CN117882502A - 电磁波屏蔽构件 - Google Patents

电磁波屏蔽构件 Download PDF

Info

Publication number
CN117882502A
CN117882502A CN202280058304.6A CN202280058304A CN117882502A CN 117882502 A CN117882502 A CN 117882502A CN 202280058304 A CN202280058304 A CN 202280058304A CN 117882502 A CN117882502 A CN 117882502A
Authority
CN
China
Prior art keywords
conductive filler
electromagnetic wave
wave shielding
fibrous
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280058304.6A
Other languages
English (en)
Chinese (zh)
Inventor
长永昭宏
中村真奈
望月光博
青藤宏光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of CN117882502A publication Critical patent/CN117882502A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280058304.6A 2021-08-31 2022-08-03 电磁波屏蔽构件 Pending CN117882502A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-141166 2021-08-31
JP2021141166 2021-08-31
PCT/JP2022/029772 WO2023032574A1 (ja) 2021-08-31 2022-08-03 電磁波シールド部材

Publications (1)

Publication Number Publication Date
CN117882502A true CN117882502A (zh) 2024-04-12

Family

ID=85411193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280058304.6A Pending CN117882502A (zh) 2021-08-31 2022-08-03 电磁波屏蔽构件

Country Status (5)

Country Link
JP (1) JP7612006B2 (https=)
KR (1) KR20240058096A (https=)
CN (1) CN117882502A (https=)
TW (1) TW202313843A (https=)
WO (1) WO2023032574A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
JP3634496B2 (ja) * 1996-04-10 2005-03-30 帝人化成株式会社 導電性樹脂組成物および成形品
JP2000225628A (ja) 1999-02-05 2000-08-15 Polyplastics Co 複合成形品の成形方法
JP2001316572A (ja) * 2000-05-08 2001-11-16 Teijin Ltd 電磁波シールド用樹脂組成物
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP3826852B2 (ja) 2002-07-05 2006-09-27 油化電子株式会社 高導電性樹脂成形品
JP2008011101A (ja) 2006-06-28 2008-01-17 Tamagawa Electronics Co Ltd Ｔｍ二重モード誘電体共振装置
US7999018B2 (en) 2007-04-24 2011-08-16 E. I. Du Pont De Nemours And Company Thermoplastic resin composition having electromagnetic interference shielding properties
JP5396810B2 (ja) 2008-10-20 2014-01-22 住友化学株式会社 液晶ポリマー組成物及び成形体
JP5585162B2 (ja) * 2010-03-29 2014-09-10 三菱化学株式会社 電磁波シールド性ポリアミド樹脂組成物及びその成形品
JP2011192714A (ja) * 2010-03-12 2011-09-29 Aisin Chemical Co Ltd 電磁波シールド材
JP2012229345A (ja) 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP6700759B2 (ja) 2015-12-08 2020-05-27 ダイセルポリマー株式会社 成形体

Also Published As

Publication number Publication date
TW202313843A (zh) 2023-04-01
JPWO2023032574A1 (https=) 2023-03-09
WO2023032574A1 (ja) 2023-03-09
JP7612006B2 (ja) 2025-01-10
KR20240058096A (ko) 2024-05-03

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