JP7533439B2 - 硬化性樹脂組成物及び電子部品装置 - Google Patents

硬化性樹脂組成物及び電子部品装置 Download PDF

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Publication number
JP7533439B2
JP7533439B2 JP2021501971A JP2021501971A JP7533439B2 JP 7533439 B2 JP7533439 B2 JP 7533439B2 JP 2021501971 A JP2021501971 A JP 2021501971A JP 2021501971 A JP2021501971 A JP 2021501971A JP 7533439 B2 JP7533439 B2 JP 7533439B2
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Japan
Prior art keywords
group
resin composition
curable resin
epoxy
bonded
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JP2021501971A
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Japanese (ja)
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JPWO2020171004A1 (https=
Inventor
高士 山本
道俊 荒田
勇磨 竹内
香澄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2020171004A1 publication Critical patent/JPWO2020171004A1/ja
Priority to JP2024080887A priority Critical patent/JP2024100861A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021501971A 2019-02-21 2020-02-17 硬化性樹脂組成物及び電子部品装置 Active JP7533439B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024080887A JP2024100861A (ja) 2019-02-21 2024-05-17 硬化性樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

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JP2019029777 2019-02-21
JP2019029777 2019-02-21
PCT/JP2020/005993 WO2020171004A1 (ja) 2019-02-21 2020-02-17 硬化性樹脂組成物及び電子部品装置

Related Child Applications (1)

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JP2024080887A Division JP2024100861A (ja) 2019-02-21 2024-05-17 硬化性樹脂組成物及び電子部品装置

Publications (2)

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JPWO2020171004A1 JPWO2020171004A1 (https=) 2020-08-27
JP7533439B2 true JP7533439B2 (ja) 2024-08-14

Family

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JP2021501971A Active JP7533439B2 (ja) 2019-02-21 2020-02-17 硬化性樹脂組成物及び電子部品装置
JP2024080887A Pending JP2024100861A (ja) 2019-02-21 2024-05-17 硬化性樹脂組成物及び電子部品装置

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JP2024080887A Pending JP2024100861A (ja) 2019-02-21 2024-05-17 硬化性樹脂組成物及び電子部品装置

Country Status (4)

Country Link
JP (2) JP7533439B2 (https=)
CN (1) CN113195585A (https=)
TW (2) TW202035558A (https=)
WO (1) WO2020171004A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002139A (ja) 2004-05-20 2006-01-05 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂およびその硬化物
JP2008063555A (ja) 2006-09-04 2008-03-21 Chang Chun Plastics Co Ltd 難燃性樹脂組成物
JP2008231239A (ja) 2007-03-20 2008-10-02 Dic Corp 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法
JP2009179764A (ja) 2008-02-01 2009-08-13 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
WO2011052157A1 (ja) 2009-10-26 2011-05-05 住友ベークライト株式会社 半導体封止用樹脂組成物およびこれを用いた半導体装置
WO2012165439A1 (ja) 2011-05-31 2012-12-06 日立化成工業株式会社 めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268721A (ja) * 1985-05-24 1986-11-28 Asahi Chem Ind Co Ltd エポキシ樹脂硬化剤
JP3632936B2 (ja) * 1995-01-18 2005-03-30 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2009231605A (ja) * 2008-03-24 2009-10-08 Sekisui Chem Co Ltd 接着剤及び接合体の製造方法
JP5187101B2 (ja) * 2008-09-26 2013-04-24 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5463110B2 (ja) * 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
JP5736718B2 (ja) * 2010-10-18 2015-06-17 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法
JP6220492B2 (ja) * 2011-05-19 2017-10-25 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP2014034629A (ja) * 2012-08-08 2014-02-24 Mitsubishi Chemicals Corp エポキシ樹脂組成物、硬化物及び半導体封止材
JP2017084973A (ja) * 2015-10-28 2017-05-18 日東電工株式会社 一次実装半導体装置の製造方法
JP7241311B2 (ja) * 2018-10-15 2023-03-17 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物及び半導体パッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002139A (ja) 2004-05-20 2006-01-05 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂およびその硬化物
JP2008063555A (ja) 2006-09-04 2008-03-21 Chang Chun Plastics Co Ltd 難燃性樹脂組成物
JP2008231239A (ja) 2007-03-20 2008-10-02 Dic Corp 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法
JP2009179764A (ja) 2008-02-01 2009-08-13 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
WO2011052157A1 (ja) 2009-10-26 2011-05-05 住友ベークライト株式会社 半導体封止用樹脂組成物およびこれを用いた半導体装置
WO2012165439A1 (ja) 2011-05-31 2012-12-06 日立化成工業株式会社 めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法

Also Published As

Publication number Publication date
TW202546069A (zh) 2025-12-01
CN113195585A (zh) 2021-07-30
WO2020171004A1 (ja) 2020-08-27
TW202035558A (zh) 2020-10-01
JP2024100861A (ja) 2024-07-26
JPWO2020171004A1 (https=) 2020-08-27

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