JPWO2021235196A1 - - Google Patents

Info

Publication number
JPWO2021235196A1
JPWO2021235196A1 JP2022524354A JP2022524354A JPWO2021235196A1 JP WO2021235196 A1 JPWO2021235196 A1 JP WO2021235196A1 JP 2022524354 A JP2022524354 A JP 2022524354A JP 2022524354 A JP2022524354 A JP 2022524354A JP WO2021235196 A1 JPWO2021235196 A1 JP WO2021235196A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022524354A
Other languages
Japanese (ja)
Other versions
JP7522973B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2021235196A1 publication Critical patent/JPWO2021235196A1/ja
Application granted granted Critical
Publication of JP7522973B2 publication Critical patent/JP7522973B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2022524354A 2020-05-21 2021-04-27 チップ部品の実装構造 Active JP7522973B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088512 2020-05-21
JP2020088512 2020-05-21
PCT/JP2021/016755 WO2021235196A1 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Publications (2)

Publication Number Publication Date
JPWO2021235196A1 true JPWO2021235196A1 (https=) 2021-11-25
JP7522973B2 JP7522973B2 (ja) 2024-07-26

Family

ID=78708343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524354A Active JP7522973B2 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Country Status (4)

Country Link
JP (1) JP7522973B2 (https=)
CN (1) CN115553074B (https=)
TW (1) TWI886263B (https=)
WO (1) WO2021235196A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4624086A1 (en) 2022-11-24 2025-10-01 Furukawa Electric Co., Ltd. Joining method and laser processing device
JP7831781B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831778B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831782B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP2024167108A (ja) * 2023-05-19 2024-12-02 株式会社大一商会 遊技機
JP7831777B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831779B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831780B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (https=) * 1981-04-09 1982-10-15
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH07106742A (ja) * 1993-10-07 1995-04-21 Hitachi Ltd プリント配線基板
JP2005026344A (ja) * 2003-06-30 2005-01-27 Brother Ind Ltd プリント配線板、プリント回路板、プリント配線板の製造方法及びプリント回路板の製造方法
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
TWI337055B (en) * 2007-06-22 2011-02-01 Delta Electronics Inc Universal solder pad structure
CN101883472A (zh) * 2009-12-02 2010-11-10 北京星网锐捷网络技术有限公司 表面贴片电容的pcb封装及其方法、印刷电路板和设备
JP2013069743A (ja) * 2011-09-21 2013-04-18 Elpida Memory Inc 半導体装置およびその製造方法
CN205611062U (zh) * 2016-05-16 2016-09-28 昆山龙腾光电有限公司 电路板结构
CN207925452U (zh) * 2018-02-05 2018-09-28 广东美的暖通设备有限公司 用于贴片元件的兼容封装结构及印制电路板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (https=) * 1981-04-09 1982-10-15
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Also Published As

Publication number Publication date
WO2021235196A1 (ja) 2021-11-25
TWI886263B (zh) 2025-06-11
CN115553074A (zh) 2022-12-30
CN115553074B (zh) 2026-02-13
JP7522973B2 (ja) 2024-07-26
TW202145849A (zh) 2021-12-01

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