JPWO2021111919A1 (en) 2019-12-04 2020-11-24

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US (1) US20230025950A1 (en)
JP (1) JPWO2021111919A1 (en)
KR (1) KR20220109405A (en)
CN (1) CN114761621A (en)
TW (1) TW202130860A (en)
WO (1) WO2021111919A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (en) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 Cyanide-free copper plating grain refiner, cyanide-free copper plating solution, preparation method therefor, and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (en) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd Additive for copper electroplating and copper electroplating bath
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP4704761B2 (en) 2005-01-19 2011-06-22 石原薬品株式会社 Electro copper plating bath and copper plating method
JP4799887B2 (en) 2005-03-24 2011-10-26 石原薬品株式会社 Electro copper plating bath and copper plating method
JP2007016264A (en) 2005-07-06 2007-01-25 Adeka Corp New compound, additive for electrolytic copper plating comprising the compound, electrolytic copper plating bath containing the additive, and electrolytic copper plating method using the plating bath
JP4750486B2 (en) * 2005-07-06 2011-08-17 株式会社Ａｄｅｋａ Electrolytic copper plating additive, electrolytic copper plating bath containing the additive, and electrolytic copper plating method using the plating bath

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