CN107236975B - 能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法 - Google Patents

能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法 Download PDF

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Publication number
CN107236975B
CN107236975B CN201710188677.6A CN201710188677A CN107236975B CN 107236975 B CN107236975 B CN 107236975B CN 201710188677 A CN201710188677 A CN 201710188677A CN 107236975 B CN107236975 B CN 107236975B
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China
Prior art keywords
height
copper
alkyl
photoresist
hydrogen
Prior art date
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CN201710188677.6A
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English (en)
Chinese (zh)
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CN107236975A (zh
Inventor
M·托尔塞斯
R·阿兹布鲁克
M·斯卡利西
Z·尼亚兹伊别特娃
J·狄茨维斯泽柯
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201710188677.6A 2016-03-29 2017-03-27 能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法 Active CN107236975B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662314435P 2016-03-29 2016-03-29
US62/314435 2016-03-29

Publications (2)

Publication Number Publication Date
CN107236975A CN107236975A (zh) 2017-10-10
CN107236975B true CN107236975B (zh) 2019-08-13

Family

ID=58428188

Family Applications (1)

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CN201710188677.6A Active CN107236975B (zh) 2016-03-29 2017-03-27 能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法

Country Status (6)

Country Link
US (1) US10190228B2 (https=)
EP (1) EP3225719B1 (https=)
JP (1) JP6445064B2 (https=)
KR (1) KR101889768B1 (https=)
CN (1) CN107236975B (https=)
TW (1) TWI649461B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996785B (zh) * 2016-09-22 2021-12-28 麦克德米德乐思公司 集成电路的晶圆级封装中的铜沉积
US20180355502A1 (en) * 2017-06-08 2018-12-13 Macdermid Enthone Inc. Process for metalization of copper pillars in the manufacture of microelectronics
US20190259722A1 (en) * 2018-02-21 2019-08-22 Rohm And Haas Electronic Materials Llc Copper pillars having improved integrity and methods of making the same
JP7533916B2 (ja) 2019-02-01 2024-08-14 石原ケミカル株式会社 電気銅メッキ又は銅合金メッキ浴
WO2020158418A1 (ja) 2019-02-01 2020-08-06 石原ケミカル株式会社 電気銅メッキ又は銅合金メッキ浴

Citations (3)

* Cited by examiner, † Cited by third party
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CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法
CN101960054A (zh) * 2008-04-28 2011-01-26 埃托特克德国有限公司 用于电解沉积铜的水性酸浴及方法
CN102939339A (zh) * 2010-06-01 2013-02-20 巴斯夫欧洲公司 包含流平试剂的金属电镀用组合物

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US4356277A (en) * 1977-03-08 1982-10-26 Ppg Industries, Inc. Reaction products of a polyglycidyl ether of a polyphenol and an amino acid and aqueous solubilized products therefrom
DE4214964A1 (de) * 1992-05-06 1993-11-11 Basf Lacke & Farben Mehrwertige Epoxidverbindungen
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
WO2002090623A1 (fr) 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
KR20030094098A (ko) * 2002-06-03 2003-12-11 쉬플리 캄파니, 엘.엘.씨. 평탄화제 화합물
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
CN101740420B (zh) 2008-11-05 2011-11-09 中芯国际集成电路制造(上海)有限公司 铜支柱制作工艺
JP5471276B2 (ja) * 2009-10-15 2014-04-16 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
RU2585184C2 (ru) * 2009-11-27 2016-05-27 Басф Се Композиция для электрического осаждения металла, содержащая выравнивающий агент
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US20110220512A1 (en) * 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
JP2012127003A (ja) * 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
US8747643B2 (en) 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
US9783905B2 (en) * 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US10006136B2 (en) 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US9932684B2 (en) * 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法
CN101960054A (zh) * 2008-04-28 2011-01-26 埃托特克德国有限公司 用于电解沉积铜的水性酸浴及方法
CN102939339A (zh) * 2010-06-01 2013-02-20 巴斯夫欧洲公司 包含流平试剂的金属电镀用组合物

Also Published As

Publication number Publication date
US20170283970A1 (en) 2017-10-05
TWI649461B (zh) 2019-02-01
JP2017222925A (ja) 2017-12-21
TW201805485A (zh) 2018-02-16
EP3225719A1 (en) 2017-10-04
CN107236975A (zh) 2017-10-10
KR20170113331A (ko) 2017-10-12
US10190228B2 (en) 2019-01-29
KR101889768B1 (ko) 2018-08-20
EP3225719B1 (en) 2018-11-07
JP6445064B2 (ja) 2018-12-26

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Address after: Massachusetts, USA

Patentee after: DuPont Electronic Materials International LLC

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Address before: Massachusetts, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Country or region before: U.S.A.