JP7241311B2 - 封止用樹脂組成物及び半導体パッケージ - Google Patents
封止用樹脂組成物及び半導体パッケージ Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Description
R1-R2-(R3-R4)n-R5 (1)
式(1)中、nは、5~10の整数である。R1及びR5の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニル基又はナフチル基である。複数のR3の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニレン基又はナフチレン基である。R2及びR4の各々は、アルキレン基である。
式(1)中、nは、5~10の整数である。R1及びR5の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニル基又はナフチル基である。複数のR3の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニレン基又はナフチレン基である。R2及びR4の各々は、アルキレン基である。
Rであるアルキル基の炭素数は、2~15であることがより好ましく、5~10であることが更に好ましい。
表1に示す原料を、ミキサーで十分混合してからニーダーで約100℃で溶融させて混練し、冷却後、粉砕機で粉砕してから打錠することで、タブレット状の組成物を得た。
・エポキシ樹脂1:ビフェニルアラルキル型エポキシ樹脂、日本化薬株式会社製、品番NC3000、エポキシ当量276。
・エポキシ樹脂2:ビフェニル型エポキシ樹脂、三菱化学株式会社製、品番YX4000H、エポキシ当量195。
・フェノール樹脂1:式(11)に示すフェノール樹脂、明和化成株式会社製、品番ST-007-02、水酸基当量234、軟化点90℃。
・フェノール樹脂2:ノボラック型フェノール樹脂、明和化成株式会社製、品番DL92、水酸基当量105。
・フェノール樹脂3:ビフェニルアラルキル型フェノール樹脂、明和化成株式会社製、品番MEH7851SS、水酸基当量203。
・硬化促進剤1:式(3)に示すリン系硬化促進剤、サンアプロ株式会社製、品番RP-701。
・硬化促進剤2:2-フェニル-4-ヒドロキシメチル-5-メチルイミダゾール、四国化成株式会社製、品番2P4MHZ。
・硬化促進剤3:トリフェニルホスフィン、北興化学工業株式会社製。
・着色剤:カーボンブラック、三菱化学株式会社製、品番MA600。
・離型剤:ポリエチレンワックス、大日化学工業株式会社製、品番PE-A。
・シランカップリング剤:3-メルカプトプロピルトリメトキシシラン、信越化学工業株式会社製、品番KBM803。
・充填材:球状溶融シリカ、電気化学工業社製、品番FB940。
2-1.比誘電率及び誘電正接の測定
組成物をトランスファー成形法で、圧力3.9MPa、温度175℃、成形時間180秒の条件で成形して硬化物を得た。この硬化物を175℃で4時間加熱することでアフターキュアを施した。続いて、硬化物を切断して1.5mm×1.5mm×85mmの寸法のサンプルを作製した。このサンプルの、測定波長10GHzにおける比誘電率及び誘電正接を、ネットワークアナライザ(アジレント・テクノロジー株式会社製、型番N5230A)を用いて測定した。
銅基材をセットした金型を用い、組成物をトランスファー成形法で、温度175℃、成形時間180秒の条件で成形することで、銅基材上に直径2.5mm、高さ3mmの寸法の硬化物を作製した。銅基材に対する硬化物の密着力を、Dage社製のボンドテスターを用いて測定した。その結果、密着力が25MPa未満の場合を「C」、密着力が25MPa以上~40MPa未満である場合は「B]、密着力が40MPa以上である場合は「A」と、評価した。
平面視40mm×40mmの寸法を有する銅製の基板を、第一精工株式会社製の成型機「S・Pot」の金型にセットしてから、この金型内で、組成物を成型温度175℃、キュア時間150秒の条件で成型することで、基板上に硬化物を作製した。硬化物を作製した直後に、金型から基板を持ち上げることで、硬化物を金型から取り外した。このとき、基板を持ち上げるために要する力を、デジタルフォースゲージ(株式会社イマダ製、型番ZTS-DPU-100N)を用いて測定した。この測定を50回繰り返し行い、得られた測定値の平均値を算出した。この平均値が10N以下である場合を「A」、10Nより大きく20N未満の場合を「B」、20N以上の場合を「C」と、判定した。
CURELASTOMETER MODELV(株式会社テイ・エス・エンジニアリング)を用いて、組成物を設定温度175℃で加熱しながら、組成物のトルク値を測定した。測定開始時からトルク値が0.5kgf・cm(4.9035N・cm)に達するまでに要した時間を、硬化時間とした。
2 半導体チップ
4 封止材
Claims (4)
- エポキシ樹脂(A)と、
下記式(1)を満たす構造を有し、かつ軟化点が150℃以下であるフェノール樹脂(B)とを含有し、
R1-R2-(R3-R4)n-R5 (1)
式(1)中、nは、5~10の整数であり、
R1及びR5の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニル基又はナフチル基であり、
複数のR3の各々は、少なくとも一つの水酸基と少なくとも一つの炭素数1~20のアルキル基とを置換基として有するフェニレン基又はナフチレン基であり、
R2及びR4の各々は、アルキレン基であり、
前記フェノール樹脂(B)は、下記式(11)に示す構造を有する化合物を含み、
封止用樹脂組成物。 - 含窒素系硬化促進剤(C2)を更に含有する、
請求項1又は2に記載の封止用樹脂組成物。 - 半導体チップと、
前記半導体チップを覆う、請求項1から3のいずれか一項に記載の封止用樹脂組成物の硬化物である封止材とを備える、
半導体パッケージ。
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JP2018194632A JP7241311B2 (ja) | 2018-10-15 | 2018-10-15 | 封止用樹脂組成物及び半導体パッケージ |
PCT/JP2019/038970 WO2020080115A1 (ja) | 2018-10-15 | 2019-10-02 | 封止用樹脂組成物及び半導体パッケージ |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000290352A (ja) | 1999-04-07 | 2000-10-17 | Sumitomo Durez Co Ltd | エポキシ樹脂硬化剤およびその製造方法 |
JP2001123045A (ja) | 1999-10-26 | 2001-05-08 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
JP2003192771A (ja) | 2001-12-28 | 2003-07-09 | Japan Epoxy Resin Kk | フェノール樹脂、その製法、エポキシ樹脂用硬化剤、エポキシ樹脂組成物及び半導体装置 |
WO2004020492A1 (ja) | 2002-08-30 | 2004-03-11 | Asahi Organic Chemicals Industry Co., Ltd. | ノボラック型フェノール樹脂の製造方法 |
WO2018003513A1 (ja) | 2016-06-29 | 2018-01-04 | Dic株式会社 | フェノールノボラック樹脂、硬化性樹脂組成物及びその硬化物 |
JP2018002911A (ja) | 2016-07-04 | 2018-01-11 | パナソニックIpマネジメント株式会社 | 封止用エポキシ樹脂組成物、硬化物、及び半導体装置 |
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JPS5942984B2 (ja) * | 1979-05-18 | 1984-10-18 | 株式会社日立製作所 | 樹脂封止半導体装置の製造法 |
JPS57113A (en) * | 1980-06-03 | 1982-01-05 | Mitsui Petrochem Ind Ltd | Production of high-molecular novolak type substituted phenol resin |
JPS5956748A (ja) * | 1983-08-29 | 1984-04-02 | Toshiba Corp | 樹脂封止型半導体装置の |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000290352A (ja) | 1999-04-07 | 2000-10-17 | Sumitomo Durez Co Ltd | エポキシ樹脂硬化剤およびその製造方法 |
JP2001123045A (ja) | 1999-10-26 | 2001-05-08 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
JP2003192771A (ja) | 2001-12-28 | 2003-07-09 | Japan Epoxy Resin Kk | フェノール樹脂、その製法、エポキシ樹脂用硬化剤、エポキシ樹脂組成物及び半導体装置 |
WO2004020492A1 (ja) | 2002-08-30 | 2004-03-11 | Asahi Organic Chemicals Industry Co., Ltd. | ノボラック型フェノール樹脂の製造方法 |
WO2018003513A1 (ja) | 2016-06-29 | 2018-01-04 | Dic株式会社 | フェノールノボラック樹脂、硬化性樹脂組成物及びその硬化物 |
JP2018002911A (ja) | 2016-07-04 | 2018-01-11 | パナソニックIpマネジメント株式会社 | 封止用エポキシ樹脂組成物、硬化物、及び半導体装置 |
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