JP7612006B2 - 電磁波シールド部材 - Google Patents

電磁波シールド部材 Download PDF

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Publication number
JP7612006B2
JP7612006B2 JP2023517301A JP2023517301A JP7612006B2 JP 7612006 B2 JP7612006 B2 JP 7612006B2 JP 2023517301 A JP2023517301 A JP 2023517301A JP 2023517301 A JP2023517301 A JP 2023517301A JP 7612006 B2 JP7612006 B2 JP 7612006B2
Authority
JP
Japan
Prior art keywords
conductive filler
fibrous
content
granular
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023517301A
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English (en)
Japanese (ja)
Other versions
JPWO2023032574A1 (https=
JPWO2023032574A5 (https=
Inventor
昭宏 長永
真奈 中村
光博 望月
宏光 青藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of JPWO2023032574A1 publication Critical patent/JPWO2023032574A1/ja
Publication of JPWO2023032574A5 publication Critical patent/JPWO2023032574A5/ja
Application granted granted Critical
Publication of JP7612006B2 publication Critical patent/JP7612006B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023517301A 2021-08-31 2022-08-03 電磁波シールド部材 Active JP7612006B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021141166 2021-08-31
JP2021141166 2021-08-31
PCT/JP2022/029772 WO2023032574A1 (ja) 2021-08-31 2022-08-03 電磁波シールド部材

Publications (3)

Publication Number Publication Date
JPWO2023032574A1 JPWO2023032574A1 (https=) 2023-03-09
JPWO2023032574A5 JPWO2023032574A5 (https=) 2023-08-09
JP7612006B2 true JP7612006B2 (ja) 2025-01-10

Family

ID=85411193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517301A Active JP7612006B2 (ja) 2021-08-31 2022-08-03 電磁波シールド部材

Country Status (5)

Country Link
JP (1) JP7612006B2 (https=)
KR (1) KR20240058096A (https=)
CN (1) CN117882502A (https=)
TW (1) TW202313843A (https=)
WO (1) WO2023032574A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225628A (ja) 1999-02-05 2000-08-15 Polyplastics Co 複合成形品の成形方法
JP2004035826A (ja) 2002-07-05 2004-02-05 Yuka Denshi Co Ltd 高導電性樹脂成形品
JP2010095669A (ja) 2008-10-20 2010-04-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物及び成形体
JP2010526888A (ja) 2007-04-24 2010-08-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電磁干渉シールド特性を有する熱可塑性樹脂組成物
JP2012229345A (ja) 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP2017107928A (ja) 2015-12-08 2017-06-15 ダイセルポリマー株式会社 成形体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
JP3634496B2 (ja) * 1996-04-10 2005-03-30 帝人化成株式会社 導電性樹脂組成物および成形品
JP2001316572A (ja) * 2000-05-08 2001-11-16 Teijin Ltd 電磁波シールド用樹脂組成物
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP2008011101A (ja) 2006-06-28 2008-01-17 Tamagawa Electronics Co Ltd Ｔｍ二重モード誘電体共振装置
JP5585162B2 (ja) * 2010-03-29 2014-09-10 三菱化学株式会社 電磁波シールド性ポリアミド樹脂組成物及びその成形品
JP2011192714A (ja) * 2010-03-12 2011-09-29 Aisin Chemical Co Ltd 電磁波シールド材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225628A (ja) 1999-02-05 2000-08-15 Polyplastics Co 複合成形品の成形方法
JP2004035826A (ja) 2002-07-05 2004-02-05 Yuka Denshi Co Ltd 高導電性樹脂成形品
JP2010526888A (ja) 2007-04-24 2010-08-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電磁干渉シールド特性を有する熱可塑性樹脂組成物
JP2010095669A (ja) 2008-10-20 2010-04-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物及び成形体
JP2012229345A (ja) 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP2017107928A (ja) 2015-12-08 2017-06-15 ダイセルポリマー株式会社 成形体

Also Published As

Publication number Publication date
TW202313843A (zh) 2023-04-01
JPWO2023032574A1 (https=) 2023-03-09
WO2023032574A1 (ja) 2023-03-09
KR20240058096A (ko) 2024-05-03
CN117882502A (zh) 2024-04-12

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