JPWO2023032574A1 - - Google Patents

Info

Publication number
JPWO2023032574A1
JPWO2023032574A1 JP2023517301A JP2023517301A JPWO2023032574A1 JP WO2023032574 A1 JPWO2023032574 A1 JP WO2023032574A1 JP 2023517301 A JP2023517301 A JP 2023517301A JP 2023517301 A JP2023517301 A JP 2023517301A JP WO2023032574 A1 JPWO2023032574 A1 JP WO2023032574A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023517301A
Other languages
Japanese (ja)
Other versions
JPWO2023032574A5 (https=
JP7612006B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032574A1 publication Critical patent/JPWO2023032574A1/ja
Publication of JPWO2023032574A5 publication Critical patent/JPWO2023032574A5/ja
Application granted granted Critical
Publication of JP7612006B2 publication Critical patent/JP7612006B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023517301A 2021-08-31 2022-08-03 電磁波シールド部材 Active JP7612006B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021141166 2021-08-31
JP2021141166 2021-08-31
PCT/JP2022/029772 WO2023032574A1 (ja) 2021-08-31 2022-08-03 電磁波シールド部材

Publications (3)

Publication Number Publication Date
JPWO2023032574A1 true JPWO2023032574A1 (https=) 2023-03-09
JPWO2023032574A5 JPWO2023032574A5 (https=) 2023-08-09
JP7612006B2 JP7612006B2 (ja) 2025-01-10

Family

ID=85411193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517301A Active JP7612006B2 (ja) 2021-08-31 2022-08-03 電磁波シールド部材

Country Status (5)

Country Link
JP (1) JP7612006B2 (https=)
KR (1) KR20240058096A (https=)
CN (1) CN117882502A (https=)
TW (1) TW202313843A (https=)
WO (1) WO2023032574A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
JPH09279003A (ja) * 1996-04-10 1997-10-28 Teijin Chem Ltd 導電性樹脂組成物および成形品
JP2001316572A (ja) * 2000-05-08 2001-11-16 Teijin Ltd 電磁波シールド用樹脂組成物
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP2004035826A (ja) * 2002-07-05 2004-02-05 Yuka Denshi Co Ltd 高導電性樹脂成形品
JP2010095669A (ja) * 2008-10-20 2010-04-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物及び成形体
JP2011192714A (ja) * 2010-03-12 2011-09-29 Aisin Chemical Co Ltd 電磁波シールド材
JP2011207981A (ja) * 2010-03-29 2011-10-20 Mitsubishi Chemicals Corp 電磁波シールド性ポリアミド樹脂組成物及びその成形品
JP2012229345A (ja) * 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) * 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP2017107928A (ja) * 2015-12-08 2017-06-15 ダイセルポリマー株式会社 成形体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225628A (ja) 1999-02-05 2000-08-15 Polyplastics Co 複合成形品の成形方法
JP2008011101A (ja) 2006-06-28 2008-01-17 Tamagawa Electronics Co Ltd Ｔｍ二重モード誘電体共振装置
US7999018B2 (en) 2007-04-24 2011-08-16 E. I. Du Pont De Nemours And Company Thermoplastic resin composition having electromagnetic interference shielding properties

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
JPH09279003A (ja) * 1996-04-10 1997-10-28 Teijin Chem Ltd 導電性樹脂組成物および成形品
JP2001316572A (ja) * 2000-05-08 2001-11-16 Teijin Ltd 電磁波シールド用樹脂組成物
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP2004035826A (ja) * 2002-07-05 2004-02-05 Yuka Denshi Co Ltd 高導電性樹脂成形品
JP2010095669A (ja) * 2008-10-20 2010-04-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物及び成形体
JP2011192714A (ja) * 2010-03-12 2011-09-29 Aisin Chemical Co Ltd 電磁波シールド材
JP2011207981A (ja) * 2010-03-29 2011-10-20 Mitsubishi Chemicals Corp 電磁波シールド性ポリアミド樹脂組成物及びその成形品
JP2012229345A (ja) * 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) * 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP2017107928A (ja) * 2015-12-08 2017-06-15 ダイセルポリマー株式会社 成形体

Also Published As

Publication number Publication date
TW202313843A (zh) 2023-04-01
WO2023032574A1 (ja) 2023-03-09
JP7612006B2 (ja) 2025-01-10
KR20240058096A (ko) 2024-05-03
CN117882502A (zh) 2024-04-12

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