JP7157749B2 - 電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法 - Google Patents
電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法 Download PDFInfo
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- JP7157749B2 JP7157749B2 JP2019539426A JP2019539426A JP7157749B2 JP 7157749 B2 JP7157749 B2 JP 7157749B2 JP 2019539426 A JP2019539426 A JP 2019539426A JP 2019539426 A JP2019539426 A JP 2019539426A JP 7157749 B2 JP7157749 B2 JP 7157749B2
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- 238000009713 electroplating Methods 0.000 title claims description 96
- 239000000654 additive Substances 0.000 title claims description 36
- 230000000996 additive effect Effects 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 61
- 229910052802 copper Inorganic materials 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 60
- 238000007747 plating Methods 0.000 claims description 47
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- -1 alcohol compound Chemical class 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical group [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 150000001805 chlorine compounds Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 83
- 239000000758 substrate Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 238000009499 grossing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 229920002873 Polyethylenimine Polymers 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000003916 ethylene diamine group Chemical group 0.000 description 4
- SENLDUJVTGGYIH-UHFFFAOYSA-N n-(2-aminoethyl)-3-[[3-(2-aminoethylamino)-3-oxopropyl]-[2-[bis[3-(2-aminoethylamino)-3-oxopropyl]amino]ethyl]amino]propanamide Chemical compound NCCNC(=O)CCN(CCC(=O)NCCN)CCN(CCC(=O)NCCN)CCC(=O)NCCN SENLDUJVTGGYIH-UHFFFAOYSA-N 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 229920000962 poly(amidoamine) Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 241000724291 Tobacco streak virus Species 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 239000012770 industrial material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000003107 substituted aryl group Chemical group 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WIYCQLLGDNXIBA-UHFFFAOYSA-L disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCSSCCCS([O-])(=O)=O WIYCQLLGDNXIBA-UHFFFAOYSA-L 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002717 polyvinylpyridine Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C237/00—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by amino groups
- C07C237/02—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by amino groups having the carbon atoms of the carboxamide groups bound to acyclic carbon atoms of the carbon skeleton
- C07C237/04—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by amino groups having the carbon atoms of the carboxamide groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
- C07C237/10—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by amino groups having the carbon atoms of the carboxamide groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated having the nitrogen atom of at least one of the carboxamide groups bound to an acyclic carbon atom of a hydrocarbon radical substituted by nitrogen atoms not being part of nitro or nitroso groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
- C08G83/002—Dendritic macromolecules
- C08G83/003—Dendrimers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
本発明の電解めっき液用添加剤は、上記化学式(1)~(4)で表される化合物No.1(商品名:PAMAMデンドリマー、エチレンジアミンコア、0.0世代、Aldrich社製)、No.2(商品名:PAMAMデンドリマー、エチレンジアミンコア、1.0世代、Aldrich社製)、No.3(商品名:PAMAMデンドリマー、エチレンジアミンコア、2.0世代、Aldrich社製)、No.4(商品名:PAMAMデンドリマー、エチレンジアミンコア、3.0世代、Aldrich社製)から選択される少なくとも1種を含有する。
次に、本発明の電解めっき液について説明する。本発明の電解めっき液は、上記の化合物No.1~4より選択される少なくとも1種を含有する電解めっき液用添加剤を必須の有効成分として含有する水溶液である。本発明の効果をより顕著に得る観点からその好ましい濃度は、0.1mg/L~100mg/L、より好ましくは0.5mg/L~50mg/L、更に好ましくは1mg/L~30mg/Lである。
次に、本発明の電解めっき液を用いた電解めっき方法について説明する。
平滑剤として化合物No.1とメタノールとを含有する電解めっき液用添加剤を用いて、表1に示す組成で電解銅めっき液を調製した。尚、実施例1~3及び比較例1、2において、電解銅めっき液の溶媒は水であり、各成分の濃度は水で調整した。また、実施例及び比較例で用いるポリエチレングリコールの重量平均分子量は3,600~4,400である。なお、重量平均分子量は、標準試料としてポリスチレンを用い、溶媒としてテトラヒドロフランを用いたゲル浸透クロマトグラフィー分析によって測定した。
平滑剤として化合物No.1を用い、メタノールを含有しない電解めっき液用添加剤を用いて、表1に示す組成で電解銅めっき液を調製した。
平滑剤として化合物No.4とメタノールとを含有する電解めっき液用添加剤を用いて、表1に示す組成で電解銅めっき液を調製した。
平滑剤として下記に示す比較化合物1とメタノールとを含有する電解めっき液用添加剤を用いて、表2に示す組成で電解銅めっき液を調製した。
平滑剤として下記に示す比較化合物2(Aldrich社製のポリエチレンイミン(エチレンジアミン枝状、Mw 約800)とメタノールとを含有する電解めっき液用添加剤を用いて、表2に示す組成で電解銅めっき液を調製した。
電解めっき装置として、パドル攪拌式めっき装置を用い、めっき槽に実施例1~3及び比較例1、2の電解銅めっき液をそれぞれ充填した電解銅めっき浴中に、被めっき基体を浸漬した。被めっき基体には、銅シード層付きSi基板上に、フォトレジストを用いて、レジストパターン(形状:断面円形状の開口部を有する、開口径:20μm、30μm及び50μm)を形成したものを用いた。次いで、下記めっき条件で各々電解銅めっき方法により、レジスト開口部に銅を埋め込み、被めっき基体上に銅層を形成した。
(めっき条件)
(1)ホール径(μm):20、30、50
(2)電流密度(A/dm2):12、16、18
(3)浴温:35℃
(4)めっき時間:めっきされた銅層の最小高さ(Lmin)が40μmになるまでの時間
図1に示すように、製造例1によって被めっき基体2の表面に形成された銅層1の断面をレーザ顕微鏡(キーエンス社製、型番:VK-9700)で観察することで、銅層1の最小高さ(Lmin)と最大高さ(LMax)を測定した。また、以下の式によりΔLを算出した。評価結果を表3に示す。
ΔL=LMax-Lmin
Claims (7)
- 前記電解めっき液用添加剤が、メタノール、エタノール、n-プロパノール、及びイソプロパノールからなる群から選択される少なくとも1種のアルコール化合物を含有する請求項1に記載の電解めっき液。
- 前記電解めっき液用添加剤は、電解銅めっき液用添加剤である請求項1又は2に記載の電解めっき液。
- 金属塩と、電解質とを含有する請求項1~3のいずれか一項に記載の電解めっき液。
- 前記金属塩が銅塩である請求項4に記載の電解めっき液。
- 前記金属塩が硫酸銅であり、前記電解質が硫酸である請求項4又は5に記載の電解めっき液。
- 請求項1~6のいずれか一項に記載の電解めっき液を用いる電解めっき方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166424 | 2017-08-31 | ||
JP2017166424 | 2017-08-31 | ||
PCT/JP2018/031139 WO2019044651A1 (ja) | 2017-08-31 | 2018-08-23 | 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法 |
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JPWO2019044651A1 JPWO2019044651A1 (ja) | 2020-11-19 |
JP7157749B2 true JP7157749B2 (ja) | 2022-10-20 |
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Country Status (5)
Country | Link |
---|---|
US (1) | US11624120B2 (ja) |
JP (1) | JP7157749B2 (ja) |
KR (1) | KR20200044913A (ja) |
TW (1) | TWI754095B (ja) |
WO (1) | WO2019044651A1 (ja) |
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WO2020241338A1 (ja) * | 2019-05-29 | 2020-12-03 | 株式会社Adeka | 電解めっき液用添加剤、電解めっき液、電解めっき方法及び新規化合物 |
JPWO2022172823A1 (ja) * | 2021-02-15 | 2022-08-18 | ||
CN114875448B (zh) * | 2022-04-29 | 2024-10-11 | 武汉工程大学 | 一种将高价态金属离子还原的方法 |
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CN105102687A (zh) | 2013-04-02 | 2015-11-25 | 株式会社Adeka | 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法 |
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US20030155248A1 (en) | 2002-02-21 | 2003-08-21 | Dalman David A. | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings |
US20080014356A1 (en) | 2006-06-16 | 2008-01-17 | Ilsoon Lee | Selective metal patterns using polyelect rolyte multilayer coatings |
CN102634778A (zh) | 2012-03-28 | 2012-08-15 | 上海工程技术大学 | 基于pamam /钯配位体的电磁屏蔽织物化学镀前活化方法 |
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US11624120B2 (en) | 2023-04-11 |
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