CN112400036B - 无电铜或铜合金镀浴和用于镀覆的方法 - Google Patents

无电铜或铜合金镀浴和用于镀覆的方法 Download PDF

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Publication number
CN112400036B
CN112400036B CN201980045418.5A CN201980045418A CN112400036B CN 112400036 B CN112400036 B CN 112400036B CN 201980045418 A CN201980045418 A CN 201980045418A CN 112400036 B CN112400036 B CN 112400036B
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China
Prior art keywords
copper
substituted
unsubstituted
plating bath
hydrogen
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CN201980045418.5A
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English (en)
Chinese (zh)
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CN112400036A (zh
Inventor
R-D·库尔克
S·扎韦尔
K·克拉登
A·彼得
B·贝克
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
CN201980045418.5A 2018-06-08 2019-06-05 无电铜或铜合金镀浴和用于镀覆的方法 Active CN112400036B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18176836.7A EP3578683B1 (en) 2018-06-08 2018-06-08 Electroless copper or copper alloy plating bath and method for plating
EP18176836.7 2018-06-08
PCT/EP2019/064616 WO2019234085A1 (en) 2018-06-08 2019-06-05 Electroless copper or copper alloy plating bath and method for plating

Publications (2)

Publication Number Publication Date
CN112400036A CN112400036A (zh) 2021-02-23
CN112400036B true CN112400036B (zh) 2023-02-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980045418.5A Active CN112400036B (zh) 2018-06-08 2019-06-05 无电铜或铜合金镀浴和用于镀覆的方法

Country Status (7)

Country Link
US (1) US11396706B2 (https=)
EP (1) EP3578683B1 (https=)
JP (1) JP7335280B2 (https=)
KR (1) KR20210018457A (https=)
CN (1) CN112400036B (https=)
TW (1) TWI814822B (https=)
WO (1) WO2019234085A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7601633B2 (ja) * 2020-12-28 2024-12-17 上村工業株式会社 フレキシブル基板の製造方法
EP4063533A1 (en) * 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
KR20260003107A (ko) 2023-04-26 2026-01-06 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판의 표면을 전처리하기 위한 방법
WO2025202100A1 (en) 2024-03-28 2025-10-02 Atotech Deutschland GmbH & Co. KG A method for electroless copper depositing onto a surface of a non-conductive or carbonfibres containing substrate

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US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
CN103397316A (zh) * 2013-07-18 2013-11-20 胜宏科技（惠州）股份有限公司 一种酸性化学镀铜复合添加剂及其制备方法和使用方法
CN104968835A (zh) * 2013-03-27 2015-10-07 埃托特克德国有限公司 无电镀铜溶液

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US4617205A (en) 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
DE59909392D1 (de) 1998-11-13 2004-06-09 Lpw Chemie Gmbh Verfahren zur Metallisierung einer Kunststoffoberfläche
US6913651B2 (en) 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
IL153498A0 (en) * 2002-12-17 2003-07-06 J G Systems Inc Electroless copper metallization of electronic devices
JP4078977B2 (ja) * 2002-12-27 2008-04-23 日立化成工業株式会社 無電解金めっき液及び無電解金めっき方法
US7220296B1 (en) 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
JP5177426B2 (ja) 2006-04-18 2013-04-03 奥野製薬工業株式会社 樹脂成形体に対するエッチング処理用組成物
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CN104040026B (zh) 2011-10-05 2019-01-01 埃托特克德国有限公司 不含甲醛的化学镀镀铜溶液
CN104221481B (zh) 2012-03-28 2017-08-22 Dic株式会社 导电性图案、电路、电磁波屏蔽物、及导电性图案的制造方法
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US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
CN104968835A (zh) * 2013-03-27 2015-10-07 埃托特克德国有限公司 无电镀铜溶液
CN103397316A (zh) * 2013-07-18 2013-11-20 胜宏科技（惠州）股份有限公司 一种酸性化学镀铜复合添加剂及其制备方法和使用方法

Also Published As

Publication number Publication date
WO2019234085A1 (en) 2019-12-12
KR20210018457A (ko) 2021-02-17
US11396706B2 (en) 2022-07-26
EP3578683A1 (en) 2019-12-11
US20210246559A1 (en) 2021-08-12
CN112400036A (zh) 2021-02-23
JP7335280B2 (ja) 2023-08-29
TW202000648A (zh) 2020-01-01
EP3578683B1 (en) 2021-02-24
JP2021527166A (ja) 2021-10-11
TWI814822B (zh) 2023-09-11

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