JP2021527166A5 - - Google Patents

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Publication number
JP2021527166A5
JP2021527166A5 JP2020568240A JP2020568240A JP2021527166A5 JP 2021527166 A5 JP2021527166 A5 JP 2021527166A5 JP 2020568240 A JP2020568240 A JP 2020568240A JP 2020568240 A JP2020568240 A JP 2020568240A JP 2021527166 A5 JP2021527166 A5 JP 2021527166A5
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JP
Japan
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group
substituted
unsubstituted
hydrogen
plating bath
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JP2020568240A
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English (en)
Japanese (ja)
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JP7335280B2 (ja
JPWO2019234085A5 (https=
JP2021527166A (ja
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Priority claimed from EP18176836.7A external-priority patent/EP3578683B1/en
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Publication of JPWO2019234085A5 publication Critical patent/JPWO2019234085A5/ja
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JP2020568240A 2018-06-08 2019-06-05 無電解銅又は銅合金めっき浴及びめっきする方法 Active JP7335280B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18176836.7A EP3578683B1 (en) 2018-06-08 2018-06-08 Electroless copper or copper alloy plating bath and method for plating
EP18176836.7 2018-06-08
PCT/EP2019/064616 WO2019234085A1 (en) 2018-06-08 2019-06-05 Electroless copper or copper alloy plating bath and method for plating

Publications (4)

Publication Number Publication Date
JP2021527166A JP2021527166A (ja) 2021-10-11
JP2021527166A5 true JP2021527166A5 (https=) 2022-05-31
JPWO2019234085A5 JPWO2019234085A5 (https=) 2022-05-31
JP7335280B2 JP7335280B2 (ja) 2023-08-29

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JP2020568240A Active JP7335280B2 (ja) 2018-06-08 2019-06-05 無電解銅又は銅合金めっき浴及びめっきする方法

Country Status (7)

Country Link
US (1) US11396706B2 (https=)
EP (1) EP3578683B1 (https=)
JP (1) JP7335280B2 (https=)
KR (1) KR20210018457A (https=)
CN (1) CN112400036B (https=)
TW (1) TWI814822B (https=)
WO (1) WO2019234085A1 (https=)

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JP7601633B2 (ja) * 2020-12-28 2024-12-17 上村工業株式会社 フレキシブル基板の製造方法
EP4063533A1 (en) * 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
KR20260003107A (ko) 2023-04-26 2026-01-06 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판의 표면을 전처리하기 위한 방법
WO2025202100A1 (en) 2024-03-28 2025-10-02 Atotech Deutschland GmbH & Co. KG A method for electroless copper depositing onto a surface of a non-conductive or carbonfibres containing substrate

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US6913651B2 (en) 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
IL153498A0 (en) * 2002-12-17 2003-07-06 J G Systems Inc Electroless copper metallization of electronic devices
JP4078977B2 (ja) * 2002-12-27 2008-04-23 日立化成工業株式会社 無電解金めっき液及び無電解金めっき方法
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