TWI886263B - 晶片零件的安裝構造 - Google Patents

晶片零件的安裝構造 Download PDF

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Publication number
TWI886263B
TWI886263B TW110115179A TW110115179A TWI886263B TW I886263 B TWI886263 B TW I886263B TW 110115179 A TW110115179 A TW 110115179A TW 110115179 A TW110115179 A TW 110115179A TW I886263 B TWI886263 B TW I886263B
Authority
TW
Taiwan
Prior art keywords
mounting structure
chip component
pads
printed wiring
pad
Prior art date
Application number
TW110115179A
Other languages
English (en)
Chinese (zh)
Other versions
TW202145849A (zh
Inventor
小谷幸男
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW202145849A publication Critical patent/TW202145849A/zh
Application granted granted Critical
Publication of TWI886263B publication Critical patent/TWI886263B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW110115179A 2020-05-21 2021-04-27 晶片零件的安裝構造 TWI886263B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-088512 2020-05-21
JP2020088512 2020-05-21

Publications (2)

Publication Number Publication Date
TW202145849A TW202145849A (zh) 2021-12-01
TWI886263B true TWI886263B (zh) 2025-06-11

Family

ID=78708343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115179A TWI886263B (zh) 2020-05-21 2021-04-27 晶片零件的安裝構造

Country Status (4)

Country Link
JP (1) JP7522973B2 (https=)
CN (1) CN115553074B (https=)
TW (1) TWI886263B (https=)
WO (1) WO2021235196A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4624086A1 (en) 2022-11-24 2025-10-01 Furukawa Electric Co., Ltd. Joining method and laser processing device
JP7831781B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831778B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831782B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP2024167108A (ja) * 2023-05-19 2024-12-02 株式会社大一商会 遊技機
JP7831777B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831779B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機
JP7831780B2 (ja) * 2023-05-19 2026-03-17 株式会社大一商会 遊技機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
TW200901843A (en) * 2007-06-22 2009-01-01 Delta Electronics Inc Universal solder pad structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629755Y2 (https=) * 1981-04-09 1987-03-06
JPH01158793A (ja) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd チップ部品取付装置
JPH07106742A (ja) * 1993-10-07 1995-04-21 Hitachi Ltd プリント配線基板
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2005026344A (ja) * 2003-06-30 2005-01-27 Brother Ind Ltd プリント配線板、プリント回路板、プリント配線板の製造方法及びプリント回路板の製造方法
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
CN101883472A (zh) * 2009-12-02 2010-11-10 北京星网锐捷网络技术有限公司 表面贴片电容的pcb封装及其方法、印刷电路板和设备
JP2013069743A (ja) * 2011-09-21 2013-04-18 Elpida Memory Inc 半導体装置およびその製造方法
CN205611062U (zh) * 2016-05-16 2016-09-28 昆山龙腾光电有限公司 电路板结构
CN207925452U (zh) * 2018-02-05 2018-09-28 广东美的暖通设备有限公司 用于贴片元件的兼容封装结构及印制电路板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
TW200901843A (en) * 2007-06-22 2009-01-01 Delta Electronics Inc Universal solder pad structure

Also Published As

Publication number Publication date
WO2021235196A1 (ja) 2021-11-25
JPWO2021235196A1 (https=) 2021-11-25
CN115553074A (zh) 2022-12-30
CN115553074B (zh) 2026-02-13
JP7522973B2 (ja) 2024-07-26
TW202145849A (zh) 2021-12-01

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