JP7444257B2 - 欠陥検査装置 - Google Patents

欠陥検査装置 Download PDF

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Publication number
JP7444257B2
JP7444257B2 JP2022532965A JP2022532965A JP7444257B2 JP 7444257 B2 JP7444257 B2 JP 7444257B2 JP 2022532965 A JP2022532965 A JP 2022532965A JP 2022532965 A JP2022532965 A JP 2022532965A JP 7444257 B2 JP7444257 B2 JP 7444257B2
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section
excitation
leg
defect inspection
unit
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Japanese (ja)
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JPWO2022003916A5 (https=
JPWO2022003916A1 (https=
Inventor
浩司 堀川
健二 田窪
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Shimadzu Corp
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Shimadzu Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02094—Speckle interferometers, i.e. for detecting changes in speckle pattern
    • G01B9/02095—Speckle interferometers, i.e. for detecting changes in speckle pattern detecting deformation from original shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02097—Self-interferometers
    • G01B9/02098—Shearing interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765—Method using an image detector and processing of image signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2694—Wings or other aircraft parts

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Optics & Photonics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2022532965A 2020-07-02 2020-07-02 欠陥検査装置 Active JP7444257B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/026071 WO2022003916A1 (ja) 2020-07-02 2020-07-02 欠陥検査装置

Publications (3)

Publication Number Publication Date
JPWO2022003916A1 JPWO2022003916A1 (https=) 2022-01-06
JPWO2022003916A5 JPWO2022003916A5 (https=) 2023-03-20
JP7444257B2 true JP7444257B2 (ja) 2024-03-06

Family

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Family Applications (1)

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JP2022532965A Active JP7444257B2 (ja) 2020-07-02 2020-07-02 欠陥検査装置

Country Status (4)

Country Link
US (1) US12345653B2 (https=)
JP (1) JP7444257B2 (https=)
CN (1) CN115997104B (https=)
WO (1) WO2022003916A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024076652A (ja) * 2022-11-25 2024-06-06 株式会社大気社 検査装置および検査方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002177271A (ja) 2000-12-07 2002-06-25 Ge Medical Systems Global Technology Co Llc 超音波プローブ製造方法、超音波プローブ、および超音波撮像装置
JP2005064919A (ja) 2003-08-13 2005-03-10 Ishikawajima Harima Heavy Ind Co Ltd 高温用超音波探触子
US20140118530A1 (en) 2012-10-31 2014-05-01 The Boeing Company Thermal Sound Inspection System
JP2014119441A (ja) 2012-12-19 2014-06-30 Toshiba Corp 超音波探傷装置及び方法
JP2017219318A (ja) 2016-06-02 2017-12-14 株式会社島津製作所 欠陥検査方法及び欠陥検査装置
CN108088913A (zh) 2018-01-09 2018-05-29 东莞理工学院 用于钢轨轨底探伤的压电超声导波探头及其探伤方法
CN208872452U (zh) 2019-01-08 2019-05-17 中国大唐集团新能源科学技术研究院有限公司 一种便携式风电机组用螺栓预紧力检测设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6121961U (ja) * 1984-07-16 1986-02-08 神奈川県 超音波探触子の保持装置
JPH10227768A (ja) 1997-02-13 1998-08-25 Aisin Seiki Co Ltd 雨滴検出装置
JPH10253604A (ja) 1997-03-07 1998-09-25 Matsushita Electric Ind Co Ltd 超音波探触子
JPH10308997A (ja) 1997-05-08 1998-11-17 Olympus Optical Co Ltd 超音波振動子
US6134006A (en) * 1998-02-25 2000-10-17 Becthel Bwxt Idaho, Llc Imaging photorefractive optical vibration measurement method and device
JPH11315883A (ja) * 1998-04-30 1999-11-16 Canon Inc 除振装置、露光装置およびデバイス製造方法
WO2005006416A1 (ja) * 2003-07-09 2005-01-20 Nikon Corporation 結合装置、露光装置、及びデバイス製造方法
CN100508119C (zh) 2003-07-09 2009-07-01 株式会社尼康 曝光装置、器件制造方法
JP4801457B2 (ja) * 2006-02-02 2011-10-26 株式会社リコー 表面欠陥検査装置、表面欠陥検査方法及び表面欠陥検査プログラム
JP5456010B2 (ja) * 2011-08-31 2014-03-26 三菱電機株式会社 薄板検査装置
TWI585519B (zh) * 2015-11-06 2017-06-01 艾斯邁科技股份有限公司 光罩檢測裝置及其方法
CN208282930U (zh) * 2018-05-08 2018-12-25 辛迈 基于振动分析的动力机组无线监测系统
CN210525404U (zh) * 2019-03-01 2020-05-15 郑淑选 一种水泥混凝土振实装置
CN209416526U (zh) * 2019-03-15 2019-09-20 江苏万宝电子有限公司 一种电机轴承用热电阻
US11898926B2 (en) * 2019-09-13 2024-02-13 Technical Manufacturing Corporation Inspection apparatus and methods for precision vibration-isolation tabletops

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002177271A (ja) 2000-12-07 2002-06-25 Ge Medical Systems Global Technology Co Llc 超音波プローブ製造方法、超音波プローブ、および超音波撮像装置
JP2005064919A (ja) 2003-08-13 2005-03-10 Ishikawajima Harima Heavy Ind Co Ltd 高温用超音波探触子
US20140118530A1 (en) 2012-10-31 2014-05-01 The Boeing Company Thermal Sound Inspection System
JP2014119441A (ja) 2012-12-19 2014-06-30 Toshiba Corp 超音波探傷装置及び方法
JP2017219318A (ja) 2016-06-02 2017-12-14 株式会社島津製作所 欠陥検査方法及び欠陥検査装置
CN108088913A (zh) 2018-01-09 2018-05-29 东莞理工学院 用于钢轨轨底探伤的压电超声导波探头及其探伤方法
CN208872452U (zh) 2019-01-08 2019-05-17 中国大唐集团新能源科学技术研究院有限公司 一种便携式风电机组用螺栓预紧力检测设备

Also Published As

Publication number Publication date
US12345653B2 (en) 2025-07-01
CN115997104B (zh) 2025-08-01
WO2022003916A1 (ja) 2022-01-06
JPWO2022003916A1 (https=) 2022-01-06
CN115997104A (zh) 2023-04-21
US20230251204A1 (en) 2023-08-10

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