JP7522973B2 - チップ部品の実装構造 - Google Patents

チップ部品の実装構造 Download PDF

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Publication number
JP7522973B2
JP7522973B2 JP2022524354A JP2022524354A JP7522973B2 JP 7522973 B2 JP7522973 B2 JP 7522973B2 JP 2022524354 A JP2022524354 A JP 2022524354A JP 2022524354 A JP2022524354 A JP 2022524354A JP 7522973 B2 JP7522973 B2 JP 7522973B2
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Japan
Prior art keywords
mounting structure
chip component
land
lands
pattern
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JP2022524354A
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English (en)
Japanese (ja)
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JPWO2021235196A1 (https=
Inventor
幸男 小谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of JPWO2021235196A1 publication Critical patent/JPWO2021235196A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2022524354A 2020-05-21 2021-04-27 チップ部品の実装構造 Active JP7522973B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088512 2020-05-21
JP2020088512 2020-05-21
PCT/JP2021/016755 WO2021235196A1 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Publications (2)

Publication Number Publication Date
JPWO2021235196A1 JPWO2021235196A1 (https=) 2021-11-25
JP7522973B2 true JP7522973B2 (ja) 2024-07-26

Family

ID=78708343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524354A Active JP7522973B2 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Country Status (4)

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JP (1) JP7522973B2 (https=)
CN (1) CN115553074B (https=)
TW (1) TWI886263B (https=)
WO (1) WO2021235196A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4624086A1 (en) 2022-11-24 2025-10-01 Furukawa Electric Co., Ltd. Joining method and laser processing device
JP7831781B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831778B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831782B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP2024167108A (ja) * 2023-05-19 2024-12-02 株式会社大一商会 遊技機
JP7831777B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831779B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831780B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271009A (ja) 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629755Y2 (https=) * 1981-04-09 1987-03-06
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH07106742A (ja) * 1993-10-07 1995-04-21 Hitachi Ltd プリント配線基板
JP2005026344A (ja) * 2003-06-30 2005-01-27 Brother Ind Ltd プリント配線板、プリント回路板、プリント配線板の製造方法及びプリント回路板の製造方法
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
TWI337055B (en) * 2007-06-22 2011-02-01 Delta Electronics Inc Universal solder pad structure
CN101883472A (zh) * 2009-12-02 2010-11-10 北京星网锐捷网络技术有限公司 表面贴片电容的pcb封装及其方法、印刷电路板和设备
JP2013069743A (ja) * 2011-09-21 2013-04-18 Elpida Memory Inc 半導体装置およびその製造方法
CN205611062U (zh) * 2016-05-16 2016-09-28 昆山龙腾光电有限公司 电路板结构
CN207925452U (zh) * 2018-02-05 2018-09-28 广东美的暖通设备有限公司 用于贴片元件的兼容封装结构及印制电路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271009A (ja) 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Also Published As

Publication number Publication date
WO2021235196A1 (ja) 2021-11-25
JPWO2021235196A1 (https=) 2021-11-25
TWI886263B (zh) 2025-06-11
CN115553074A (zh) 2022-12-30
CN115553074B (zh) 2026-02-13
TW202145849A (zh) 2021-12-01

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