IL153498A0 - Electroless copper metallization of electronic devices - Google Patents

Electroless copper metallization of electronic devices

Info

Publication number
IL153498A0
IL153498A0 IL15349802A IL15349802A IL153498A0 IL 153498 A0 IL153498 A0 IL 153498A0 IL 15349802 A IL15349802 A IL 15349802A IL 15349802 A IL15349802 A IL 15349802A IL 153498 A0 IL153498 A0 IL 153498A0
Authority
IL
Israel
Prior art keywords
electronic devices
electroless copper
copper metallization
metallization
electroless
Prior art date
Application number
IL15349802A
Original Assignee
J G Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J G Systems Inc filed Critical J G Systems Inc
Priority to IL15349802A priority Critical patent/IL153498A0/en
Publication of IL153498A0 publication Critical patent/IL153498A0/en
Priority to US10/669,633 priority patent/US20040154929A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IL15349802A 2002-12-17 2002-12-17 Electroless copper metallization of electronic devices IL153498A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL15349802A IL153498A0 (en) 2002-12-17 2002-12-17 Electroless copper metallization of electronic devices
US10/669,633 US20040154929A1 (en) 2002-12-17 2003-09-25 Electroless copper plating of electronic device components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL15349802A IL153498A0 (en) 2002-12-17 2002-12-17 Electroless copper metallization of electronic devices

Publications (1)

Publication Number Publication Date
IL153498A0 true IL153498A0 (en) 2003-07-06

Family

ID=29798374

Family Applications (1)

Application Number Title Priority Date Filing Date
IL15349802A IL153498A0 (en) 2002-12-17 2002-12-17 Electroless copper metallization of electronic devices

Country Status (2)

Country Link
US (1) US20040154929A1 (en)
IL (1) IL153498A0 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005009072B4 (en) * 2005-02-28 2016-12-08 Advanced Micro Devices, Inc. Method and apparatus for metal deposition by electroless plating using an activation scheme with a substrate heating process
CN102534583B (en) * 2010-12-08 2014-07-30 比亚迪股份有限公司 Chemical copper-plating solution and chemical copper-plating method
JP6388910B2 (en) * 2013-03-27 2018-09-12 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ Electroless copper plating solution
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
EP3578683B1 (en) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Electroless copper or copper alloy plating bath and method for plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199623A (en) * 1974-11-01 1980-04-22 Kollmorgen Technologies Corporation Process for sensitizing articles for metallization and resulting articles
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Also Published As

Publication number Publication date
US20040154929A1 (en) 2004-08-12

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