IL153498A0 - Electroless copper metallization of electronic devices - Google Patents
Electroless copper metallization of electronic devicesInfo
- Publication number
- IL153498A0 IL153498A0 IL15349802A IL15349802A IL153498A0 IL 153498 A0 IL153498 A0 IL 153498A0 IL 15349802 A IL15349802 A IL 15349802A IL 15349802 A IL15349802 A IL 15349802A IL 153498 A0 IL153498 A0 IL 153498A0
- Authority
- IL
- Israel
- Prior art keywords
- electronic devices
- electroless copper
- copper metallization
- metallization
- electroless
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL15349802A IL153498A0 (en) | 2002-12-17 | 2002-12-17 | Electroless copper metallization of electronic devices |
US10/669,633 US20040154929A1 (en) | 2002-12-17 | 2003-09-25 | Electroless copper plating of electronic device components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL15349802A IL153498A0 (en) | 2002-12-17 | 2002-12-17 | Electroless copper metallization of electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
IL153498A0 true IL153498A0 (en) | 2003-07-06 |
Family
ID=29798374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL15349802A IL153498A0 (en) | 2002-12-17 | 2002-12-17 | Electroless copper metallization of electronic devices |
Country Status (2)
Country | Link |
---|---|
US (1) | US20040154929A1 (en) |
IL (1) | IL153498A0 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005009072B4 (en) * | 2005-02-28 | 2016-12-08 | Advanced Micro Devices, Inc. | Method and apparatus for metal deposition by electroless plating using an activation scheme with a substrate heating process |
CN102534583B (en) * | 2010-12-08 | 2014-07-30 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
JP6388910B2 (en) * | 2013-03-27 | 2018-09-12 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Electroless copper plating solution |
EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
EP3578683B1 (en) | 2018-06-08 | 2021-02-24 | ATOTECH Deutschland GmbH | Electroless copper or copper alloy plating bath and method for plating |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4199623A (en) * | 1974-11-01 | 1980-04-22 | Kollmorgen Technologies Corporation | Process for sensitizing articles for metallization and resulting articles |
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
-
2002
- 2002-12-17 IL IL15349802A patent/IL153498A0/en unknown
-
2003
- 2003-09-25 US US10/669,633 patent/US20040154929A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040154929A1 (en) | 2004-08-12 |
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