TW202313843A - 電磁波遮蔽部件 - Google Patents

電磁波遮蔽部件 Download PDF

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Publication number
TW202313843A
TW202313843A TW111129820A TW111129820A TW202313843A TW 202313843 A TW202313843 A TW 202313843A TW 111129820 A TW111129820 A TW 111129820A TW 111129820 A TW111129820 A TW 111129820A TW 202313843 A TW202313843 A TW 202313843A
Authority
TW
Taiwan
Prior art keywords
conductive filler
electromagnetic wave
wave shielding
liquid crystalline
shielding member
Prior art date
Application number
TW111129820A
Other languages
English (en)
Chinese (zh)
Inventor
長永昭宏
中村真奈
望月光博
青藤宏光
Original Assignee
日商寶理塑料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商寶理塑料股份有限公司 filed Critical 日商寶理塑料股份有限公司
Publication of TW202313843A publication Critical patent/TW202313843A/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/346Clay
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111129820A 2021-08-31 2022-08-09 電磁波遮蔽部件 TW202313843A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-141166 2021-08-31
JP2021141166 2021-08-31

Publications (1)

Publication Number Publication Date
TW202313843A true TW202313843A (zh) 2023-04-01

Family

ID=85411193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111129820A TW202313843A (zh) 2021-08-31 2022-08-09 電磁波遮蔽部件

Country Status (5)

Country Link
JP (1) JP7612006B2 (https=)
KR (1) KR20240058096A (https=)
CN (1) CN117882502A (https=)
TW (1) TW202313843A (https=)
WO (1) WO2023032574A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
JP3634496B2 (ja) * 1996-04-10 2005-03-30 帝人化成株式会社 導電性樹脂組成物および成形品
JP2000225628A (ja) 1999-02-05 2000-08-15 Polyplastics Co 複合成形品の成形方法
JP2001316572A (ja) * 2000-05-08 2001-11-16 Teijin Ltd 電磁波シールド用樹脂組成物
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP3826852B2 (ja) 2002-07-05 2006-09-27 油化電子株式会社 高導電性樹脂成形品
JP2008011101A (ja) 2006-06-28 2008-01-17 Tamagawa Electronics Co Ltd Tm二重モード誘電体共振装置
US7999018B2 (en) 2007-04-24 2011-08-16 E. I. Du Pont De Nemours And Company Thermoplastic resin composition having electromagnetic interference shielding properties
JP5396810B2 (ja) 2008-10-20 2014-01-22 住友化学株式会社 液晶ポリマー組成物及び成形体
JP5585162B2 (ja) * 2010-03-29 2014-09-10 三菱化学株式会社 電磁波シールド性ポリアミド樹脂組成物及びその成形品
JP2011192714A (ja) * 2010-03-12 2011-09-29 Aisin Chemical Co Ltd 電磁波シールド材
JP2012229345A (ja) 2011-04-27 2012-11-22 Toray Ind Inc 成形品
JP2013103967A (ja) 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 液晶ポリマー組成物の製造方法及び成形体
JP6700759B2 (ja) 2015-12-08 2020-05-27 ダイセルポリマー株式会社 成形体

Also Published As

Publication number Publication date
JPWO2023032574A1 (https=) 2023-03-09
WO2023032574A1 (ja) 2023-03-09
JP7612006B2 (ja) 2025-01-10
KR20240058096A (ko) 2024-05-03
CN117882502A (zh) 2024-04-12

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