TWI814822B - 無電解銅或銅合金鍍浴及用於鍍覆之方法 - Google Patents

無電解銅或銅合金鍍浴及用於鍍覆之方法 Download PDF

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Publication number
TWI814822B
TWI814822B TW108115812A TW108115812A TWI814822B TW I814822 B TWI814822 B TW I814822B TW 108115812 A TW108115812 A TW 108115812A TW 108115812 A TW108115812 A TW 108115812A TW I814822 B TWI814822 B TW I814822B
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TW
Taiwan
Prior art keywords
group
substituted
copper
unsubstituted
plating bath
Prior art date
Application number
TW108115812A
Other languages
English (en)
Chinese (zh)
Other versions
TW202000648A (zh
Inventor
羅曼 大衛 庫柯
塞巴斯蒂安 札威爾
基連 克拉登
安娜 彼得
博基 貝克
Original Assignee
德商德國艾托特克公司
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Publication date
Application filed by 德商德國艾托特克公司 filed Critical 德商德國艾托特克公司
Publication of TW202000648A publication Critical patent/TW202000648A/zh
Application granted granted Critical
Publication of TWI814822B publication Critical patent/TWI814822B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
TW108115812A 2018-06-08 2019-05-08 無電解銅或銅合金鍍浴及用於鍍覆之方法 TWI814822B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18176836.7A EP3578683B1 (en) 2018-06-08 2018-06-08 Electroless copper or copper alloy plating bath and method for plating
EP18176836.7 2018-06-08

Publications (2)

Publication Number Publication Date
TW202000648A TW202000648A (zh) 2020-01-01
TWI814822B true TWI814822B (zh) 2023-09-11

Family

ID=62597382

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108115812A TWI814822B (zh) 2018-06-08 2019-05-08 無電解銅或銅合金鍍浴及用於鍍覆之方法

Country Status (7)

Country Link
US (1) US11396706B2 (https=)
EP (1) EP3578683B1 (https=)
JP (1) JP7335280B2 (https=)
KR (1) KR20210018457A (https=)
CN (1) CN112400036B (https=)
TW (1) TWI814822B (https=)
WO (1) WO2019234085A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7601633B2 (ja) * 2020-12-28 2024-12-17 上村工業株式会社 フレキシブル基板の製造方法
EP4063533A1 (en) * 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
KR20260003107A (ko) 2023-04-26 2026-01-06 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판의 표면을 전처리하기 위한 방법
WO2025202100A1 (en) 2024-03-28 2025-10-02 Atotech Deutschland GmbH & Co. KG A method for electroless copper depositing onto a surface of a non-conductive or carbonfibres containing substrate

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DE59909392D1 (de) 1998-11-13 2004-06-09 Lpw Chemie Gmbh Verfahren zur Metallisierung einer Kunststoffoberfläche
US6913651B2 (en) 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
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US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
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Also Published As

Publication number Publication date
WO2019234085A1 (en) 2019-12-12
KR20210018457A (ko) 2021-02-17
CN112400036B (zh) 2023-02-21
US11396706B2 (en) 2022-07-26
EP3578683A1 (en) 2019-12-11
US20210246559A1 (en) 2021-08-12
CN112400036A (zh) 2021-02-23
JP7335280B2 (ja) 2023-08-29
TW202000648A (zh) 2020-01-01
EP3578683B1 (en) 2021-02-24
JP2021527166A (ja) 2021-10-11

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