JP2017222925A5 - - Google Patents
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- Publication number
- JP2017222925A5 JP2017222925A5 JP2017048764A JP2017048764A JP2017222925A5 JP 2017222925 A5 JP2017222925 A5 JP 2017222925A5 JP 2017048764 A JP2017048764 A JP 2017048764A JP 2017048764 A JP2017048764 A JP 2017048764A JP 2017222925 A5 JP2017222925 A5 JP 2017222925A5
- Authority
- JP
- Japan
- Prior art keywords
- nitrogen
- photoresist
- openings
- copper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 150000002118 epoxides Chemical class 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- -1 amino acid compound Chemical class 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662314435P | 2016-03-29 | 2016-03-29 | |
| US62/314,435 | 2016-03-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017222925A JP2017222925A (ja) | 2017-12-21 |
| JP2017222925A5 true JP2017222925A5 (https=) | 2018-11-01 |
| JP6445064B2 JP6445064B2 (ja) | 2018-12-26 |
Family
ID=58428188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017048764A Active JP6445064B2 (ja) | 2016-03-29 | 2017-03-14 | メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10190228B2 (https=) |
| EP (1) | EP3225719B1 (https=) |
| JP (1) | JP6445064B2 (https=) |
| KR (1) | KR101889768B1 (https=) |
| CN (1) | CN107236975B (https=) |
| TW (1) | TWI649461B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109996785B (zh) * | 2016-09-22 | 2021-12-28 | 麦克德米德乐思公司 | 集成电路的晶圆级封装中的铜沉积 |
| US20180355502A1 (en) * | 2017-06-08 | 2018-12-13 | Macdermid Enthone Inc. | Process for metalization of copper pillars in the manufacture of microelectronics |
| US20190259722A1 (en) * | 2018-02-21 | 2019-08-22 | Rohm And Haas Electronic Materials Llc | Copper pillars having improved integrity and methods of making the same |
| JP7533916B2 (ja) | 2019-02-01 | 2024-08-14 | 石原ケミカル株式会社 | 電気銅メッキ又は銅合金メッキ浴 |
| WO2020158418A1 (ja) | 2019-02-01 | 2020-08-06 | 石原ケミカル株式会社 | 電気銅メッキ又は銅合金メッキ浴 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4356277A (en) * | 1977-03-08 | 1982-10-26 | Ppg Industries, Inc. | Reaction products of a polyglycidyl ether of a polyphenol and an amino acid and aqueous solubilized products therefrom |
| DE4214964A1 (de) * | 1992-05-06 | 1993-11-11 | Basf Lacke & Farben | Mehrwertige Epoxidverbindungen |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| WO2002090623A1 (fr) | 2001-05-09 | 2002-11-14 | Ebara-Udylite Co., Ltd. | Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain |
| KR20030094098A (ko) * | 2002-06-03 | 2003-12-11 | 쉬플리 캄파니, 엘.엘.씨. | 평탄화제 화합물 |
| US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
| TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| EP1741804B1 (en) * | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
| US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
| ATE506468T1 (de) * | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
| CN101740420B (zh) | 2008-11-05 | 2011-11-09 | 中芯国际集成电路制造(上海)有限公司 | 铜支柱制作工艺 |
| JP5471276B2 (ja) * | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
| RU2585184C2 (ru) * | 2009-11-27 | 2016-05-27 | Басф Се | Композиция для электрического осаждения металла, содержащая выравнивающий агент |
| US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| MY164464A (en) * | 2010-06-01 | 2017-12-15 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8546254B2 (en) | 2010-08-19 | 2013-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps using patterned anodes |
| JP2012127003A (ja) * | 2010-12-15 | 2012-07-05 | Rohm & Haas Electronic Materials Llc | 銅層を均一にする電気めっき方法 |
| US8747643B2 (en) | 2011-08-22 | 2014-06-10 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US9783905B2 (en) * | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
| US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| US9932684B2 (en) * | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
-
2017
- 2017-03-07 US US15/451,547 patent/US10190228B2/en active Active
- 2017-03-14 JP JP2017048764A patent/JP6445064B2/ja active Active
- 2017-03-16 TW TW106108789A patent/TWI649461B/zh active
- 2017-03-27 EP EP17163063.5A patent/EP3225719B1/en active Active
- 2017-03-27 CN CN201710188677.6A patent/CN107236975B/zh active Active
- 2017-03-28 KR KR1020170039333A patent/KR101889768B1/ko active Active
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