JP6445064B2 - メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 - Google Patents

メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 Download PDF

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Publication number
JP6445064B2
JP6445064B2 JP2017048764A JP2017048764A JP6445064B2 JP 6445064 B2 JP6445064 B2 JP 6445064B2 JP 2017048764 A JP2017048764 A JP 2017048764A JP 2017048764 A JP2017048764 A JP 2017048764A JP 6445064 B2 JP6445064 B2 JP 6445064B2
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Japan
Prior art keywords
copper
alkyl
hydrogen
photoresist
electroplating
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JP2017048764A
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English (en)
Japanese (ja)
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JP2017222925A5 (https=
JP2017222925A (ja
Inventor
マシュー・ソアセス
レベッカ・アーズブルック
マーク・スカリシ
ズーラ・ニアジンベトバ
ジョアンナ・ディウィジック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
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Publication of JP2017222925A5 publication Critical patent/JP2017222925A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2017048764A 2016-03-29 2017-03-14 メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 Active JP6445064B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662314435P 2016-03-29 2016-03-29
US62/314,435 2016-03-29

Publications (3)

Publication Number Publication Date
JP2017222925A JP2017222925A (ja) 2017-12-21
JP2017222925A5 JP2017222925A5 (https=) 2018-11-01
JP6445064B2 true JP6445064B2 (ja) 2018-12-26

Family

ID=58428188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017048764A Active JP6445064B2 (ja) 2016-03-29 2017-03-14 メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法

Country Status (6)

Country Link
US (1) US10190228B2 (https=)
EP (1) EP3225719B1 (https=)
JP (1) JP6445064B2 (https=)
KR (1) KR101889768B1 (https=)
CN (1) CN107236975B (https=)
TW (1) TWI649461B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996785B (zh) * 2016-09-22 2021-12-28 麦克德米德乐思公司 集成电路的晶圆级封装中的铜沉积
US20180355502A1 (en) * 2017-06-08 2018-12-13 Macdermid Enthone Inc. Process for metalization of copper pillars in the manufacture of microelectronics
US20190259722A1 (en) * 2018-02-21 2019-08-22 Rohm And Haas Electronic Materials Llc Copper pillars having improved integrity and methods of making the same
JP7533916B2 (ja) 2019-02-01 2024-08-14 石原ケミカル株式会社 電気銅メッキ又は銅合金メッキ浴
WO2020158418A1 (ja) 2019-02-01 2020-08-06 石原ケミカル株式会社 電気銅メッキ又は銅合金メッキ浴

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356277A (en) * 1977-03-08 1982-10-26 Ppg Industries, Inc. Reaction products of a polyglycidyl ether of a polyphenol and an amino acid and aqueous solubilized products therefrom
DE4214964A1 (de) * 1992-05-06 1993-11-11 Basf Lacke & Farben Mehrwertige Epoxidverbindungen
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
WO2002090623A1 (fr) 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
KR20030094098A (ko) * 2002-06-03 2003-12-11 쉬플리 캄파니, 엘.엘.씨. 평탄화제 화합물
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1741804B1 (en) * 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
ATE506468T1 (de) * 2008-04-28 2011-05-15 Atotech Deutschland Gmbh Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer
CN101740420B (zh) 2008-11-05 2011-11-09 中芯国际集成电路制造(上海)有限公司 铜支柱制作工艺
JP5471276B2 (ja) * 2009-10-15 2014-04-16 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
RU2585184C2 (ru) * 2009-11-27 2016-05-27 Басф Се Композиция для электрического осаждения металла, содержащая выравнивающий агент
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US20110220512A1 (en) * 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
MY164464A (en) * 2010-06-01 2017-12-15 Basf Se Composition for metal electroplating comprising leveling agent
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
JP2012127003A (ja) * 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
US8747643B2 (en) 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
US9783905B2 (en) * 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US10006136B2 (en) 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US9932684B2 (en) * 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Also Published As

Publication number Publication date
US20170283970A1 (en) 2017-10-05
TWI649461B (zh) 2019-02-01
JP2017222925A (ja) 2017-12-21
TW201805485A (zh) 2018-02-16
EP3225719A1 (en) 2017-10-04
CN107236975A (zh) 2017-10-10
KR20170113331A (ko) 2017-10-12
US10190228B2 (en) 2019-01-29
KR101889768B1 (ko) 2018-08-20
CN107236975B (zh) 2019-08-13
EP3225719B1 (en) 2018-11-07

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