CN115553074B - 芯片部件的安装构造 - Google Patents

芯片部件的安装构造

Info

Publication number
CN115553074B
CN115553074B CN202180035046.5A CN202180035046A CN115553074B CN 115553074 B CN115553074 B CN 115553074B CN 202180035046 A CN202180035046 A CN 202180035046A CN 115553074 B CN115553074 B CN 115553074B
Authority
CN
China
Prior art keywords
chip component
mounting structure
pads
component
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180035046.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN115553074A (zh
Inventor
小谷幸男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN115553074A publication Critical patent/CN115553074A/zh
Application granted granted Critical
Publication of CN115553074B publication Critical patent/CN115553074B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN202180035046.5A 2020-05-21 2021-04-27 芯片部件的安装构造 Active CN115553074B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-088512 2020-05-21
JP2020088512 2020-05-21
PCT/JP2021/016755 WO2021235196A1 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Publications (2)

Publication Number Publication Date
CN115553074A CN115553074A (zh) 2022-12-30
CN115553074B true CN115553074B (zh) 2026-02-13

Family

ID=78708343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180035046.5A Active CN115553074B (zh) 2020-05-21 2021-04-27 芯片部件的安装构造

Country Status (4)

Country Link
JP (1) JP7522973B2 (https=)
CN (1) CN115553074B (https=)
TW (1) TWI886263B (https=)
WO (1) WO2021235196A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4624086A1 (en) 2022-11-24 2025-10-01 Furukawa Electric Co., Ltd. Joining method and laser processing device
JP7831781B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831778B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831782B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP2024167108A (ja) * 2023-05-19 2024-12-02 株式会社大一商会 遊技機
JP7831777B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831779B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831780B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH07106742A (ja) * 1993-10-07 1995-04-21 Hitachi Ltd プリント配線基板
CN207925452U (zh) * 2018-02-05 2018-09-28 广东美的暖通设备有限公司 用于贴片元件的兼容封装结构及印制电路板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629755Y2 (https=) * 1981-04-09 1987-03-06
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005026344A (ja) * 2003-06-30 2005-01-27 Brother Ind Ltd プリント配線板、プリント回路板、プリント配線板の製造方法及びプリント回路板の製造方法
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
TWI337055B (en) * 2007-06-22 2011-02-01 Delta Electronics Inc Universal solder pad structure
CN101883472A (zh) * 2009-12-02 2010-11-10 北京星网锐捷网络技术有限公司 表面贴片电容的pcb封装及其方法、印刷电路板和设备
JP2013069743A (ja) * 2011-09-21 2013-04-18 Elpida Memory Inc 半導体装置およびその製造方法
CN205611062U (zh) * 2016-05-16 2016-09-28 昆山龙腾光电有限公司 电路板结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH07106742A (ja) * 1993-10-07 1995-04-21 Hitachi Ltd プリント配線基板
CN207925452U (zh) * 2018-02-05 2018-09-28 广东美的暖通设备有限公司 用于贴片元件的兼容封装结构及印制电路板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Also Published As

Publication number Publication date
WO2021235196A1 (ja) 2021-11-25
JPWO2021235196A1 (https=) 2021-11-25
TWI886263B (zh) 2025-06-11
CN115553074A (zh) 2022-12-30
JP7522973B2 (ja) 2024-07-26
TW202145849A (zh) 2021-12-01

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