CN113195585A - 硬化性树脂组合物及电子零件装置 - Google Patents

硬化性树脂组合物及电子零件装置 Download PDF

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Publication number
CN113195585A
CN113195585A CN202080007052.5A CN202080007052A CN113195585A CN 113195585 A CN113195585 A CN 113195585A CN 202080007052 A CN202080007052 A CN 202080007052A CN 113195585 A CN113195585 A CN 113195585A
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CN
China
Prior art keywords
group
resin composition
bonded
curable resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080007052.5A
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English (en)
Chinese (zh)
Inventor
山本高士
荒田道俊
竹内勇磨
中村香澄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN113195585A publication Critical patent/CN113195585A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202080007052.5A 2019-02-21 2020-02-17 硬化性树脂组合物及电子零件装置 Pending CN113195585A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-029777 2019-02-21
JP2019029777 2019-02-21
PCT/JP2020/005993 WO2020171004A1 (ja) 2019-02-21 2020-02-17 硬化性樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
CN113195585A true CN113195585A (zh) 2021-07-30

Family

ID=72143430

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080007052.5A Pending CN113195585A (zh) 2019-02-21 2020-02-17 硬化性树脂组合物及电子零件装置

Country Status (4)

Country Link
JP (2) JP7533439B2 (https=)
CN (1) CN113195585A (https=)
TW (2) TW202035558A (https=)
WO (1) WO2020171004A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002139A (ja) * 2004-05-20 2006-01-05 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂およびその硬化物
US20080054234A1 (en) * 2006-09-04 2008-03-06 Chang Chun Plastics Co., Ltd. Flame retardative resin composition
JP2008231239A (ja) * 2007-03-20 2008-10-02 Dic Corp 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法
JP2009179764A (ja) * 2008-02-01 2009-08-13 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
US20120205822A1 (en) * 2009-10-26 2012-08-16 Yusuke Tanaka Resin composition for encapsulating semiconductor and semiconductor device using the resin composition
US20140151091A1 (en) * 2011-05-31 2014-06-05 Daisuke Fujimoto Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same
TW201727785A (zh) * 2015-10-28 2017-08-01 日東電工股份有限公司 一次安裝半導體裝置之製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268721A (ja) * 1985-05-24 1986-11-28 Asahi Chem Ind Co Ltd エポキシ樹脂硬化剤
JP3632936B2 (ja) * 1995-01-18 2005-03-30 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2009231605A (ja) * 2008-03-24 2009-10-08 Sekisui Chem Co Ltd 接着剤及び接合体の製造方法
JP5187101B2 (ja) * 2008-09-26 2013-04-24 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5463110B2 (ja) * 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
JP5736718B2 (ja) * 2010-10-18 2015-06-17 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法
JP6220492B2 (ja) * 2011-05-19 2017-10-25 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP2014034629A (ja) * 2012-08-08 2014-02-24 Mitsubishi Chemicals Corp エポキシ樹脂組成物、硬化物及び半導体封止材
JP7241311B2 (ja) * 2018-10-15 2023-03-17 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物及び半導体パッケージ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002139A (ja) * 2004-05-20 2006-01-05 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂およびその硬化物
US20080054234A1 (en) * 2006-09-04 2008-03-06 Chang Chun Plastics Co., Ltd. Flame retardative resin composition
JP2008231239A (ja) * 2007-03-20 2008-10-02 Dic Corp 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法
JP2009179764A (ja) * 2008-02-01 2009-08-13 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
US20120205822A1 (en) * 2009-10-26 2012-08-16 Yusuke Tanaka Resin composition for encapsulating semiconductor and semiconductor device using the resin composition
US20140151091A1 (en) * 2011-05-31 2014-06-05 Daisuke Fujimoto Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same
TW201727785A (zh) * 2015-10-28 2017-08-01 日東電工股份有限公司 一次安裝半導體裝置之製造方法

Also Published As

Publication number Publication date
TW202546069A (zh) 2025-12-01
WO2020171004A1 (ja) 2020-08-27
JP7533439B2 (ja) 2024-08-14
TW202035558A (zh) 2020-10-01
JP2024100861A (ja) 2024-07-26
JPWO2020171004A1 (https=) 2020-08-27

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Address after: No. 13-9, Shigemen 1-chome, Tokyo Port Area, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: 9-2 Marunouchi, Chiyoda, Tokyo, Japan (postal code: 100-6606)

Applicant before: Showa electrical materials Co.,Ltd.

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Country or region after: Japan

Address after: 9-1 Higashinbashi 1-chome, Tokyo Port Area, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: No. 13-9, Shigemen 1-chome, Tokyo Port Area, Japan

Applicant before: Lishennoco Co.,Ltd.

Country or region before: Japan